Regional Sites

Brazil
China
India
Japan
Korea
Mexico

Industry Blogs

Top blogs

Regular Columnist Alan Rae

Alan Rae is VP of Market and Business Development at NanoDynamics Inc., developers of practical and commercial applications for nanotechnology. From 1999 to 2004 he was VP of Technology for Cookson Electronics, involved in developing business opportunities for materials systems and equipment in silicon wafer fabrication, packaging, circuit board manufacture, circuit board assembly and recycling. He is Director of Research for iNEMI Inc. (the International Electronics Manufacturing Initiative), Chair of the JISSO North America Committee (facilitating electronics business worldwide by harmonizing technology roadmaps and standards), and a member of the Industrial Advisory Board of SMTA (the Surface Mount Technology Association). Dr. Rae holds an Honors Bachelor's Degree in Chemistry from the University of Aberdeen and a Ph.D. in Engineering Materials and M.B.A. in Business Administration from t! he University of Newcastle upon Tyne.



6.5 – Surfacing lead–free issues in North America and Asia PDF Print E-mail
User Rating: / 0
Written by Alan Rae   
Thursday, 01 June 2006

I still can’t escape from lead–free! Having spent 5 intense years at Cookson Electronics on the key materials transitions I now find myself coming at it from another direction – how can we use nanomaterials to improve some of the processing issues?  

 
6.2 – Which nanodevices will replace silicon? PDF Print E-mail
User Rating: / 0
Written by Alan Rae   
Wednesday, 01 February 2006
Roadmaps are a really good tool for pacing the evolution of a well–developed technology into the future and identifying gaps and challenges to its future development.
 

Related Items

Featured Interview

Interview - Terry Heilman, Sunstone Circuits
Trevor Galbraith spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.
 

Small Matters

IC Packaging Technology Retrospective – Part 4

The electronics industry’s mantra has for many years been "Smaller, Faster, Lighter, Better and Cheaper."

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff