Dr. Dongkai Shangguan,
Senior Director for Advanced Assembly and Environmental Technologies,
Flextronics Corporate Technology Group, San Jose, CA, USA,
Dongkai.Shangguan@Flextronics.com.
For lead-free solder alloys, based on considerations for toxicity, cost and availability, manufacturability, and metallurgical, chemical, physical and mechanical properties, the worldwide industry has converged on to the Sn-Ag-Cu (SAC) eutectic alloy, based on earlier recommendation by iNEMI.
As we enter the post-July 1, 2006 era, most of the large PCBA factories in the world are running lead-free soldering. However, challenges remain, and process optimization is essential, particularly for soldering and rework of large, thick boards.
In today’s business environment, firms no longer compete on the possession of capitals and tangible resources. Instead, competition in the industry centers around technologies, capabilities, ‘know hows’.
Depending on how liberal one is in their definition of what a wafer
level package is, the technology is either entering its second, third
or perhaps even its fourth or fifth decade of use.
Dr. Dongkai Shangguan,
Senior Director for Advanced Assembly and Environmental Technologies,
Flextronics Corporate Technology Group, San Jose, CA, USA,
