1. Following a successful premiere: hybridica 2010 demonstrates future potential
(Industry News/Europe)

...f metals - i.e. stamping, shaping and surface treatment - in plastics processing - i.e. overmolding inserted parts, insert molding, outsert molding, back molding metals, media-tight ove...

2. Henkel Extends Die Attach Solder Paste Product Line, Adds Printable Formula to Popular Portfolio
(Products News/New Products)

...mpact of flux reliability evaluation programs for such critical elements as cleanability, wire bonding and molding, among others. Formulated for printing processes, Multicore DA101 is a flux system...

3. Plastronics Introduces ES Socket Solution
(Products News/New Products)

...anufacturing and marketing high-quality burn-in sockets. Through advanced product design, state-of-the-art molding and automated production, Plastronics has become the world leader in the reliability ...

4. Multi–Seals introduces M5–92 Epoxy Preforms designed for robust solvent resistance
(Products News/New Products)

... which allows the epoxy seals to withstand subsequent high-temperature manufacturing processes such as overmolding or soldering.  When M5-92 is used early in an assembly process, the highly resis...

5. Quik–Pak Names World Wide Sales Director
(Industry News/World)

...long with backgrinding, wafer dicing, die/wire bonding, laser micromachining, detector array processing, remolding and marking/branding. Custom assembly services are also offered for ceramic packages,...

6. Inovaxe Corp. Provides Enhanced Profitability through Improved Sources of Supply
(Industry News/World)

...ighly reliable sources for tooling and production of bare PCB fabrication, SMT stencils, plastic injection molding, blow molded plastic, aluminum and plastic extrusions, CNC machined parts, metal cast...

7. MaskTrack Pro® TeraPure system selected for Nano–Imprint Lithography at Dai Nippon Printing
(Industry News/World)

...production lines and is the only manufacturer globally to offer the complete range of products, mastering, molding and replication lines. In addition, to the further development of the core activ...

8. Quik–Pak Announces ITAR Registration
(Industry News/America)

...long with backgrinding, wafer dicing, die/wire bonding, laser micromachining, detector array processing, remolding and marking/branding. Custom assembly services are also offered for ceramic packages,...

9. IVAM Product Market "High–tech for Medical Devices" at COMPAMED/MEDICA
(Industry News/Europe)

...ions into their matrixes will also be shown. Due to the application of micro extrusion and micro injection molding, nearly every material can be processed and molded into complex geometries under seri...

10. Press–Fit Compliant Body Receptacles
(Products News/New Products)

...ring facility includes engineering, tooling, primary and secondary machining, stamping, plating, injection molding, and assembly. www.mill-max.com ...

11. High–Lead and Lead–Free Capable Multicore Die Attach Solder Paste
(Products News/New Products)

...mpact of flux reliability evaluation programs for such critical elements as cleanability, wire bonding and molding, among others. Though silver-based die attach adhesives or pure solder wire have h...

12. EV Group Unveils Next–Generation UV–Nanoimprint Lithography Step and Repeat System
(Products News/New Products)

...s the micro-optics arena, which utilizes master lenses to develop working stamps for full-wafer lens micro-molding of CMOS image sensors for wafer-level cameras, among others.  Augmenting traditi...

13. Dow Corning Electronics Announces New Silicone Encapsulant for Overmolding Process
(Products News/New Products)

...ion’s Electronics group introduced its newest silicone encapsulant, Dow Corning ®OE-6636, designed for overmolding (compression molding) and dispensing processes. The product provides for a high refra...

14. Plastinum Signs Sales Contract
(Industry News/Europe)

...old waste proves that mixed household plastic waste is recyclable and is ready to be used in the injection molding industry. Based on this new sales contract as well as on interest that has been expre...

15. AdTech Ceramics to exhibit at EMPC 2009 June 15–18, Rimini, Italy
(Industry News/World)

...nd LTCC materials. The 92% alumina base HTCC material can also be formed and metallized using an injection molding process for complex shape requirements. Chemical milling of materials, including Kova...

16. Fraunhofer IOF Selects EV Group UV–Nanoimprint Lithography (UV–NIL) System
(Industry News/World)

...tronic research efforts.  The Institute will be using the UV-NIL stepper for micro-lens mastering and molding for a host of micro-optics applications, including fiber optics and CMOS image sensor...

17. Mill–Max Expands its Line of Relay and Oscillator Sockets
(Products News/New Products)

...ring facility includes engineering, tooling, primary and secondary machining, stamping, plating, injection molding, and assembly. www.mill-max.com ...

18. Jabil Launches Single–Use Device Business at MD&M West 2009
(Industry News/America)

New Turnkey Outsourcing Offering Builds on More than 20 Years of Global Expertise in Plastics Molding and Medical Electronic Manufacturing ServicesAt MD&M West 2009, Jabil today announced the debu

19. Molex Introduces HD&S Interposer With Neoconix’s PCBeam Interconnect Technology
(Products News/New Products)

...etch-based manufacturing process allows excellent dimensional control compared to traditional stamping and molding, and the process is scalable to very fine feature sizes for space constrained applica...

20. Mill–Max Adds Surface Mount Transistor Sockets to its Line of TO–5 and TO–100 Through
(Products News/New Products)

...ring facility includes engineering, tooling, primary and secondary machining, stamping, plating, injection molding, and assembly. For more information, contact Robin D. Ritter, Marketing Coordinator...

21. Molded underfill process for the SiP
(Technical Articles/Materials)

... few companies have already tried to develop this process using one flip chip. In this application, we are molding three flip chips into the underfill process. The test vehicle consists of three 3.5 x...

22. High Performance Treatment Meets Sophisticated Monitoring and Control
(Products News/New Products)

...promoting adhesion for painting, bonding, casting, flocking, labeling, coating, marking, extruding and overmolding applications. Quality control is self regulated by a real time Plasma Integrity Monit...

23. Essemtec’s New Brochure Provides Information about LED Production and Processing
(Industry News/America)

... VARIO suits particularly well. With the RO VARIO, for example, SMD prints will be soldered, adhesives and molding compounds are cured and LEDs are soldered on special foils (e.g. polyester). The ne...

24. AdTech Ceramics to exhibit at Electronica 2008
(Special Features/Electronica 2008, Munich)

... or better. In addition the 92% alumina base HTCC material can be formed and metallized using an injection molding process for complex shape requirements. Chemical milling of materials, including Kova...

25. Join over 13,000 industry professionals @ GlobalTRONICS 2008
(Industry News/World)

... Testing & Measurement Equipment Active & Passive Components Contract Manufacturing, Plastic Molding, Metal Stamping & Precision Engineering Embedded Systems Solutions & Techno...

26. New Strategy for Printed Electronics
(Industry News/World)

...ble. “This is, for example, particularly important for plastic films that are shaped using the film insert molding process after the wiring diagram has been printed, and are then back-injected,” says ...

27. Challenging times ahead...
(Financials/Market Update)

... contract for Location Based Technologies’ PocketFinder. Jurong Technologies sold its plastic injection molding operations in Singapore, Malaysia and China to MAP Technology Holdings for $26.3 mill...

28. Amkor – Booth 7352
(Special Features/SEMICON West)

Amkor Technology, Inc. introduces a high–performance flip chip packaging technology using an advanced molding process technology that is expected to provide a number of design, cost and performan

29. Henkel – Booth 8311
(Special Features/SEMICON West)

...equipment or process steps, as paste dispensing is not required and curing takes place during the standard molding process. The materials leave no burrs after dicing, enable superior bondline thicknes...

30. Sonion Businesses to be Renamed Pulse
(Industry News/Latest)

...f Sonion’s product portfolio, the Pulse name will also represent expertise in microacoustics and precision molding and stamping.” “As part of Pulse, we look forward to joining 25,000 colleagues from...