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The ONLY global awards program in the industry
This year’s awards will be presented at a ceremony to be held during SMTA International, which will be held in Orlando, Florida, October 24-28, 2010. Now in our sixth year of recognizing and celebrating the very best new innovations in the printed circuit assembly and packaging industries. Questions? Contact us at awards@globalsmt.net.
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Winners 2009 The fifth annual Global Technology Awards were held at Productronica in Munich, Germany, in November 2009 and broadcast live on Global SMT TV. Here are highlights from the event:
A team of international judges presided
over the contest to select the best new product innovations introduced
between July 2008 and July 2009. The result was a celebration of some extremely innovative technology that deserves the description “the best in the world”. Below is a brief description of each category winner and the products submitted. Adhesives/Coatings/Encapsulents
Anti-Counterfeiting Services
Anti-Counterfeiting Tools
Siemens—SIPLACE SX
KIC—e-Clipse
Environmentally Friendly Products/Services
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Henkel’s new Loctite PSX-P and Loctite PSX-D printable phase-change thermal interface products overcome many of the challenges associated with pads and greases. These next-generation materials are phase-change materials in liquid form that allow manufacturers to realize the throughput and ease-of-use often synonymous with thermal grease processes. Loctite PSX-P is suitable for automated screen printing systems and is offered in both medium dry and extended try formulations. Loctite PSX-D is a fast-drying paste that can either be needle dispensed or manually screen printed. 
STI ELECTRONICS INC. performs a special chemical decap service for customers who want to see if they are receiving counterfeit parts from their supply chain vendors. STI also provides this same service to component manufacturers who want to verify if certain returned components are truly their original manufactured parts. This service provides the ability to chemically decap the integrated circuit from the overmold package and verify at the die level if the die inside the component package is the original manufacturers die. This is a good way to know without a shadow of a doubt if the component in question is counterfeit. 
The SENTRY Counterfeit IC Detector solution is in response to a global problem generated mainly by component obsolescence. SENTRY is an easy to use tester, aimed at goods inwards inspectors and designed to measure the PinPrints of components. The information collected is managed through a database and is used to compare known good devices against suspect components. Typically, SENTRY can easily detect missing or incorrect dies, lack of bond wires, inaccurate pin outs and pin impedance variations. Simple pass or fail results are returned after testing, offering a high level of confidence in the authenticity of components. 
Juki’s new FX-3 motor driven electric feeder can feed sensitively for ultra small components, steadily and fast. With the electric feeder there is no need to stop the machine when replenishing components using the splicing function. This drastically reduces down time, allowing components to be easily replenished at any time. Additionally, the electric feeder requires only a minimum investment for stable production of high quality. 
Specifically cited in MIL-2000A, the Zero-Ion ionic contamination tester is one of the industry’s most popular Resistivity of Solvent Extract (ROSE) testers. The Zero-Ion G3 is the newest, most advanced Zero-Ion ever designed. Unlike other systems which require heated test solution, the Zero-Ion performs all tests at ambient temperature, eliminating the need for heaters and their associated safety concerns. Ambient temperature testing also reduces machine start-up times and test solution evaporation. 
Kyzen’s Cybersolv® 141-R is a precision cleaner blend of organic solvents. 141-R was designed for optimum effectiveness on a wide variety of soils typically found in electronic assembly and maintenance cleaning applications including flux, paste, inks, uncured adhesives, waxes, mill markings, greases, oils, finger prints, etc. Cybersolv® 141-R cleans faster than IPA and other competitive products. Production line down-time to restock supplies is dramatically reduced over 40% due to the materials low volatility.
Alta Manufacturing’s facilities are equipped with state of the art machines. The company is very competitive in the quick turn PCBA market specializing in highly complex PCBs while still maintaining quality service toward a broad spectrum of technologies. Alta Manufacturing’s Contract Services include quick turn prototype assembly (1 day), volume production, program management, material procurement and management, mechanical engineering, full box build and testing services, resulting in tremendous cost benefits. 
Because machine settings on the MY500 jet printer are automatic, process engineers can concentrate entirely on the deposit design and location. The ability to inspect and repair the printing result if necessary reduces the risk of mistakes and the amount of rework – which in turn leads to increased profitability. Instead of waiting for a new stencil to be
shipped, you simply enter the new CAD data in
the software and set up a new program. 
Cobar’s 396-DRX is a no-clean VOC-Free Flux. This RoHS compliant flux fulfils the need for more environmental-friendly materials, while maintaining excellent soldering performance.396-DRX can be applied with any kind of air atomizing or ultrasonic spray fluxers. Only a minimal amount is required so that optimal settings for the fluxer unit can be selected. The flux removes the oxides and promotes wetting during soldering, making it possible to achieve good hole filling without having to lower the transportation speed. 
The V-Works 24 is designed specifically as a single component rework tool. It utilizes Vapor Phase Technology to transfer heat for removal and replacement of single components and connectors on circuit boards. The V-Works 24 solves many of the problems now plaguing the rework sector of the electronics industry and specifically lead free applications. Hot air and IR rework stations may bring issues such as overheating, shadowing, deflection and reflection to rework. These are non-issues in the new V-Works 24 vapor rework station. 
ProductSentry™ is a new generation of barcode labels using covert-enhanced Thermoguard® technologies built around its Thermoguard® “harsh environment platform”. Existing WIP information, is now matched with a one-to-one correspondence to its authentication, at the beginning of its manufacturing cycle. In other words, ‘Track and Trace’ technologies now begin in real time, on the factory floor. The system helps protect your products from counterfeiting, warranty fraud, and product diversion downstream, saving a great deal of money in the long run. 
The MIRTEC MV-3L is a five-camera desktop AOI system featuring four-megapixel digital color camera technology and 9.8 micron/pixel resolution. The system is extremely simple to program and operate and offers unsurpassed defect detection. THE MV-3L also features Intelli-Beam laser inspection technology, four-point height measurement for coplanarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. 
The Dage XD7600NT100 is the most technologically advanced x-ray inspection system on the market with groundbreaking 100 nanometer (0.1 micron) feature recognition for finite analysis of the most challenging inspection applications.The system is available with a high-power tube combining 10 watts of power and sub-micron feature recognition. Unlike existing high power tubes that have to significantly compromise resolution when used at higher power levels, this new high-power tube retains sub-micron feature recognition at full power. 
The development vision of “high quality placement at low price” is embodied throughout the JX-100 and it is a best choice for the enterprises introducing a mounter first time. The machine can improve productivity and confidence with minimum investment. New mounter JX-100 helps you get rid of manual jobs and enter the list of modernized manufacturers. The JX100 offers a competitive placement speed of 14,400CPH. The JX100 uses recognized and simple data preparation program. The operator can master machine operation in only a short time. 
Panasonic’s NPM (Next Production Modular) integrates screen printing, dispensing, placement, and AOI into one configurable platform. Production can be scaled to exact factory needs with heads and functions changing as production requires. Two plug-and-play heads with no pairing limits work on each stage, maximizing productivity and fully realizing dual lane benefits. Two different boards or different sides of the same board can run using both sides of the machine’s feeders and balancing top and bottom of a board with large part count discrepancies. The NPM-DSP (dual screen printer) features high-speed simultaneous production of two same-type boards or two completely different products as well as non-stop model changeover so the product can be changed on one side while the other continues operation. 
The SIPLACE SX leads the way to a new era in innovative SMT production of the future. It is ahead of all traditional machine concepts because manufacturers can scale position capacity and placement performance independently and switch them between machines and lines “on demand”. The main feature of this new concept is rail-mounted gantries that can be added or removed in less than thirty minutes by a single operator. The SIPLACE SX allows manufacturers to transfer capacity between machines and lines, and depending on demand peaks they can purchase or rent additional capacity – either complete machines, or just machine frames or just gantries can feeder slots. This eliminates the need for costly line reconfigurations each time new products and/or demands change. 
The first laser-cut solder paste stencil that has paste release performance comparable to electroform technology. The UltraSlic FG incorporates the latest stencil laser technology along with a new Fine Grain stencil material from Datum Alloys. Acceptable paste release is achieved down to a surface area ratio of 0.45. UltraSlic FG stencils have higher repeatability and cleaner release of solder paste on small/miniature components, resulting in minimized rework at the end of the assembly line. This results in increased yields and tremendous throughput improvements. 
The FlashCORE III is the first programming engine to support device and image data sizes greater than 4 Gigabytes, while maintaining programming speeds near the theoretical limit of the device. In addition to fast programming speed, the FlashCORE III supports fast data downloads over the Ethernet network to facilitate quick job setup and short changeover times, enabling efficient production. Fast speeds and faster changeovers mean customers can produce more units with fewer machines and less floor space. Quality monitoring can reduce potential defects or mistake consequences. Data I/O proprietary sockets lead to the lowest consumables cost over large production runs of anyone in the programmer industry. 
The FlexSolder W510 uses the same technology that has been so successful in the past but with a new flexible design, allowing the machine to be assembled anywhere and to allow complete option upgrades in the field. The advantage of the JUKI selective soldering machine over the competitors remains the same as in past machines i.e. the ability to have multiple mini-wave nozzles soldering simultaneously or even better, running separately using 2 different size nozzles. The advantage of this is you can use a nozzle as small as 1.8mm for tight areas (1mm away from SMD or other components) on densely populated boards and a larger nozzle for making single passes on large connectors. This adds much needed flexibility to the process, allowing various soldering options with no changeover. 
vCheck is the quality management system at the core of Valor’s manufacturing execution suite for dynamic assembly. vCheck includes alarms and Acceptable Quality Level (AQL) trigger points to help continuously reduce the Defect Per Million Opportunities (DPMO) rate in the manufacturing process, and is designed to increase profitability and customer satisfaction by making all aspects of quality testing and inspection visible to any decision maker vCheck enables easy pinpointing of problems as well as automatic suggestion of solutions from its knowledge base, providing significant reductions in the time it takes to analyze problems and locate solutions. 
KIC developed a very easy to use tool for the solar industry that has almost unlimited flexibility, so that it will continue to be productive for customers as they are changing the way they want to manufacture their solar cells in the future. One example is that the SunKIC will calculate "the area under the curve" for each profile. This may turn out to be a critical number. If yes, it will be calculated automatically. If no, the customer will not select that dimension, and hence it will not clutter the more important data. The SunKIC with Spectrum will optimize on conveyor speed allowing the manufacturers to run the fastest speed within the limitations of the process window and furnace capabilities. 
TC attachment has a significant influence on the accuracy of the thermal profile readings, as well as their repeatability. The e-Clipse TC attachment fixture offers repeatable profile data, convenient TC attachment, and utilizes the user’s existing solar wafers. It features four spring loaded TCs within a lightweight fixture that also holds the solar wafer. The TCs have disk-shaped beads, rather than the traditional spherical shaped beads. These flattened TCs offer a more reliable contact to the surface of the solar wafer, as well as a greater number of repeatable profile readings. 
The MRS-1000 modular rework system is designed to simplify the removal and placement of BGA/CSP and SMT components. By integrating advanced rework technologies, it is an extremely versatile system. Comprising a programmable convection tool with a wide array of nozzles, preheater, adjustable tool holder and light magnifier. Capable of handling multiple sizes of PCBs, this manually-assisted rework system is equipped to process components up to 40mm x 40mm. Standard features include: 4 zone profile control, digital display, program storage of up to 50 profiles and simple profiling. 
SN100C (040) is a product that is truly halogen-free with no halogenated covalent bonds, combining the uniqueness of the proven SN100C lead-free solder, environmental benefits and long term solder joint reliability. SN100C (040) provides excellent wetting and smooth bright fillets free of shrinkage defects, with a stable microstructure that accommodates long term and impact solder joint strains. SN100C (040) offers fast wetting for high production on commonly used solderable finishes, i.e. OSP, Immersion Sn, Immersion Ag, ENIG. 
The innovative Visionscape® Smart Camera inspection system is a cost effective and flexible solution that can be used for PCB quality inspection, device metrology inspection, and full traceability. Small, portable, and high speed, Visionscape® Smart Camera inspection systems are easy to install inside equipment or “over-the-belt”. Job changeovers can be done quickly and easily through a user friendly GUI, making even the most difficult applications easy to program and bring on-line. 
The Diamond Series atmospheric robots represent a significant engineering advancement in the design and reliability of wafer handling equipment. Benefiting from technologically superior components, the robots utilize ultra low inertia, high-response brushless servomotors coupled with zero-backlash Harmonic Drive® gears to achieve greatly enhanced dexterity and precision. Two independent arms (R1 and R2) attached to a common royalty axis (T) allow fast swapping or simultaneous transfer of two wafers. Powerful native wafer handling and scripting languages facilitate rapid software development for embedding the robots into an OEM application environment. 
LIQUID LOCK™ is an integrated resource management system for conveyorized inline
cleaning systems that reduces operating cost of the cleaning process by saving
cleaning agent, water and power, minimizing the environmental impact of the cleaning process. LIQUID LOCK™ “locks” atomized spray in the wash chamber, eliminating the number one cause of chemical solution loss (atomized spray mist exhaust). Extensive lab tests and
customer data confirm that the LIQUID LOCK™ technology reduces consumption of
cleaning solution by up to 75%. 
Icon i8 represents something of an industry first. Wielding exceptionally high throughput and immense flexibility, Icon i8 has been specifically developed to meet the significant industry challenges of the fast-paced Asian electronics market. Featuring a high degree of automation to maximize throughput and minimize operator intervention, the Icon i8 reduces product changeover time to a minimal two minutes, resulting in increased speed and throughput improvements. Along with a host of other impressive technical specifications, Icon i8 delivers a rapid 12 seconds cycle time, 350 x 300 mm maximum board dimensions and compatibility with a range of advanced performance options. 
The EVS 7000 represents a quantum leap forward in the processing of solder dross. The series’ sleek lines confirm the streamlined systems, advanced electronic controls and integrated diagnostics. The EVS7000 offers a capacity of 10 kg/20 lb, and has the ability for single operation de-drossing of even the largest wave soldering machines. Its integrated hopper makes rapid transfer of dross both simpler and safer, and speeds de-drossing times by up to 75 percent. 
CyberOptics redefines inspection speed with the SE500 — a new 100 percent 3-D solder paste inspection system. This system has the ability to inspect the most demanding assemblies with a >80 cm2/sec inspection speed that does not compromise measurement accuracy and repeatability. Building on CyberOptics’ reputation for providing solder paste inspection systems with industry-leading volume accuracy, the SE500 can inspect pad sizes down to 01005 component size, while keeping up with ever-increasing line speeds. Accurate volume measurement of every solder paste deposit is critical to ensuring high quality solder joints in the SMT process.