1. Mfg Engineer
(Comments)

...because the scanning resolution is too low. Please rescan. http://content.yudu.com/Library/A14vqn/GlobalSMTPackaging93/resources/6.htm...

2. Nihon Superior’s Keith Sweatman to Present at TMS 2010
(Industry News/America)

...ttle. The presentation will be held during the session titled “Pb-Free Solders and Emerging Interconnect and Packaging Technologies: Microstructure, Intermetallics, Whisker (II),” which is scheduled t...

3. Metering Analog Front End (AFE) from Microchip Technology enables highly accurate measurements
(Products News/New Products)

...ble and low-cost utility metering applications, including energy, water, and gas and heat meters.   Packaging, pricing & availability The MCP3901 AFE is available in a 20-pin SSOP packa...

4. Acculogic to Feature Latest Testing Technologies at APEX 2010
(Special Features/IPC APEX EXPO™ 2010)

...d boundary scan test capability on all probes (top and bottom side). Shrinking component sizes and denser packaging technologies are posing new challenges to test. FLS980Dxi uses highly repeatable ...

5. Fixed Frequency Synthesizer: SFS6520A-LF Features Low Phase Noise
(Products News/New Products)

...industry standard PLL-V12N package measuring 0.60 in. x 0.60 in. x 0.13 in. It is available in tape and reel packaging for production requirements. The   SFS6520A-LF is also ideal for automa...

6. SMTA Issues SMTA International 2010 Call for Papers
(Association News/North America)

...ctronic industry's premier forum on the manufacture of electronic products utilizing surface mount, advanced packaging and related technologies, being held October 24-28, 2010 in Orlando, Florida. P...

7. Etek will be showcasing its leading products & services at the UK’s Southern Electronics Show 2010
(Special Features/Southern Electronics Show 2010)

...d name is synonymous with technology leadership in dispensing systems for surface mount electronics and chip packaging and assembly applications. ELECTROVERT is the worldwide leading producer of wave ...

8. New Hydrophilic PTFE Filters from Gore for High-Purity Chemical Processing
(Products News/New Products)

...uids, especially where outgassing or bubbles are a concern. Applications include high-throughput filling, packaging and recirculation systems. Gore membrane filtration technology has been used fo...

9. TechSearch International Provides Market Forecast for 3D TSV Adoption
(Industry News/World)

...tional, Inc., founded in 1987, is a market research firm specializing in technology trends, microelectronics packaging and assembly.  Research topics include flip chip, WLPs, CSPs, BGAs, SiPs, 3D...

10. 8-pin microcontroller features 3.5 kB self-programmable flash memory
(Products News/New Products)

...ore information on Microchip development tools is available at http://www.microchip.com/get/KWWH.   Packaging & Availability   The new PIC12F617 MCU is available in 8-pin PDIP, S...

11. SMTA Announces International Wafer-Level Packaging Conference (IWLPC) Call for Papers
(Association News/North America)

...cale Review magazine, is pleased to release the Call for Papers for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC) to be held October 11-14, 2010 at the ...

12. New Zero-Insertion-Force (ZIF) High Speed Connector
(Products News/New Products)

...h standards while at the same time having an attractive price. The connector is delivered in tape & reel packaging. Apart from this version of the High Speed ZIF connector Yamaichi Electronic...

13. VCO: CRO2660B-LF Features Low Phase Noise
(Products News/New Products)

...in Z-Comm's standard MINI-16 package measuring 0.5 in. x 0.5 in. x 0.22 in. It is available in tape and reel packaging for production requirements. The CRO2660B-LF is also ideal for automated surface ...

14. Meeting the Technical and Regulatory Challenges of Global Environmental Legislation
(Technical Articles/Business)

...te. In the USA, iNEMI had been running a halogen-free PCB laminate project since 2006. The High Density User Packaging Group (HDPUG) with a membership drawn from many of the major global players from ...

15. Functional Printing Enables Next Wave of Mass Produced Electronic Goods
(Industry News/Europe)

..., e-readers, flat batteries, RFID tags, sensors and actuators for ambient intelligence in textiles and smart packaging, even low-cost electronic gadgets suited for one-time use - easily integrate...

16. Southern Electronics 2010: Real world solutions for the real world of business
(Special Features/Southern Electronics Show 2010)

...th these essentials, today's electronics professional also has to be concerned with mechanical sub-assembly, packaging, testing and finishing. Add to that the need to stay aware of topics like changin...

17. SUSS MicroTec Expands Activities in Wafer-Level Camera Applications
(Industry News/World)

...ces. With this project SUSS MicroTec expands its activities as an equipment supplier supporting image sensor packaging and wafer-level camera manufacturing processes. Wafer-level camera technology i...

18. More than 500 exhibitors expected at SMT/HYBRID/PACKAGING 2010
(Special Features/SMT/HYBRID/PACKAGING 2010)

...l have the chance to present their latest products and solutions to an estimated 23,000 visitors. SMT/HYBRID/PACKAGING 2010 System Integration in Micro Electronics International Trade Fair and Con...

19. New Trends in Printed Electronics
(Industry News/Europe)

...d more unique.   End users will be there in force with everything from printed solar bags to smart packaging and contactless railway tickets. There is a surge in new products and technologie...

20. UP Media Group Issues Call For Papers For PCB West 2010
(Industry News/America)

...ally how they affect design and fabrication); environmental legislation (REACH, RoHS, etc.) and its effects; packaging design; mixed-signal design; area arrays; FPGA design and implementation; embedde...

21. VCO: V624ME05-LF Features Low Phase Noise
(Products News/New Products)

... Z-Comm's standard MINI-16-L package measuring 0.5 in. x 0.5 in. x 0.13 in. It is available in tape and reel packaging for production requirements. The V624ME05-LF is also ideal for automated surface ...

22. SMTA International Conference on Soldering and Reliability Call for Papers
(Association News/North America)

...bsp;   Manufacturing Process     Package on Package     Advanced Packaging     Halogen-Free Laminates     High Density Int...

23. FCT Assembly Appoints ARK Manufacturing Solutions, LLC
(Industry News/America)

...rn Nevada, and Sonora, Mexico. The company specializes in the fields of microelectronics, SMT and electronic packaging. ARK Manufacturing Solutions, LLC works with manufacturers of electronic materi...

24. STI Electronics Becomes ISO14644-1:1999 Certified
(Industry News/America)

...ponent/Die Technology called IC/DT® that also will benefit from the increase in cleanroom size. STI’s IC/DT® packaging technology is a more reliable alternative to SMT to meet size, weight, and power ...

25. DEK launches new VectorGuard® Double Layer Platinum stencil
(Products News/New Products)

... diminishing stencil strength. In addition, the system incorporates numerous advantages for microelectronics packaging specialists. Ideal for multi-layer technologies such as Low Temperature Co-fired ...

26. Low Maintenance Poppet Valve Introduced by Tridak™ for Precision Fluid Dispensing
(Products News/New Products)

...tures a complete line of precision dispense valves, electro-pneumatic dispensers and controllers, disposable packaging, and complete dispensing and filling systems for industrial assembly and packagin...

27. R&D Technical Services Appoints ARK Manufacturing Solutions, LLC
(Industry News/America)

...rn Nevada, and Sonora, Mexico. The company specializes in the fields of microelectronics, SMT and electronic packaging. ARK Manufacturing Solutions, LLC works with manufacturers of electronic materi...

28. Panasonic Factory Solutions Company of America adds six sigma black belt to its credentials
(Industry News/America)

..., software and technical support, provides total business systems solutions for electronic semiconductor and packaging companies in the global marketplace through one provider. Panasonic Factory Solut...

29. Cookson Electronics Alpha® appoints new Global Business Manager for Stencils
(Industry News/World)

..., Bar Solder, Cored Wire Solder, Wave Soldering Fluxes, and SMD Adhesives. Cookson Electronics Semiconductor Packaging is the leader in EMC and polymeric materials for semiconductor packaging. Cooks...

30. VCO: ZRO2407A1LF Features Low Phase Noise
(Products News/New Products)

...Z-Comm's standard MINI-16-SM package measuring 0.5 in. x 0.5 in. x 0.22 in. It is available in tape and reel packaging for production requirements. The ZRO2407A1LF is also ideal for automated surface ...