This article describes a study recently conducted by Zestron for better
understanding the risks of cleaning lead-free and lead-containing
assemblies together in a single process.
Electronic assembly cleaning processes are becoming increasingly more
complex because of global environmental mandates and customer-driven
product performance requirements.
Written by Sheila Hamilton, Technical Director, Teknek
Wednesday, 25 June 2008
Presenting the contamination analysis in this way makes it immediately obvious where housekeeping procedures or manufacturing protocols need to be increased or changed within the department.
Written by Hunter Paterson, Product Manager, Teknek
Tuesday, 24 June 2008
Research has shown that 80% of contaminants are introduced in to a “clean area” by people and products, 15% is generated by the products themselves and 5% is actually produced by the room and filtration system.
Written by Mike Bixenman, Erik Miller and Fernando Rueda
Wednesday, 07 February 2007
When industry announced the intention to eliminate lead (Pb) from the soldering process, a number of experiments were performed to test the cleaning efficacy of Pb-free soldering materials.
There are several steps in determining IF and HOW to implement a de-fluxing strategy. Lead-free soldering and reflow environments mandate a more critical de-fluxing due-diligence process.
The transition to lead-free solder technology presents a long list of challenges for the manufacturing shop floor engineers, and that list includes an array of cleaning challenges.
Jeff Timms, president of Microscan since 2007, has been focusing these
past two years on bringing the company to the forefront of the
precision data acquisition and control solutions industry.
Electronic assembly cleaning processes are becoming increasingly more
complex because of global environmental mandates and customer-driven
product performance requirements. 
Presenting the contamination analysis in this way makes it immediately obvious where housekeeping procedures or manufacturing protocols need to be increased or changed within the department. 
Research has shown that 80% of contaminants are introduced in to a “clean area” by people and products, 15% is generated by the products themselves and 5% is actually produced by the room and filtration system. 
Innovative electronic assembly designs strive to increase functionality over smaller surface areas. Highly dense circuit assembly designs increase the cleaning challenge. 
When industry announced the intention to eliminate lead (Pb) from the soldering process, a number of experiments were performed to test the cleaning efficacy of Pb-free soldering materials.
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