1. Solder void in SMT components
(Comments)

I'd like to know what is the size allowed for solder voids in a SMD components? and what is the standar explain it? because in the IPC 610-D only the section 5.2.2 is writen it but in a simple way.

2. Mil/Aero Reliability Inspection for Latent Defects
(Industry News/Latest)

...dentify and analyze internal anomalies that can cause electrical failures in service, such as die attach voids in a hybrid device or singulation cracks in a capacitor. Sonoscan has publicly announced ...

3. Stencil cleaning options and board wash-offs
(Regular Columns/Columns - Bob Willis)

...Running test prints on test boards or printing onto a mylar sheet or low tack film applied to a board avoids unnecessary cleaning. Many of the printed board surface finishes are affected by cleanin...

4. Guidelines for establishing a lead-free wave soldering process for high-reliability
(Technical Articles/Wave soldering)

... about reliability, but solder joint appearance also raises many questions. Dull appearance, shrinkage voids and hot tears are all contrary to traditional tin-lead solder joint inspection, but surf...

5. Assembléon shows its new Smart Solutions at APEX 2010
(Industry News/America)

...ray feeding speed. With the increasing unbalance between tray and tape components, the new tray trolley avoids tray components being a production line bottleneck. www.assembleon.com ...

6. SMT Prototype Production On High Quality Level
(Industry News/World)

...ty and provides intelligent feeders for quick changeover. The barcode-based feeder setup control system avoids wrong component setups, an important feature for sensitive industries such as medical or ...

7. High-Tech Conversions Highlights GREEN MONSTER! Stencil Wiping Fabric
(Products News/New Products)

...l wiping fabric. GREEN MONSTER! is ESD-safe, preventing ESD events that could damage components, cause voids in solder traces and possible explosions in the presence of flammable solvent vapors. The...

8. Henkel Extends Die Attach Solder Paste Product Line, Adds Printable Formula to Popular Portfolio
(Products News/New Products)

... industry has generally accepted void percentages that range from 10% to 20%, Henkel believes that fewer voids mean stronger interconnects, improved thermal conductivity and, therefore, has engineered...

9. Essemtec premiers new pick-and-place “Paraquda” at Productronica
(Products News/New Products)

... it actively prevents wrong user input. Eplace also offers an integrated quality management system that avoids set-up errors and costly repairs. As an additional benefit, the system can be opera...

10. Essemtec acquires rights for fully automatic SMD component storage system
(Products News/New Products)

...ed based on the consumption data delivered by the pick-and-place machine. Such a fully automatic system avoids costly human errors. For storing sensitive components, a drying unit can be integrat...

11. A hotmelt for ice–cold calculators
(Products News/New Products)

...ased, improving the overall service lifetime of the systems involved. Using Technomelt Supra Cool 130 avoids the problem of clogged modules and blocked nozzles, again reducing machine and equipment ...

12. Abatek gets approval for SMD silicone entry keys
(Industry News/World)

...ons were met regarding solder meniscus and IMC thickness. The IPC standards were also met with regard to voids, such as the X-ray inspection showed. With the final test report the SMD silicone entry...

13. Rutronik presents Flexible Circuit Connector Family from FCI
(Products News/New Products)

... is available at distributor Rutronik now. The ZIF cable insertion design prevents cable buckling and avoids excessive scraping of contact surfaces, which provides for the VLP series' 20 high number...

14. Spartanics Flexible Combination Roll/Sheet–Fed Laser Die Cutting Machine Now Available Worldwid
(Products News/New Products)

...ciencies. You’re able to follow market opportunities where you find them - using tool-free cutting that avoids delays and costs for tools.” Like all Spartanics Laser Die Cutting machines, the Combi...

15. High–Tech Conversions’ GREEN MONSTER Is Both Tough and Green on PCBs
(Products News/New Products)

...bsp;                Figure 3: Voids to fill www.high-techconversions.com ...

16. BGA, Land Grid Array and Stack Package Design and Assembly Seminar
(Industry News/Europe)

...are just a few. All LGA/QFN packages suffer from voiding, how does solder mask reduce voiding and how do voids impact on package standoff height and alternately reliability and thermal performance? ...

17. High–Lead and Lead–Free Capable Multicore Die Attach Solder Paste
(Products News/New Products)

... industry has generally accepted void percentages that range from 10% to 20%, Henkel believes that fewer voids mean stronger interconnects, improved thermal conductivity and, therefore, has engineered...

18. Vantage Solder Saver from Contax
(Industry News/Europe)

...are then ready for easy collection and safe disposal. “Solder Saver can be utilised at any time which avoids lengthy and costly operator delays whilst the recycling operation takes place” said Bob T...

19. Course provides skills essential for Advanced SMT reworking
(Industry News/Europe)

...l be placed on the diagnosis of faults that may occur when reworking this range of components, including voids, shorts, insufficient and excessive solder, de-wetting, non-wetting and misplacement. P...

20. Ball Grid Array, Land Grid Array and Stack Package Design and Assembly Seminar
(Association News/Europe)

...are just a few. All LGA/QFN packages suffer from voiding, how does solder mask reduce voiding and how do voids impact on package standoff height and alternately reliability and thermal performance? ...

21. Multicore LF700 Solder Paste from Henkel Offers Exceptional Lead–free, Halide–free Perform
(Products News/New Products)

...e formulations is solder joint voiding.  Through its unique flux chemistry, Multicore LF700 reduces voids in BGA solder joints, delivering higher reliability and outstanding in-field performance....

22. Assembléon’s true capacity on demand program solves today’s dynamics in electronics manufa
(Industry News/World)

Assembléon’s True Capacity on Demand program is exclusive to the company, and is possible because of the uniquely modular design of its flagship A–Series Pick & Place machines.Roy

23. DfR Solutions Chosen to Develop Printed Circuit Board Plating QC Standards
(Industry News/World)

...PCB quality and reliability issues. DfR Solutions will determine the severity of the defects (plating voids, insufficient plating thickness, etc.) and their impact on the reliability of the PCB by ...

24. Essemtec AG Opens Essemtec Benelux
(Industry News/World)

...utomatically recognized by the machine to eliminate programming time. A bar code-based set-up procedure avoids wrong loaded parts and ensures the highest possible quality level. Besides this, the inte...

25. LPKF Laser & Electronics Winner of SMT Vision Award
(Industry News/America)

... material. By utilizing its unique integrated UV laser technology the system’s non-contact depaneling avoids damage to small sensitive components. With its innovative features the ProtoLaser U will ...

26. VAC645 – The new compact vacuum vapour phase soldering system
(Products News/New Products)

...ned soaking profile before the vacuum process is an advantage as it can also help reduce the creation of voids. The key factor of the IBL vacuum soldering technology is the location of the vacuum ch...

27. Artisan announces Artisan Workbench
(Products News/New Products)

...up with only a few simple steps required to define a new project, and built-in configuration management avoids the need for third-party tools for item check-in and check-out and enabling Artisan Workb...

28. 9.2 – February 2009
(Online Issues/Online Issues)

...train gage testing: the delta effect of thermal cycle testing by Mark T. McMeen Resolution of solder voids in pin–in–hole product by Condia Yu, Eddie W. W. Tang, Jack To, Ka Wai Chan, B...

29. Enthone Introduces OrmeSTAR™ Ultra Nanofinish®, Organic Metal–based PWB Final Finish
(Products News/New Products)

OrmeSTAR Ultra bonds with copper without a displacement reaction, ensuring long bath life, no microvoids, and no solder mask interface attack.Enthone Inc., a business of Cookson Electronics, has intro

30. Rehm Thermal Systems to Showcase New Vacuum Vapor Phase Reflow Technology at Internepcon Japan
(Industry News/World)

...o a vacuum, enabling the escape of remaining residues and gas inclusions which would otherwise result in voids in the solidified joint.  In many cases this delivers solder joints with surface con...