1. Juki to Showcase a Range of Leading Equipment at APEX 2010
(Special Features/IPC APEX EXPO™ 2010)

...ficiency, operations and reliability. The FX-2 supports centering and placement of components from 0402 (01005) to 33.5 mm sq. Efficient, high-speed production lines can be created by connecting a hig...

2. CyberOptics to Expand Product Portfolio with New SPI and AOI System at APEX 2010
(Special Features/IPC APEX EXPO™ 2010)

...ion lines. Leveraging on the technology of SE500, this system is capable of inspecting pad sizes down to 01005 component size (150 x 150 µm). The AOI QX500 combines a unique image acquisition sol...

3. ESSEMTEC to Highlight Range of Equipment at APEX 2010
(Special Features/IPC APEX EXPO™ 2010)

...ead can simultaneously hold and measure four components. The range of components is vast - it spans from 01005 resistors up to 4 inch sq components, which can be up to 1 inch in height. The minimum pi...

4. CyberOptics to Unveil Latest Inspection Equipment at APEX 2010
(Special Features/IPC APEX EXPO™ 2010)

... paste inspection systems with industry-leading volume accuracy, the SE500 can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds. The SE...

5. Acculogic to Feature Latest Testing Technologies at APEX 2010
(Special Features/IPC APEX EXPO™ 2010)

...ical access and guarantee repeatable probing of fine-pitch devices and small components such as 0201 and 01005s. Using the patented vectorless test suite, PinScan™, the FLS900 series detects open-p...

6. Europlacer to Exhibit IINEO SMT Platform and XPii-II Pick-and-Place Unit at APEX 2010
(Special Features/IPC APEX EXPO™ 2010)

...an be between 14,000 and 26,000 cph The largest PCB can reach 1,610 x 600 mm Component range is from 01005 to 70 x 70 mm The tallest component can be 35 mm height. Possible options include gl...

7. Assembléon shows its new Smart Solutions at APEX 2010
(Industry News/America)

...on to Assembléon’s end of line solutions. The versatile machine places components from 0.4 mm by 0.2 mm (01005) up to 45 mm square (1.77”) on boards up to 700 mm long by 460 mm wide (27.56” x 18.11”)....

8. NBS further increases its SMT assembly capacity…Again
(Industry News/America)

...further expands NBS’ capacity to accommodate volume assembly and all up-to-date package styles including 01005, 0201, 0402, QFP, QFN, ball grid array (BGA), microBGA, and chip scale packages. “In st...

9. Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing
(Products News/New Products)

...pe 5 powder, S3X70-M407 solder paste has been formulated for 0.2 mm pitch µBGA devices, as well as 0402 (01005) components. Features include excellent wetting in air environments and low voiding. Ko...

10. HCD decides on AOI System from GOEPEL electronics at Productronica
(Special Features/Productronica 2009)

...ults. “The OptiCon BasicLine AOI system provided a solution that met all the criteria of HCD including 01005, system versatility and especially lifted lead detection with the Chameleon 360° angled v...

11. Productronica confirms industry rebound
(Special Features/Productronica 2009)

...y up to 40%. The SE500 can handle board sizes up to 410 x 410 mm and can measure components smaller than 01005. The newer SE500x can handle board sizes up to 810 x 610 mm. Europlacer launched the XP...

12. CyberOptics wins a 2009 Global Technology Award for its SE500™
(Industry News/World)

... paste inspection systems with industry-leading volume accuracy, the SE500 can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds. The...

13. Essemtec premiers new pick-and-place “Paraquda” at Productronica
(Products News/New Products)

...n simultaneously hold and measure four components. The range of components is vast ― it spans from 01005 resistors up to 100 mm square components, which can be up to 25 mm in height. The minimum...

14. Assembléon introduces high speed, high quality screen printer at Productronica
(Products News/New Products)

...hile maintaining high output, screen printers should be able to handle a wide mix of components, down to 01005, with small interspacing (down to 100µm). They should also adapt to PCB material trends s...

15. Machine Vision Products demonstrates the Supra Series 2D/3D Full AOI system at Productronica 2009
(Special Features/Productronica 2009)

...des full metrology and solder joint coverage. Resolutions between 7-17um provide capabilities to inspect 01005 components. The system is capable of a board handling of up to 508x508mm (20x20 inches) a...

16. Nihon Superior to Exhibit at SMTA Southeast Asia
(Special Features/SMTA South East Asia)

...-chip balling. SN100C P520 is a no-clean, lead-free solder paste optimized for chip components down to 01005 (0402 metric).  SN100C P520 ensures joint quality on densely populated boards with f...

17. AOI for the medium-sized company: Leveraging the crisis
(Industry News/Europe)

... everyday business. High resolution inspection is used only where required, such as in the inspection of 01005 components. The Integrated Verification is another example: this compact software modul...

18. Kentec Electronics Installs Europlacer’s iineo to Increase Capacity
(Industry News/Europe)

...ent,” said Dave.   Europlacer’s iineo I has a feeder capacity of 264 x 8mm, and can handle from 01005 through to 50 x 50mm devices, with the ability to hold an additional 10 full JEDEC-sized ...

19. S3088-III – The new, high-performance, economical AOI system from Viscom
(Special Features/Productronica 2009)

...r placement inspection. Thanks to the further improved positional accuracy, even the smallest defects on 01005 components are detected in high resolution mode with precise reliability. The revised ...

20. Gemini Data Loggers Invest in High Definition Inspection System from Europlacer
(Industry News/Europe)

...arno Magnus provides a magnification from 1.6-105X, allowing very detailed inspection of devices such as 01005 and fine-pitch devices. The Tagarno Magnus is available exclusively in the UK via Blak...

21. Union Four Electronics Ltd. Invests in Europlacer’s Targarno Magnus
(Industry News/Europe)

...it is possible to have magnification from 1.6-105X, allowing very detailed inspection of devices such as 01005 and fine-pitch devices. The Tagarno Magnus is available exclusively in the UK via Blake...

22. JUKI to highlight its latest line–up in Hall A3, Stand 143 of the Productronica exhibition
(Special Features/Productronica 2009)

... time. The chip shooter features a placement rate of 27,000 cph (IPC 9850), and a component range from 01005 to 20mm x 20 mm. Additionally, the system consistently has a placement accuracy of ±50µm ...

23. MVP demonstrates the new Supra–E AOI system at the SMTAI Electronics Exhibition 2009 in San Die
(Industry News/America)

...pixel camera and with Tri-Color illumination. Resolutions between 7-17um provide capabilities to inspect 01005 components down to solder joint level. The system is capable of a board handling of 508x5...

24. Herald Electronics decides on AOI System from GOEPEL electronics
(Industry News/Europe)

...tiCon BasicLine AOI system provided a solution that met all the criteria of Herald Electronics including 01005 and angled view inspection coupled with laser height measurement and system versatility”,...

25. Juki to Feature KE2080 at SMTAI 2009
(Industry News/America)

...on down to 1 mm, the KE-2080 is 25 percent more accurate than previous models capable of placing down to 01005 components. The KE-2080 introduces the Load Cell option that gives the machine the abil...

26. Cyberoptics to Launch ‘Larger Board’ Version of New SE500 System at Productronica 2009
(Special Features/Productronica 2009)

...ndustry-leading volume accuracy, the SE500 and larger board SE500X systems can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds. This g...

27. Nihon Superior to Highlight SN100C Products at SMTAI 2009
(Industry News/America)

...eliability no-clean lead-free solder paste optimized to deliver good reflow with chip components down to 01005 (0402 metric). SN100C P520 improves the joint quality of densely populated boards with fi...

28. Seika Machinery’s Michelle Ohigara to Co–Chair Presentation at SMTAI 2009
(Industry News/America)

... specification limit, not waiting until a process goes out of control. Micro packages such a 0201 and 01005s, lead-free solder, BGAs and other under-package I/O components all have confounded the i...

29. Kyzen’s Mike Bixenman to Present at Medical Electronics Symposium 2009
(Industry News/America)

...cleaning lead-free flux residues under low standoff components such as 1206, 0805, 0603, 0402, 0201, and 01005 chip cap resistors is highly difficult. The process window for removing lead-free flux re...

30. PCB Technology Ltd. Invests in Europlacer’s iineo
(Industry News/World)

...le placement accuracy     • Wide component range handling capability (including 01005)     • Rapid or minimum product changeover   &nbs...