1. Manncorp.com launches new turnkey section - Showcasing 7 complete SMT Assembly Systems
(Products News/New Products)

...ries pick-and-place machines. They feature latest Cognex® flying vision for chips down to 0201, CSPs, µBGAs, flip-chips and other components. Bottom vision is for larger components up to 150 x 100mm. ...

2. Etek Europe Confirms Sale of Trident III Automatic Defluxing System to CEM Union Four
(Industry News/Europe)

...e high or low volumes and prototypes. Facilities include fully automated surface mount - including BGA & Flip-Chip - Mixed technology assembly, as well as inspection and test. Etek Europe’s Mana...

3. IMEC’s ultra–low power actuator suitable for in–vivo biomedical applications
(Products News/New Products)

... a watertight encapsulation that does not hinder the movement of actuator and needle. The package includes a flip-chip mounted glass cap and hydrophobic surface treatment to prevent water ingress. A...

4. IMEC sets major step towards 3D integration of DRAM on logic
(Industry News/World)

...er the DRAM dies, and will test the fabricated 3D stack; two other partners, will package the 3D stack using flip-chip onto a FBGA (fine-pitch ball-grid array) substrate. “We are excited to achieve ...

5. Fast–curing mCD adhesives / Heat pulse process makes for curing in seconds
(Special Features/Productronica 2009)

The new adhesives accompanied by this new process are presented on the occasion of the Productronica in Munich.Faster production processes and the associated cost reductions are a competitive factor f

6. Asymtek Sells Spectrum™ S–910N Dispensing System to DancoTech
(Industry News/World)

...pment and production of microelectronic components with expertise in chip stacking, fine-pitch wire bonding, flip-chip and fine-line surface mount adhesive device applications. DancoTech works closely...

7. The new SIPLACE CA application: Die–bonding and SMD placement in a single machine
(Products News/New Products)

...se cooperation between the SIPLACE team and leading makers of electronic components. It processes dies (both flip-chip and die-attach) directly from the wafer, but it can also place conventional SMT c...

8. IPC’s Collegiate Challenge — Road to the Final … Three
(Special Features/2009 IPC APEX EXPO™)

...versity Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Gold Stud Bump Flip-Chip Attachment David Lee, Johns Hopkins University   Reliability of Standa...

9. The Hot Tickets in Vegas
(Special Features/2009 IPC APEX EXPO™)

...e or Convection Reflow Soldering for Lead-Free and Tin-Lead Assembly,     •  Lead-Free Flip-Chip Wafer-Level Packaging for 3-D System-in-Packages and PCB Assemblies,  &nbs...

10. Growing Applications of Flexible Circuit Technology Subject of IPC International Conference
(Association News/North America)

...ctroless copper deposition processes; flex circuit applications that require an ENIG finish; and assembly of flip-chip and SMT on flex. In-depth, half-day workshops will cover topics such as flexibl...

11. Manncorp Announces Its Own ‘Economic Stimulus Package’
(Industry News/America)

...exibility 4,000 cph MC384 pick-and-place machine, offering Cognex® vision for on-the-fly placement of 0201s, flip-chips, CSPs and µBGAs, and bottom vision for larger components to 38 x 38 mm, with fin...

12. 2008 International Wafer–Level Packaging Conference Delivers During Tough Times
(Association News/International)

...n with two-days of half-day tutorials on topics ranging from IC Packaging to Failure Modes & Analysis of Flip-Chip Assemblies given by leading instructors in the industry. The conference line-up...

13. Pac Tech held Grand Opening Celebration for their New Asian Facility
(Industry News/World)

... day of presentations on both business and technology trends within the packaging industry, including WLCSP, flip-chip, and 3D packaging. Over 200 people from around the world attended the symposium. ...

14. Nextreme Pumps Up with New OptoCooler High Voltage Series
(Products News/New Products)

...he ABA process decreases the size of Nextreme's thermal bumps to approximately 125 microns, which makes them flip-chip bumping compatible with standard solder bumping processes commonly used in electr...

15. Indium Corporation’s Dr. Andy Mackie Joins Chip Scale Review Editorial Board
(Industry News/America)

...l back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip, and wafer-level packaging market.   Indium Corporation is a premiere ma...

16. Pac Tech Asian Facility Grand Opening
(Industry News/Latest)

...lectroless Ni/Au under-bump metallization for copper and aluminum devices, solder-paste stencil printing for flip-chips, solder-ball placement for wafer-level CSPs down to 200µm ball diameters, and mi...

17. Pushing the barriers of wafer level device integration
(Technical Articles/Components)

... digital signal processors (DSPs), chipsets, graphics, memory and microprocessors are expanding their use of flip-chip packages. According to Techsearch’s Flip Chip and WLP: 2006 Market Update and Tec...

18. Asymtek Receives Two Awards for Product Excellence and Innovation at NEPCON China
(Industry News/World)

...ownership for high-volume microelectronics packaging and printed circuit board assembly applications such as flip-chip and ball grid array and chip scale packaging underfill.  Its integrated proc...

19. Case Study: Technology partnership for effective RFID system solutions
(Technical Articles/Materials)

...ue chain.  In order to allow easy, cost-saving and fast contacting of chips to different substrates, flip-chip technology is used for smart labels. The structured, active side of the semicondu...

20. Soldertec Global offers new ‘same day’ x–ray inspection service
(Industry News/World)

... has enabled solder joint inspection of hard-to-access areas, including underneath ball grid array (BGA) and flip-chip components. Missing, open, malformed and bridged BGA interconnections and misalig...

21. MG–1R and MG–8R pick & place redesign improves maintenance and reliability
(Products News/New Products)

...ts. High resolution vision systems recognize, dip-flux, and place even the smallest balls and tightest-pitch flip-chips. The M-Series is easy to maintain. All modules verify the correct condition o...

22. i2a Technologies relocates to new headquarters in Fremont, California
(Industry News/America)

...p; Key offerings include a vast selection of advanced packages, such as chip-scale packages (BGA, CSP, QFN); flip-chip packages (SIP, modules);  packages produced at the wafer level and a combina...

23. DEK – Hall A4, Stand 305
(Special Features/Productronica 2007)

...sembly convergence, Galaxy is engineered to handle advanced packaging challenges including wafer-level CSPs, flip-chip, uBGA and ultra-fine pitch SMT. This display will also highlight a selection of k...

24. Glenbrook Technologies – Hall A5, Stand 445
(Special Features/Productronica 2007)

...tems allow users to examine internal solder joints and bonds in advanced technology packages -- BGAs, µBGAs, flip-chips, ICs and other complex components -- that cannot be verified by visual inspectio...

25. Henkel to share materials expertise at upcoming IPC Midwest, SMTA International
(Industry News/World)

... notable Henkel researher, Renzhe Zhao, Ph.D. will deliver a presentation entitled “Lead-free Application of Flip-Chip Underfills“ on October 10th at 3:30 p.m.  Findings on the company’s work reg...

26. DEK invites visitors to ‘Expect More’ at Forum de l’Electronique 2007
(Industry News/Europe)

...or high accuracy mass imaging, Galaxy is engineered to handle packaging challenges such as wafer-level CSPs, flip-chip, uBGA and ultra-fine pitch SMT. Running alongside this demonstration, DEK will al...

27. Henkel launches new series of underfills for flip–chip applications
(Products News/New Products)

Hysol FP4581 is a high–purity, liquid epoxy encapsulant formulated specifically for the requirements of high–lead, bumped large die flip chip packages. Hysol FP4583 is for applications requi

28. Improved flip–chip adhesive process speed & temperature performance
(Products News/New Products)

...withstand rework. Dow Corning Corp. today introduced two new members of its family of lid-seal materials for flip-chip semiconductor packages. One offers a two-fold improvement in cure rate, and anoth...

29. Oleg Khaykin, COO of Amkor Technology, to present at IWLPC dinner
(Association News/North America)

...Khaykin joined Chandler, Ariz.-based Amkor in 2003 as executive vice president for corporate development and flip-chip operations. He spearheaded Amkor’s 2004 acquisition of Unitive Electronics and th...

30. IPC sponsors Singapore Lead–Free Issues and Solutions Workshop
(Industry News/World)

... on the lead-free critical issues and solutions of the most popular SMT packages such as PQFP, PBGA, CSP and flip-chip WLCSP. Topics to be covered during the course include critical issues/solutions...