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Breaking News
ESSEMTEC to Highlight Key Products and Technologies at APEX 2009
Friday, 27 March 2009
Expert–SAFP SMD Pick+PlaceOn display in Essemtec’s booth will be Pantera–XV, SP003–MLV, FLX2011LV, RO400FC, SP150, and Expert–SAFP.
 
The Award–Winning SIPLACE D–Series demonstrated at APEX
Friday, 27 March 2009

Its offline Vision Teaching Station lets you map and describe new component shapes offline, without interrupting the production line.

 
To invest further in Technology
Friday, 27 March 2009

Fuba Printed Circuits Tunisie has already, invested heavily during 2002–2007 and achieved more than 200 % increase in production capacity.

 
KCS expand relation with 3 DIMA Modulo Pick & Place machines
Friday, 27 March 2009
RO–510 SOLANOThe Solano RO–510 Reflow oven, offers exact control of all cells and total performance consistency, even under varying loads.
 
48 pin F Series Male and Female DIN 41612 are rated at 6A/pin
Friday, 27 March 2009
Available with solder eyelet, Wire Wrap and board solder pins.
 
StratEdge Introduces Low–profile, High–power Switch Package for GaN, SiC, and GaAs Devices
Friday, 27 March 2009
Provide Complete Turnkey Package Assembly and Test Services
 
Tools for Singulating Tab Routed PCB Panels
Friday, 27 March 2009
N200Video of the N200 punch shows separation of round and odd shaped panels without dust.
 
Mirics and CyberLink join forces to deliver HDTV to notebooks
Friday, 27 March 2009
Mirics and CyberLink join forces to deliver HDTV to notebooks World’s first PC TV receiver featuring software demodulation delivers HD content with CyberLink’s industry standard TVEnhance
 
Keithley White Paper Describes Semiconductor Characterization and Parametric Test Challenges
Friday, 27 March 2009

The white paper describes the emerging technology and business dynamics affecting the industry, including the growing need for vendor support.

 
Bourns Announces freeXpansion™ Technology for its Multifuse® Polymer PTC Resettable Fuses
Friday, 27 March 2009
Bourns freeXpansion PTC FusesNew Technology Handles Higher Currents and Voltages, Improves Resistance Stability and Allows Bourns to Introduce One of the Smallest Lines of Polymer PTC Resettable Fuses
 
Dage announces the success of its NT X–ray tube technology
Thursday, 26 March 2009
Offers lower maintenance costs and eliminates filament replacement
 
Siemens invites APEX attendees to COMPARE SIPLACE
Thursday, 26 March 2009
At APEX 2009 Siemens will be presenting its SIPLACE X–Series platform powered by its new SIPLACE MultiStar placement head.
 
OPTEK enhances Family of Fluid Sensors with Automatic Calibration Circuitry
Thursday, 26 March 2009

The OCB350 Series sensors are designed to maintain the calibrated setting even if power is lost.

 
Transition Automation will Introduce an Innovative Cleaning System at Apex
Thursday, 26 March 2009

The new system allows users a "mini–car–wash" type function with push–button activation and no external spraying or chemical exposure.

 
Digi–Key Corporation and Bosch Sensortec Announce Global Distribution Deal
Thursday, 26 March 2009
Digi–Key to distribute complete product portfolio of Bosch Sensortec
 
Aqueous Technologies Introduces Zero–Ion g3
Thursday, 26 March 2009
Aqueous Technologies Introduces Zero–Ion g3The combination of test–board submersion and immersion spraying creates an environment whereby all of the soluble contamination is extracted and measured.
 
Europlacer Receives 2009 Frost & Sullivan Award
Thursday, 26 March 2009
Europlacer Receives 2009 Frost & Sullivan Award for Product Differentiation Innovation in the Global SMT Placement Market
 
New Cor–Coat Family of ESD Protective Coatings Announced
Thursday, 26 March 2009
For 30 years CCI has been designing and manufacturing static protective packaging for the electronics market including automotive, medical, commercial and defense industries.
 
Formation of new company
Thursday, 26 March 2009

Orange County Instruments announces its formation as a provider of small tooling for the Pharmaceutical and electronic assembly industries.

 
Yury Kovalevsky named IPC Russian Representative
Thursday, 26 March 2009
Kovalevsky’s appointment is part of IPC’s long–term plan to expand services and standards globally.
 
Valor Highlights Manufacturing Visibility Dashboard Solution
Thursday, 26 March 2009
Valor DashboardThe dashboards quickly identify trends or patterns in–progress and help derive the insights needed for early corrective action.
 
Juki to Feature FX–1R High–Speed Chip Shooter at APEX 2009
Thursday, 26 March 2009
Juki FX–1R High–Speed Chip ShooterBoth quadruple heads have a multi–nozzle alignment system using a high–resolution laser developed exclusively for Juki’s assembly systems.
 
RNT Adds New Representation for European and Israeli Sales
Wednesday, 25 March 2009

"This will help RNT bring NanoFoil® and NanoBond®to various sectors of the local electronics assembly industries and extend our sales reach throughout the world."

 
JJS Electronics moves forward with MYDATA
Wednesday, 25 March 2009
The new machine combines the versatility and high availability for which MYDATA machines are well known with a throughput of 34,000 cph.

 

 
Interface Development Suite supports creation of ultimate user experience for display–based des
Wednesday, 25 March 2009
Flexible GUI development environment is optimised for Anders intelligent display platforms to deliver powerful end–to–end solution with 80% less coding.
 
Seika Machinery, Inc. Announces 100 Sayaka Routers Sold in North America
Wednesday, 25 March 2009
Seika SAYAKAThe compact size and weight of these models are ideal for limited workspaces and versatility in production line set–up.
 
PCB East Returns to the Boston Area
Wednesday, 25 March 2009

The conference will be accompanied by a free one–day tabletop exhibition on Wednesday, April 29, featuring many of the industry's leading vendors.

 
Flat PCB Trays for In Process Work Holding
Wednesday, 25 March 2009
Flat RackHold up to 25 .12" thick cards at .65" pitch
 
Stablcor Enters Into New Licensing Agreement With France–Based Elvia PCB Group
Wednesday, 25 March 2009

Elvia PCB is a division of the Elvia Group, the largest supplier of PCBs in Europe.

 
IMEC lights 25 birthday candles
Wednesday, 25 March 2009
Today, 25 years later, IMEC has grown into a world–renowned institute addressing with its nanoelectronics research some of the major challenges of our planet and its people.
 
SMT/HYBRID/PACKAGING 2009
Wednesday, 25 March 2009
System Integration in Micro Electronics
International Exhibition & Conference
5 – 7 May 2009, Exhibition Center Nuremberg
 
Valor Features vCheck Quality Management System
Wednesday, 25 March 2009
Valor will feature the vCheck at APEX in booth 1373, and will have USR, an EMS provider, present in the booth to discuss the success they have experienced with vCheck.
 
Christopher Associates receives significant SPI order from major West Coast EMS manufacturer
Wednesday, 25 March 2009
Aspire 2, to be officially introduced at the IPX/APEX exhibition in Las Vegas later this month, is the fastest and most accurate solder paste inspection system in the industry.
 
New Virtual Practical Dummy Components Catalog Now Available
Wednesday, 25 March 2009
In the catalog, critical product additions include new body sizes of the Amkor® PoP (package on package) as well as the added ability to make triple PoP stacks.
 
Sono–Tek Corporation will introduce SonoFlux Servo
Wednesday, 25 March 2009
Sono–Tek SonoFlux ServoSono–Tek to Premier Ultrasonic Reciprocating Spray Fluxing System with Automated PLC Control and Selective Fluxing Capability at APEX 2009
 
MEPTEC Announces 7th Annual MEMS Symposium
Wednesday, 25 March 2009
This special one–day event will take place at the Wyndham Hotel, San Jose, CA.
 
RBP Chemical Technology to Offer $500 Rebate on New Products at IPC APEX EXPO 2009 in Las Vegas
Wednesday, 25 March 2009
RBP Microstrip ONE and FoamFREE ONERBP Chemical Technology will feature two new products of interest to printed circuit manufacturers and others allied to the field.
 
ESSEMTEC to Showcase FLX2011 at APEX 2009
Wednesday, 25 March 2009
The FLX2011 pick–and–place series fulfils the requirements of a high–mix SMT production and features 01005 chip placement capabilities.
 
Juki Automation Systems to Exhibit KE–2070 High–Speed Chip Shooter at APEX 2009
Wednesday, 25 March 2009
Juki KE2070KE–2070 introduces new stepper motors in the conveyor system that allow for enhanced speed control for the entire conveyor.
 
Inovaxe to Showcase INOCART Material Handling Systems at APEX 2009
Wednesday, 25 March 2009
Inovaxe INOCARTINOCART is a mobile bonded stockroom capable of locating wherever material is needed throughout the production plant.
 
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Featured Interview

Bryan Gass—Techcon Systems

Bryan talks to Trevor Galbraith about why he believes that implementing a rigid strategy now will strengthen Techcon Systems in these challenging times and beyond.

 

Small Matters

Synergy, the Occam process and twisted wire interconnect

The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff