| Winners: 2011 - 2010 - 2009 - 2008 - 2007 - 2006 - 2005 |
Technology Awards
The ONLY global awards program in the industry
The 2011 awards will be presented at a ceremony held during productronica in Munich, Germany this November. Now in our seventh year of recognizing and celebrating the very best new innovations in the printed circuit assembly and packaging industries. Questions? Contact us at awards@globalsmt.net.
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Winners 2011 The seventh annual Global Technology Awards were held at Productronica in Munich, Germany on November 15, 2011. Check out our photo gallery from the awards ceremony. A team of international judges presided over the contest to select the best new product innovations introduced between July 2010 and July 2011. The result was a celebration of some extremely innovative technology that deserves the description "the best in the world". Below is a brief description of each category winner and the products submitted.
Best Product—Asia
GPD Global—PCD Dispensing on MAX series platforms
ID & Labeling
Inspection Equipment—X-ray
Rep of the Year
Soldering Materials
Storage Systems
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ViTrox's V810 In-line 3D automated x-ray inspection system (AXI) provides the fastest inspection speed and widest test coverage. V810's state-of-art technology is based on Digital Tomosynthesis methodology. The advanced Digital Reconstruction Technology reconstructs x-ray images from multiple angled cameras and effectively separates the top and bottom side of the board images clearly. Proprietary Auto Focus technology enables the system to intelligently focus on desired z-height without any mechanical movement from x-ray or stage. 
Launched in September 2008, the AD Oracle quickly became the established choice for high performance extraction applications within the electronics sector. The addition of IQ intelligent technology further enhances this product range and sets new industry standards for innovation and performance. IQ combines the very latest design standards with state of the art hardware technology. The 'chip on glass' graphic display provides a comprehensive summary of real time performance and access to an array of analytical data, including fully customisable reports. 
The high performance DataMan 500 fixed-mount barcode reader is powered by a proprietary vision chip technology, Cognex VSoC™ (Vision System on a Chip), providing unmatched barcode reading and ease of use not found in other image-based or laser systems available today. DataMan 500 reads barcodes at twice the speed of other readers and is so easy to use, and reads codes so well, that it doesn't have to be positioned optimally to achieve high read rates. 
The Auto Focus Power is a "self profiling oven". Today, to set up a new product for the reflow process, one must run a profile initially to find the appropriate recipe to manufacture this board within its defined specifications. This process means that if the board is not able to be used as a good production board, it becomes scrap. A profiling database is accumulated by the user, allowing them to simply enter the PCB length, width and weight, the software will then automatically suggest the suitable reflow oven recipe and the expected PCB profile, WITHOUT the need to profile. The process is optimized for an in spec profile and for the least amount of electricity use that will yield an in-spec process. 
GPD's Positive Cavity Displacement (PCD) Pump for next-generation volumetric dispensing delivers low or high viscosity fluids in a controlled manner without the possibility of dripping or drooling. When coupled with the MAX II Dispense platform and UltiPath optimization software for the BGA underfill process, the result is increased throughput by reducing idle time from optimizing the dispense paths associated with multiple dispense pass products. 
Almost everyone does splicing, but most keep tools on a nearby table, component reels in another place and splices somewhere else. The SMT Splice Cart is a simple tool used to store and use splices, leader-tape and component reels together on a simple stand on wheels. The Splice Cart cuts splicing time in half and keeps the pick-and-place machine running and placing components. 
The FINEPLACER® matrix MA is the ideal choice for bonding when high precision and application flexibility are required -- especially when standards of process reliability and reproducibility of results are demanded (specifications such as those found in medical technology, aerospace and the automobile industry). The process flexibility makes the system ready for future developments in respect to new connection technologies. 
Trident XLD is the industry's most environmentally responsible fully automated defluxing and cleanliness testing system. Unlike other closed-loop defluxing systems, the Trident XLD is capable of removing all flux types including no-clean, rosin and water soluble. Additionally, the system is capable of operating with a variety of environmentally safe defluxing chemistries, frequently required for specific types of flux removal. The Trident XLD's average total cycle time is under thirty minutes making it the fastest fully automatic defluxing system available. The Trident XLD can clean one month's worth of production while consuming less than ten gallons (38 liters) of water, all of which is lost to normal evaporation. 
An engineered electronic assembly and advanced packaging cleaning agent, AQUANOX® A4638 is the first product designed and specifically optimized for cleaning lead-free water soluble flux residues from advanced packaging devices and assemblies. A4638 has inherent optimization that every other product lacks: It is designed for particularly high temperature water soluble residues, this allows for lower cost of ownership and high throughputs.
The Micro-Coil Spring Array has been introduced as an improved alternative to standard rigid arrays to replace the Column Grid Array (solder columns) commonly used on Integrated Circuits (IC) with a very high lead count. The Micro-Coil Spring Array was developed by NASA for a higher degree of reliability over conventional Column Grid Arrays and this technology was licensed to STI Electronics Inc. for its commercialization and production capability. 
ACD's Flight Status system leverages state-of-the-art programming techniques to track the progress of circuit boards throughout the manufacturing process internally for ACD's use. This also is visible for customers to track the status of the order at any point in the manufacturing process. Touch-screen displays present a real-time list of projects and board counts within specific process centers, including the quantity of boards in previous and subsequent process centers. An assembler can touch the line for a specific project to drill down into information relevant to that specific project in process, such as the route and contact information. 
Computrol's success is largely attributable to its ability to manufacture high quality products in small to medium lot sizes. The focus on lower volume electronic contract manufacturing has fostered the development of highly differentiated services that are specifically tailored to meet the unique needs of low volume contract manufacturing customers. This allows the company to be more flexible and provide assembly services with shorter cycle times. 
Krayden is a "NASA top 100 Supplier," "Dow Corning Electronics Distributor of the Year 2008, 2009 & 2010," Certified AS 9120, ISO 9001:2008, and now offers Dow Corning Solar Solutions. The company is a technical problem solving distributor, specializing in adhesives, sealants, coatings, solvents, various types of chemicals, solder and lead-free solder. Krayden serves the electronics, aerospace, transportation and energy industries (solar, oil and gas) as well as OEM manufacturers. 
SCAN-Ge071 is a low Ag lead-free alloy. The alloy is an improved SAC alloy that contains a small amount of Ni to reduce the growth of the intermetallic layer, resulting in more reliable solder joints. The flux is an optimized resin based chemistry to have the best wetting and printing properties with this specific alloy. The flux is designed to make printing possible up to 100 mm/s for larger volume production lines. The combination of solvents and activators used in this paste returns a large process window for the reflow process. High yields can be achieved with fast conveyor speed and short cycle times. 
Behind the impressive design of the WX2 lies a powerful control system with 2 independent outputs. With 240W of power and low voltage outputs that drive intelligent soldering tools with integrated temperature sensors and quick heating-up time, the WX2 is the ideal tool for modern assembly requirements ranging from heavy duty soldering through to precise surface mount hand soldering. 
The revolutionary Vision MINI machine vision smart camera combines compact hardware and industrial features with unprecedented ease of use and scalability through software advances. Now, process and manufacturing engineers have greater flexibility and no longer need to become experts in machine vision in order to successfully deploy a system that meets their traceability, inspection and quality control needs. 
MIRTEC's all new MV-7 Series 2D/3D AOI systems may be configured with a state-of-the-art 15 Mega Pixel top-down camera system, which they affectionately refer to as ISIS. This is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of inspection equipment. ISIS is an acronym for Infinitely Scalable Imaging Sensor. As the name implies the ISIS Vision System may be scaled or modified to address the specific inspection requirements of virtually any production environment without sacrificing speed or performance. 
The TR7007 is the world's fastest inline shadow-free solder paste inspection system that offers full 3D inspection of area, volume, height, shift, peak height, shape, deformation, registration, bridge, and foreign materials at a maximum 160cm²/sec at 14µm. With a 10µm resolution, the TR7007 meets the requirements for fine-pitch PCBAs and other speed-critical applications. The system even offers repeatable and accurate results on small CSP, 0201 and 01005 component inspections at an optimal price/performance ratio. 
Nordson DAGE's XD7600NT Diamond FP x-ray inspection system uses the latest technology flat panel detector to provide the ultimate choice for the highest quality real time x-ray imaging. The unique Nordson DAGE NT provides up to 10 W of power, making this the choice for the highest performance. The system is powered by a single phase 200-230Vac,16 A. Using the latest flat panel detectors with their much lower image noise enables clear analytical pictures to be produced much more quickly and therefore gives improved inspection times and increased sample throughput. 
Nordson ASYMTEK's jet dispenser is faster than other multi-head dispensers, is easier to setup, and enables jetting into extremely small and hard-to-reach cavities for side-view LEDs. Silicone phosphor dispensing is critical for LED color quality. The system uses a jet for non-contact dispensing, jetting 0.1 to 0.2mm dots through windows as small as 0.4mm into LED cavities. Unlike a needle, the jet retracts much less for silicone break-off, dispensing multiple shots faster, increasing speed and throughput. The jet's small, controlled drops of fluid reach tight cavities consistently and reliably, unlike needles with orifices larger than the cavity windows of side-view LEDs. 
Cobra is the first pick-and-place system that combines high throughput of 20\'000 cph with the flexibility of on-line feeder changeover. Cobra is the first machine with an eight-nozzle pick-and-place head where each axis has a fully independent drive system and each nozzle can handle the full component range from 01005 chips up to 80x70 mm. Additionally, the new Cobra Feeder is now available. 
With the introduction of the Sentry, Juki has integrated the inspection process into the assembly sequence. The Sentry was developed in cooperation with CyberOptics Corporation and is the first system to prevent incorrectly assembled boards from being reflowed. Boards are inspected at each step with innovative sensors (soldering, printing, small chip placement, large device placement), allowing only correctly assembled boards to enter the reflow oven. 
The SP700avi combines Speedprint's commitment to high performance and reliability. The system was designed to cope with the rigors of high-volume SMT production. The SP700avi features unique Look Down/Look Down vision that facilitates optimized board-to-stencil alignment, yielding 20micron, 6 Sigma performance at 2Cpk. Additionally, the screen printer eliminates any alignment compromise due to fiducial quality. 
Model 2800 combines BPM's award-winning, proven Flashstream technology with universal device support, resulting in the fastest universal device programmer. It uses 64-bit architecture, which pushes device programming beyond the 4 GB data density barrier. The 2800 was designed to support very low voltage devices down to 0.7 (Vdd). It also uses BPM's innovative individual socket cards as opposed to "gang" cards, which are soldered to a common PCB. These features provide for a faster, more efficient and more economical programming solution. 
Etek has built its success on strong relationships with both customer and supplier which ensures that they continue to deliver the latest premium solutions. Etek have a proven ability to provide unrivalled service and support that focuses on quick response times, clear communication and complete customer care. 
The Micra is a brand new SRT rework platform in a benchtop format, specifically designed for the rework of mobile products incorporating small, high density electronic devices such as Smartphones, Netbooks, GPS and other handheld products. The new SierraMate V9 software simplifies process definition and assures consistent, repeatable results between facilities and between continents. The system's redesigned heaters and revolutionary power controls provide extremely high throughput and matched results regardless of typical facility voltage variations. 
The FSW620-EF is a traditional mini-wave soldering system that is capable of supporting board sizes up to 510mm x 510mm depending on nozzle configuration. The FSW620-EF is the only machine in its class that can accommodate up to three autonomous acting soldering nozzles, allowing the use of three different sizes and/or types of nozzles without changeover. 
The Line Executive (LX) is a SMT setup optimization tool designed to improve schedule performance and reduce line down time for high-mix, or ultra high-mix electronics assembly manufacturing. The core feature is an extremely fast grouping engine based on part commonalities, production quantities per work order, schedule priorities and line /station configurations. The planning function can take thousands of work orders and distribute them across the lines to minimize changeover time and achieve the best factory build plan. 
The PYRAMAX™ was designed for mass production for both Semiconductor Packaging and Surface Mount Technology. Now, the PYRAMAX dual-lane system is available with independent lane speeds, making it possible to run boards with large thermal differences simultaneously. This Dual Lane Dual Speed capability will enhance the system's productivity, support LEAN manufacturing, and save customer's resources. Multiple speeds provide customers with high-mix products with the opportunity to maximize their operation. 
SN100C (551CT) combines the benefits of a eutectic lead-free alloy with a robust, high temperature capable cored flux for high speed sequential soldering. The cored flux is formulated for high soldering tip temperatures, 380°C, with good tip separation for reduced icicles, allowing fast wetting and high spreadability, a 10 percent increase over comparable flux cores for automatic robotic soldering. 
Seika Machinery offers various options for the new McDry Feeder Cabinet line for easy dry storage and reconditioning of tape and reel MSDs on feeders and faster operation on the floor for pick-and-place machines. These include the sliding reel shelves for both the DXU-1002-1000 large size cabinets and the DXU-580AF for smaller quantity storage ideal to be set in the line for prompt access and storage of MSDs on tape feeders. Seika offers ergonomic options in both sizes as well as the cart/feeder system in the larger DXU-1002-1000 cabinet. This model provides a versatile solution for dry storage options in that the five standard shelves are part of the package and can be replaced should requirements change. 
The Nordson DAGE 4000Plus is the most advanced bondtester on the market, offering unsurpassed accuracy and repeatability. Developed by the world leader in bond testing technology, the Nordson DAGE 4000Plus represents the industry standard in bond testing. The 4000Plus Hot Bump Pull application is achieved by selecting a specialized load cartridge that can be programmed to apply a time-temperature reflow profile to individual solder bumps and/or bonds using a test probe. Reflow parameters including pre-heating, soak, rate of rise, time above liquidous and cooling rate are integrated into the 4000Plus Paragon™ software for easy on-screen profiling and control. A selection of standard probe sizes are offered as well as custom test tips which are available upon request. 
Entered by Datest, a test service provider, the SPEA 4060 is a multi-purpose flying probe system designed to cover the widest range of test requirements. With high mechanical speed, dual-sided probing, extreme accuracy, a comprehensive range of board loading modules, overall configurability and fast set-up changes; the 4060's performance and flexibility provides a complete solution to all of your production needs. The 4060 system is the only flying probe platform to offer linear motor probe movement and optical encoder feedback to provide closed-loop feedback for precise probe positioning.