Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

Normaly connectors in pin-in-hole intrusive reflow have the greatest impact on reflow delta T because they are BIG, so what happens with a higher reflow temperature with tin/copper solder paste?

As many engineers and rework staff know, there are a wide range of techniques for replacing BGA components on a board assembly.

During the soldering operation, copper is dissolved by tin to form a tin/copper intermetallic, and the amount dissolved is dependent on the soldering process, solder alloy, surfaces to be joined, temperature, time and solder flow rate.

Shear force measurement is a common and quick way of destructively assessing solder joints and complement pull strength measurements.

There is definitely an increasing interest in conformal coating for electronics.

In an ideal world, components would only be purchased from the original producer, a franchised distributor or an approved non–franchised source.

There are two types of solder balls generally seen after wave soldering.

In any process there are always opportunities to improve, reduce the number of process stages or reduce the cost of manufacture.

Vapour phase soldering (VPS) has been around in the industry for many years and was one of the only two serious options during the early introduction of surface mount technology.