1. International Wafer–Level Packaging Conference (IWLPC) Features Five Half–Day Tutorials
(Association News/North America)

...S - Products & Packages, Ken Gilleo, Ph.D., ET Trends LLC; Design for Wafer Level CSP Technology, Vern Solberg, Solberg Technical Consulting; Advanced Flip Chip Technology and Processing, Dan Bald...

2. Volunteers honored for contributions to IPC and Electronics Industry
(Association News/North America)

... Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation.     • Vern Solberg, Solberg Technical Consulting, for leadership of the 5-21g Flip Chip Mounting Strateg...

3. IPC honors volunteers for their contributions to IPC Stabdards and Program Development
(Association News/North America)

...ed Martin EPI Center; George Oxx, Flextronics International USA; Robert Rowland, RadiSys Corporation; Vern Solberg, Solberg Technical Consulting; Kristen Troxel, Hewlett-Packard Company; and Bob Willi...

4. IPC Midwest Covers Package to Board
(Association News/North America)

...ai Shagguan, VP of Flextronics, will talk about what EMS firms should know about the latest packages. Vern Solberg, a member of our Editorial Advisory Board and head of his consulting firm, will talk ...

5. Process and assembly methods for increased yield of PoP devices
(Technical Articles/Reliability)

...REFERENCES 1. Zhang, J., “Stress Free Modeling”, Global SMT & Packaging, April, 2006. 2. Solberg, J., et al., “Package on Package (POP) Process Development and Reliability Evaluation...

6. IPC to host numerous events in Asia
(Industry News/World)

...nology Workshops will take place June 7-8 in Singapore. The featured instructors will be Jack Fisher, Vern Solberg and John Lau. IPC/ CCLA Conference will take place from June 13-14 in Dalian and wi...

7. China 6.3 – May/June 2006
(China Edition/China Editions)

...35013;无铅焊接的质量认证测试 – Vern Solberg   目次 下载本期杂志PDF୭...

8. 6.6 – June/July 2006
(Online Issues/Online Issues)

Issue 6.6 / June/July 2006 Standardizing cleanliness criteria for fiber optic connectors cuts costs, improves quality by Tatiana Berdinskikh, Sun–Yuan Huang, Heather Tkalec, Douglas H. Wilso

9. 6.5 – May 2006
(Online Issues/Online Issues)

...ssue 6.5 / May 2006 "IC package qualification testing for lead–free soldering" by Vern Solberg "Thermal process optimization provides reduced energy consumption" by P...

10. 6.5 – IC package qualification testing for lead–free soldering
(Technical Articles/Components)

...l SMT & Packaging magazine 6.5 - May 2006. Download the full article (free) in PDF format. Vern Solberg is the senior applications engineer with Tessera. Vern has served the industry for mo...

11. Two industry veterans receive IPC’s 2005 Hall of Fame Award
(Association News/North America)

... Association Connecting Electronics Industries® honored Gene Weiner, Weiner & Associates, and Vern Solberg, Micro Electronic Engineering Services, with the 2005 Raymond E. Pritchard IPC Hall o...