In November 2006, I was honored to be elected a Distinguished Lecturer by the IEEE CPMT Society.

For lead–free solder alloys, based on considerations for toxicity, cost and availability, manufacturability, and metallurgical, chemical, physical and mechanical properties, the worldwide industry has converged on to the Sn–Ag–Cu (SAC) eutectic alloy, based on earlier recommendation by iNEMI.

As we enter the post–July 1, 2006 era, most of the large PCBA factories in the world are running lead–free soldering. However, challenges remain, and process optimization is essential, particularly for soldering and rework of large, thick boards. 

In today’s business environment, firms no longer compete on the possession of capitals and tangible resources. Instead, competition in the industry centers around technologies, capabilities, ‘know hows’.