1. Kester’s Peter Biocca to Present at SMTA Atlanta 2009
(Industry News/America)

...uilds were achieved with a 99.6 percent first pass yield for the overall soldering process.Kester’s Peter Biocca, along with Carlos Rivas of SMT Dynamics, will present a paper titled, “Case Study on t...

2. Kester to Participate in Technical Conference at APEX 2009
(Special Features/2009 IPC APEX EXPO™)

... solutions of metalization with papers on via fill and copper wrap.Kester is proud to announce that Peter Biocca and David Scheiner will hold a technical session titled “PCB Metalization” at the upcom...

3. 7.2 – Validation of SAC305 and SnCu–based solders at the contract assembler level
(Technical Articles/Lead-free)

This paper details the experience of one medium sized assembler set on achieving a customer–driven mandate to go lead–free for the assembly of high–end printer boards. This paper detai

4. 7.2 – February 2007
(Online Issues/Online Issues)

...ry 2007 The validation of SAC305 and SnCu–based solders at the contract assembler level by Peter Biocca, Carlos Rivas Process improvement with selective solder by John Weisheit, Tom Barnar...

5. China 6.2 – Mar/Apr 2006
(China Edition/China Editions)

...论龟与免RoHS最终期限要遵守 – Peter Biocca 空气中喷淋式清洗能力į...

6. 6.10 – Tin–copper based solder options for lead–free assembly
(Technical Articles/Lead-free)

Tin–silver–copper has received much publicity in recent years as the lead–free solder of choice.   Tin-silver-copper has received much publicity in recent years as the lead-free

7. 6.10 – Nov/Dec 2006
(Online Issues/Online Issues)

... systems by Jens Kokott Tin–copper based solder options for lead–free assembly by Peter Biocca Tin–copper based solder options for lead–free assembly by Peter Biocca .....

8. Kester to present at SWEPEX 2006
(Industry News/America)

On Wednesday, November 15 during the 8 to 11:30 a.m. session, Peter Biocca will present "Lead–free Assembly Materials and Processes – No Defects and Maintaining Yields" i

9. Kester presents at IPCWorks 2006
(Industry News/America)

Kester announces that Peter Biocca will present at IPCWorks 2006, scheduled to take place September 10 to 14, 2006, at the American Airlines Training and Conference Center in Fort Worth, Texas. Peter

10. Kester and Vitronics Soltec team to Host a Series of Free Lead–Free RoHS assembly seminars
(Industry News/America)

...80 or lstefanski@kester.com. For more information on the technical content of the seminars, contact Peter Biocca at (+1) 972-390-1197 or pbiocca@kester.com or Denis Barbini at (+1) 603-772-7778, ext. ...

11. 6.2 – February 2006
(Online Issues/Online Issues)

...s" by Clive Ashmore The turtle and the hare – beating the RoHS deadline anyway" by Peter Biocca "Developing the 01005 stencil printing process" by Joe Belemonte Technolo...

12. 6.2 – The turtle and the hare: beating the RoHS deadline anyway
(Technical Articles/Lead-free)

...ing magazine 6.2 - Feb 2006. Download the full article (free) in PDF format.     Peter Biocca is a Senior Market Development Engineer with Kester in Des Plaines, Illinois. He is a c...