2008 SMT HYBRID PACKAGING
SMT/HYBRID/PACKAGING 2008 takes place June 3rd - 5th at Messezentrum Nuremberg in Nuremberg, Germany and features the industry's leading companies on system integration in micro electronics, including modern production, electronic systems, design and development, components, PCB, test systems, packaging and basis materials, machinery, apparatus, automobile engineering, information and communication technology, Advanced Packaging, ASICs, automatic placement machines, BGAs, Board Design, CAE, FPGAs, hybrids, soldering, MCM, PCBs, test, screen printing, SMD / SMT, test equipment, materials and more.
The 2007 event featured nearly exhibitors/partners and more than 24,000 visitors.
From design and development to PCB production, components, packaging and test systems - SMT/HYBRID/PACKAGING offers a comprehensive and compact presentation of products all under one roof!
More information can be found on the exhibition's website.
Global SMT & Packaging presents a preview of some of the technology that will be on display:
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Aqueous Technologies Corp. will introduce the Trident, its fourth-generation automatic defluxing system, in distributor SYSTRONIC stand.
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The new MC-12 packs up to 120 feeders into a machine just 1.25 m long and 1.44 m wide. |
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BPM Microsystems will display its latest Flashstream automated programming technology, the 3000FS. |
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BTU International, supplier of advanced thermal processing equipment
for the alternative energy and electronics manufacturing markets, will
feature the new Pyramax 75A.
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CeTaQ GmbH is to launch two new advanced services and demonstrate the CmController5 Compact (CmC5 Compact) measurement and analysis tool. |
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Balver Zinn, provider of high-quality anodes with various alloys as well as soft solders and special wires, and Cobar BV, a member of the Balver Zinn Group, will introduce its new XF3 lead-free solder paste. |
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CyberOptics Corporation will showcase its Flex HR automated optical inspection system (AOI), in distributor GPS Technologies GmbH stand. |
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ECD’s award winning MEGAM.O.L.E.®20 thermal profiler and MEGAM.O.L.E.®MAP software will be featured.
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Essemtec announces it has further enhanced its successful SMT placement equipment FLX series, and designated machines in the series FLX2011, FLX2021 and FLX2031 have become faster and even more precise. |
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Europlacer, a designer and manufacturer of comprehensive SMT placement
systems for the global electronics industry, will display its brand new
iineo SMT platform, the iineo single head configuration, 8 nozzle
machine.
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The iineo platform features many improvements to the Europlacer machine range such as a higher feeder count, increased board size and increased maximum component height. |
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The electronics group of Henkel
SMTA International
Booth # 806 |
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As a highlight of 2008, at the SMT Hybrid in Nuremberg, the most important fair in Europe, JUKI will present its latest developments. |
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A newly formulated hot melt resin (SH 33800) as well as a dispensing machine for it has been developed by KC-Produkte, Germany |
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KIC will showcase KIC Explorer, a new generation of thermal profiler in distributor Multi-Components’ stand. |
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Kyzen Corporation will introduce AQUANOX® A4651US Low pH Ultrasonic Immersion Cleaner. |
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Ovation Products will showcase the High Density (HD) Grid-Lok automated tooling system in distributor BEN TECHNOLOGIES Stand 8-413B.
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PBT Rožnov p.R. s.r.o., manufacturer of high-tech cleaning system for fine cleaning in electronics, is introducing a new revolutionary cleaning system Super SWASH that succeeds a successful model SWASH. |
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nanofocus® X-ray tube technology provides sub-micron resolution in x-ray inspection and 3D computed tomography (CT), thus creating leading future technologies for the non-destructive inspection of IC packages. |
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Practical Components, international distributor of mechanical IC samples, or 'dummy' components, and SMD production tools and equipment will showcase the Amkor Technology dummy components in distributor booth AAT Aston GmbH. |
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