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Regular Columnist Bob Willis

Bob Willis is a process engineer providing engineering support in conventional and surface mount assembly processes.

He runs production lines for suppliers at exhibitions and also provides seminar and workshops world wide. Bob has one of the largest collection of training videos, interactive CD-ROMs and training material in the industry.

Email: bob@leadfreesoldering.com

http://www.leadfreesoldering.com



Ball grid array & lead-free assembly defects, part 2 PDF Print E-mail
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Written by Bob Willis   
Thursday, 31 July 2008

Over the last few years I have been asked to examine many different ball grid array (BGA) defects from assembly and on field failures here are a selection of the defects and some of the popular causes.

 
Ball grid array & lead-free assembly defects, part 1 PDF Print E-mail
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Written by Bob Willis   
Monday, 16 June 2008

Over the last few years I have been asked to examine many different ball grid array (BGA) defects from assembly and on field failures here are a selection of the defects and some of the popular causes.

 
Static control - Training is still the key to success PDF Print E-mail
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Written by Global SMT & Packaging   
Wednesday, 21 May 2008
The electronics industry is continually faced with problems that take time and money to solve. Many of the problems are by no means new. Possibly they may be areas that were not considered important.
 
BGA & stack packages - making dummy parts PDF Print E-mail
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Written by Bob Willis   
Monday, 21 April 2008


Ball Grid Array BGAs are a widely used technology in a vast range of products, including consumer, telecommunications and office-based systems.

 
Practical selection/problems for SMT adhesives PDF Print E-mail
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Written by Bob Willis   
Monday, 17 March 2008

Surface mount technology (SMT) first started with the introduction of mixed technology designs incorporating components mounted on the underside of the circuit board.  

 
Identification of assembly and soldering defects today – history tomorrow PDF Print E-mail
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Written by Bob Willis   
Tuesday, 12 February 2008

How often have you solved assembly and soldering problems only to have them come back to haunt you in six months’ time?

 
Printing using micro stencils for LGA/QFN rework PDF Print E-mail
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Written by Bob Willis   
Friday, 04 January 2008
If you are repairing land grid array (LGA) or area array devices, should you print the circuit board or the device terminations?
 
Defect Troubleshooter: As good as the information provided PDF Print E-mail
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Written by Bob Willis   
Monday, 03 December 2007

If you find yourself with a component, printed board or soldering problem, our “Defect TroubleShooter Service” can help you solve you problems FREE.

 
7.10 - Bob Willis' top ten reference books, plus new lead-free reviews PDF Print E-mail
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Written by Bob Willis   
Wednesday, 07 November 2007

During Productronica we will be offering free advice on production problems and specification issues and solutions on testing. Just bring your problem board assemblies and let us take a look for you.

 
7.9 - Testing for RoHS compliance in production PDF Print E-mail
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Written by Bob Wilis   
Friday, 12 October 2007

X-ray fluorescence (XRF) systems can be used in production for RoHS compliance.

 
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