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Regular Columnist Joe Fjelstad

Joseph Fjelstad, co-founder and CEO of SiliconPipe is an author and innovator in electronics interconnection technology having numerous books and articles and more than 170 issued or pending US patents. His most recent book, the 3rd edition of Flexible Circuit Technology, is available in soft copy for free at www.FlexibleCircuitTechnology.com. Email jfjelstad@siliconpipe.com



Dropping in on the world of mechanical shock testing PDF Print E-mail
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Written by Joe Fjelstad   
Thursday, 14 August 2008
The brave new lead-free world of electronics assembly has cast a dark shadow over the electronics industry, especially in the realm of electronics reliability.
 
Are we there yet? PDF Print E-mail
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Written by Joe Fjelstad   
Tuesday, 08 July 2008

The ongoing journey to co-design of chip, package and substrate.

 
Change in the electronics industry – slow but inevitable PDF Print E-mail
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Written by Joe Fjelstad   
Monday, 09 June 2008

Approaching four decades of working in the electronics interconnection industry, it appears to this observer that, when looking back over all those years, the electronics interconnection manufacturing industry has been on a treadmill of sorts and changing ever so slowly.

 
"REACH for the sky…" PDF Print E-mail
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Written by Global SMT & Packaging   
Wednesday, 14 May 2008
Will the latest bit of environmental legislation be a hold up?
 
A brief history of embedded device technology PDF Print E-mail
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Written by Joe Fjelstad   
Wednesday, 09 April 2008

Electronics manufacturing technology has evolved slowly since its beginnings. 

 
New finish off to a nice start PDF Print E-mail
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Written by Joe Fjelstad   
Monday, 17 March 2008

Soldering in the legislatively imposed era of lead-free solder has resulted in some significant challenges being thrust upon the electronics assembly industry.

 
Wire bonding process for bonding over active circuits and low K materials PDF Print E-mail
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Written by Joe Fjelstad   
Friday, 04 January 2008
In the process of designing, manufacturing and assembling semiconductor chips, there has been a long standing and well established convention that wire bond pads are placed at the periphery of the die to make the wire bonding process easier.
 
Occam update PDF Print E-mail
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Written by Joe Fjelstad   
Monday, 03 December 2007

Since the introduction of the Occam Process on August 1st of this year on, there has been a groundswell of interest in the concept from around the world.

 
7.10 - Managing technological change PDF Print E-mail
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Written by Joe Fjelstad   
Wednesday, 07 November 2007

Executing change, especially technological change, is one of the most difficult activities a manufacturer can engage in.

 
7.9 - Treasure trove of information awaits IC packaging engineers PDF Print E-mail
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Written by Joe Fjelstad, Paul Wesling   
Friday, 12 October 2007

The IEEE is one of the most respected and relevant technical societies in the world today.

 
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