Industry Blogs

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EMS ‘Lean Sigma’ shortens cycle time, reduces costs & improves quality

Lean Sigma, an approach that has been in practice for several years, mixes the lean manufacturing concept and problem solving…

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Shear Testing of BGA Pads – Pads are not as good as they were?

Shear force measurement is a common and quick way of destructively assessing solder joints and complement pull strength measurements.

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Cleaning chemistry vs. mechanical impingement

Welcome to the cleaning debate “Cleaning chemistries vs. mechanical impingement.” As the title suggests, we’re looking forward to a robust…

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Jetting fluids in non traditional packaging and assembly applications

Technical Articles >> Dispensing

The expansion of business into alternative energy, green components and energy-efficient components is having a significant impact on the electronics…

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Breaking News
125-17 - Screen-Printable Solvent-Resistant Flexible Ultraviolet-Curable Coating
Friday, 03 July 2009
125-17, an exceptional dielectric inkA sky-blue ink, this dielectric features extremely low odor, with excellent flow characteristics and print quality.
 
Seika Machinery, Inc. Features YJ Link Conveyor Systems
Friday, 03 July 2009

Young Jin Conveyors for SPI and AOIBoth systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch screen operation.

 
What Is Outsourced Device Programming Costing You?
Friday, 03 July 2009
Frustrated with excessive charges, long lead times and a fat, inflexible supply chain for your outsourced programming?
 
Anders Eases Monochrome-to-Colour LCD Migration with Unique Multicolour LCD Technology
Friday, 03 July 2009
Anders' Unique Multicolour LCD TechnologyAnders now offers innovative multicolour Field Sequential LCD display modules - the fastest and most cost-effective path to colour.
 
SMTA International Conference Program finalized and registration now open
Friday, 03 July 2009
SMTAI 2009 offers educational opportunities covering Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Business Issues and Process Control.
 
Event provides insight into developments in medical devices
Friday, 03 July 2009
Event: ‘Electronics for Medical Devices Applications’
Date: Thursday 23rd July
Venue: AMP Technology Centre in Rotherham
 
HVR Advanced Power Components Awarded ISO 9001:2000 Certification
Friday, 03 July 2009
HVR Advanced Power Components has achieved ISO 9001:2000 certification for the design, assembly and distribution of electronic resistors.
 
Saelig Introduces CANminiBOX™ Fanless CANbus Controllers
Friday, 03 July 2009
Saelig's CANminiBOX™Maintenance-Free CANbus Controller for Embedded Control Applications Offers 128 MB SD-RAM Capabilities, Weighs Less than One Pound
 
SUSS MicroTec Strengthens Presence in Asia with New Sales Structure
Friday, 03 July 2009

With the appointment of ZMC Technologies as general sales representative for Malaysia, Singapore and Philippines, SUSS MicroTec reinforces its strong presence in Asia.

 
India LCD-TV Shipments to Surpass CRT in 2012
Friday, 03 July 2009
With the transition to LCD-TV, India will follow in the footsteps of other regions.
 
New Digi TransPort™ VPN Concentrator Enables Easy End-to-End Connectivity of Remote Wireless Devices
Friday, 03 July 2009
Digi TransPort VC7400 integration with Digi TransPort and Digi Connect® cellular router reduces complexity of VPN setup; increases reliability
 
ASML 2009 Second Quarter Results
Friday, 03 July 2009
ASML Holding N.V. will announce its 2009 Second Quarter Results on Wednesday July 15, 2009.
 
Surrey University part of research team awarded £430k grant for pioneering nanotechnology research
Friday, 03 July 2009
ESPRC and National Science Foundation of China fund three-year 'spintronics' study
 
CASCON supports TI TAP transceiver
Thursday, 02 July 2009
Boundary Scan software platform SYSTEM CASCON™ expands support for IEEE1149.1 TAP transceiver by Texas Instruments
 
Cookson Electronics’ Launches ALPHA® CVP 520 Lead-Free Low Temperature Solder Paste
Thursday, 02 July 2009
Cookson Electronics ALPHA® CVP-520 Solder PasteALPHA® CVP-520’s low reflow temperature capability delivers excellent print and reflow process yields for pin-in-through-hole applications.
 
iNEMI Members Release Position Statement on the Definition of “Low Halogen” for Electronic Products
Thursday, 02 July 2009
Statement defines BFR/CFR/PVC-Free
 
Synopsys MVSIM adopted for low power verification of STw8500 mobile SoC platform
Thursday, 02 July 2009
Comprehensive support for low power techniques and high level of accuracy significantly improve bug detection
 
Mesago Messe Frankfurt terminates collaboration with Automation Shanghai – IAC, TME + SENSOR
Thursday, 02 July 2009
After one year of common commitment, there was no unity regarding the further design of the event.
 
Customer-oriented product engineering of micro and nano devices
Thursday, 02 July 2009

The CORONA partners at a project meeting in Cambridge in June.- European project CORONA looks back on a promising first year

 
Real-Time Traffic Service Revenue to Boom Over the Next Five Years
Thursday, 02 July 2009
During the next five years, Japan’s share will decline as the United States, China and other regions use more broadcast traffic information.
 
What’s the verdict on NEW 2009? Plenty of interest and high quality leads
Thursday, 02 July 2009
Amid reports of visitors attending with the sole aim of purchasing equipment and exhibitors re-booking for 2010, NEW 2009 represents further evidence of a pending industry recovery.
 
New MATRIX UV Laser for High-Throughput Applications
Thursday, 02 July 2009
Coherent MATRIX UVAll MATRIX lasers are fully RoHS compliant and backed by an 18 month/10,000 hour warranty.
 
3Dconnexion 3D mice now supported by Dassault Systèmes’ CATIA V5R19 SP4
Thursday, 02 July 2009
3Dconnexion 3D mice3Dconnexion’s 3D mice offer CATIA users a more streamlined design process, increased comfort and performance benefits.
 
Just 10 UKT&I Grants remain for The Manufacturing Technology Ireland 2009 Exhibition
Thursday, 02 July 2009
Use the Weak Pound to Your Advantage - Beat Off the Recession & Increase Your Exports in Ireland Using UKT&I Grant Funding
 
Mouser Electronics First to Stock the Freescale Tower System
Thursday, 02 July 2009
Freescale TowerTWR-MCF51CN-KIT simplifies configuration with modular hardware development platform
 
EEF sets out manifesto for manufacturing
Thursday, 02 July 2009
EEF’s strategy for a more diverse, agile and innovative manufacturing sector speaks to both manufacturers and government.
 
Seika to Feature Product Literature for all Seika Machinery Products at SMTA Ohio
Wednesday, 01 July 2009
The Anritsu 3-D High Precision Laser In-Line Inspection System features numerous advanced technology features.
 
Kyzen to Highlight AQUANOX® A4241 at SMTA Ohio Valley Expo & Tech Forum
Wednesday, 01 July 2009

AQUANOX® A4241AQUANOX® A4241 is multi-metal safe including bare aluminum and copper.

 
Maximum Process Control for SEHO Selective Soldering Systems
Wednesday, 01 July 2009
Flux ControlThe new flux control system from Seho does not only monitor the function of the drop jet nozzle.
 
Bourns Announces New Power Resistor Products
Wednesday, 01 July 2009

Bourns CRF1206 CRM2512-FT Power ResistorsNew Power Resistors Feature High Power Density and Small Form Factor Design

 
E-Switch’s Latest Tact Switch is Illuminated with Many Cap Options!
Wednesday, 01 July 2009
TL1220This switch has multiple illuminated cap options that include graphics.
 
Future Horizons signs up Israeli representative
Wednesday, 01 July 2009
Ben-Artzi brings an impressive track record within the semiconductor industry to the world’s leading independent semiconductor analyst house.
 
CIL reaping rewards for investment in micro-packaging
Wednesday, 01 July 2009

Wirebond application from CIL utilising 32 micron wire on a 100 micron pitchRecently CIL have invested in new automatic high speed die bonders and an automatic aluminium wirebonder capable of wiring at 25 micron.

 
congatec Introduces New Low-Cost, Low-Power ETX/XTX Module
Wednesday, 01 July 2009
conga-XA945 moduleCombining the Intel® Atom™ Processor N270 with the mobile Intel® 945GME Express chipset makes for powerful graphics performance
 
Aquantia deploys Synopsys IC Validator and IC Compiler for 40nm quad 10GBASE-T design
Wednesday, 01 July 2009
In-Design physical verification key to accelerated manufacturing compliance
 
Register for PCB West 2009
Wednesday, 01 July 2009

Conference: September 14-18
Exhibition: September 15-16
Location: Santa Clara Marriott

 
Digi Announces ZigBee Smart Energy Certified ESP Gateway
Wednesday, 01 July 2009
New comprehensive Smart Energy product family expands iDigi™ Energy offering
 
KIC’s Brian O’Leary to Host an Encore Presentation Webinar on Profiling BGAs
Tuesday, 30 June 2009
Brian O’Leary, Sales Manager - Americas, will host a free Webinar on Wednesday, July 1 at 10:30 a.m.
 
Asymtek Sells Spectrum™ S-910N Dispensing System to DancoTech
Tuesday, 30 June 2009

L to R: Thomas Tach Soerensen and Ulrik Nielsen of DancoTechDancoTech’s 11th Asymtek Dispensing System

 
Aqueous Technologies Appoints Sales Representative for Midwest
Tuesday, 30 June 2009
Horizon Sales is a manufacturers’ representative corporation delivering machinery and supplies to the electronics industry.
 
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Results 1 - 40 of 5550


Featured Interview

Interview—Jeff Timms, Microscan

Jeff Timms, president of Microscan since 2007, has been focusing these past two years on bringing the company to the forefront of the precision data acquisition and control solutions industry.

 

Small Matters

IC Packaging Technology Retrospective - Part 4

The electronics industry’s mantra has for many years been “Smaller, Faster, Lighter, Better and Cheaper.” 

 

Lead-Free Matters

Shear Testing of BGA Pads – Pads are not as good as they were?

Shear force measurement is a common and quick way of destructively assessing solder joints and complement pull strength measurements.

 

Global Business

Sobering first quarter

Modest seasonal & cyclical recovery now underway.

 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff
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