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Written by Dipl. Ing. Stefan Strixner
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Wednesday, 10 December 2008 |
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This article describes a study recently conducted by Zestron for better
understanding the risks of cleaning lead–free and lead–containing
assemblies together in a single process.
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Written by Steven Stach and Mike Bixenman
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Wednesday, 22 October 2008 |
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 Electronic assembly cleaning processes are becoming increasingly more
complex because of global environmental mandates and customer–driven
product performance requirements.
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Written by Sheila Hamilton, Technical Director, Teknek
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Wednesday, 25 June 2008 |
 Presenting the contamination analysis in this way makes it immediately obvious where housekeeping procedures or manufacturing protocols need to be increased or changed within the department. |
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Written by Hunter Paterson, Product Manager, Teknek
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Tuesday, 24 June 2008 |
 Research has shown that 80% of contaminants are introduced in to a "clean area" by people and products, 15% is generated by the products themselves and 5% is actually produced by the room and filtration system. |
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Written by Mike Bixenman and Steve Stach
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Wednesday, 30 April 2008 |
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 Innovative electronic assembly designs strive to increase functionality over smaller surface areas. Highly dense circuit assembly designs increase the cleaning challenge.
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Written by Dirk Ellis, Speedline Technologies and Mike Bixenman, Kyzen Corporation
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Thursday, 19 July 2007 |
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As the electronics industry moves toward the implementation of Pb–free soldering, the impact on the assembly process must be considered. |
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Written by Mike Bixenman, Erik Miller and Fernando Rueda
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Wednesday, 07 February 2007 |
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 When industry announced the intention to eliminate lead (Pb) from the soldering process, a number of experiments were performed to test the cleaning efficacy of Pb–free soldering materials.
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Written by Wack, Schweigart, Tosun, Becht, Afshari and Ellis
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Friday, 26 January 2007 |
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As the entire electronic manufacturing industry braced for the July 1, 2006 deadline, it has been reevaluating the entire production process. |
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Written by Michael T. Konrad
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Friday, 13 October 2006 |
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 There are several steps in determining IF and HOW to implement a de–fluxing strategy. Lead–free soldering and reflow environments mandate a more critical de–fluxing due–diligence process.
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Written by Thomas M. Forsythe
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Friday, 13 October 2006 |
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 The transition to lead–free solder technology presents a long list of challenges for the manufacturing shop floor engineers, and that list includes an array of cleaning challenges.
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Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 