 Werner Engelmaier has
over 39 years experience in electronic packaging and interconnection
technology. Known as "Mr. Reliability" in the industry, he is the
president of Engelmaier Associates, L.C., a firm providing consulting
services on reliability, manufacturing and processing aspects of
electronic packaging and interconnection technology. He is the chairman
of the IPC Main Committee on Product Reliability. He was elected into
the IPC Hall of Fame 2003, and was awarded the IPC President's Award in
1996 and the IEPS Electronic Packaging Achievement Award in 1987. He
also was named a Bell Telephone Laboratories Distinguished Member of
Technical Staff in 1986 and an IMAPS Fellow in 1996. More information
is available at www.engelmaier.com, and he can be reached at
engelmaier@aol.com.
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Written by Werner Engelmaier
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Thursday, 24 July 2008 |
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A real reliability issue with lead-free solders. |
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Written by Werner Engelmaier
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Monday, 03 December 2007 |
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In the last two reliability columns, I presented all the models and equations necessary to estimate the reliability of the solder attachments of the various components, individually and collectively, making up an electronic assembly, and illustrated their use on hand of a numerical example. |
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Written by Werner Engelmaier
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Wednesday, 07 November 2007 |
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So, how does one estimate the reliability of solder attachments in an electronic system—a numerical example. |
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Written by Werner Engelmaier
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Friday, 12 October 2007 |
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When I wrote some recent columns on solder joint reliability, I found to my embarrassment and chagrin that in all the years I have been writing this reliability column, I have never addressed the issue of creep-fatigue modeling for solders to estimate their fatigue life for product in the field. |
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Written by Werner Engelmaier
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Thursday, 16 August 2007 |
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When I started this column, it was meant as a one-part treatment, but it grew so much it needed to be split into two. |
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Written by Werner Engelmaier
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Friday, 27 July 2007 |
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With SnPb-solders we always had the option of using higher melting solders for non-melting, non-collapsing solder balls and columns; that option is gone in a Pb-free world…or is it? |
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Written by Werner Engelmaier
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Thursday, 28 June 2007 |
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While some product geometries lend themselves to simple modeling using closed-form solutions, other more complex situations can only be attempted using finite element analysis (FEA). |
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Written by Werner Engelmaier
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Wednesday, 14 February 2007 |
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My original column on this topic, “How to specify reliable PCBs for lead-free solder assembly”, appeared in the September 2006 [GSMT&P 6.08] issue. |
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Written by Global SMT & Packaging
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Tuesday, 12 December 2006 |
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It appears that the threat posed by lead-free soldering to the reliability of the interconnect structures of printed circuit boards (PCBs) is perhaps more significant than the as yet not fully understood threat to the reliability of the solder joints themselves. |
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Written by Walt & Jon Custer
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Friday, 01 December 2006 |
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Thanks to higher interest rates and other inflation-controlling efforts the world’s economies appear to be heading toward a ‘soft landing’ in 2007 |
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