Written by Sheila Hamilton, Technical Director, Teknek
Wednesday, 25 June 2008
Presenting the contamination analysis in this way makes it immediately obvious where housekeeping procedures or manufacturing protocols need to be increased or changed within the department.
Written by Hunter Paterson, Product Manager, Teknek
Tuesday, 24 June 2008
Research has shown that 80% of contaminants are introduced in to a “clean area” by people and products, 15% is generated by the products themselves and 5% is actually produced by the room and filtration system.
Written by Mike Bixenman, Erik Miller and Fernando Rueda
Wednesday, 07 February 2007
When industry announced the intention to eliminate lead (Pb) from the soldering process, a number of experiments were performed to test the cleaning efficacy of Pb-free soldering materials.
There are several steps in determining IF and HOW to implement a de-fluxing strategy. Lead-free soldering and reflow environments mandate a more critical de-fluxing due-diligence process.
The transition to lead-free solder technology presents a long list of challenges for the manufacturing shop floor engineers, and that list includes an array of cleaning challenges.
Written by Tatiana Berdinskikh, Sun-Yuan Huang, Heather Tkalec, Douglas H. Wilson, Frank (Yi) Zhang
Friday, 14 July 2006
The iNEMI Fiber Connector End-Face Inspection Project conducted
research to quantify the correlation between fiber optic connector
cleanliness and optical performance, with the goal of developing
industry-standard criteria.
In Global SMT & Packaging issue 5.6 (June/July 2005), Stach & Bixenman presented research for optimizing cleaning energy in batch and inline cleaning systems....
Depending on how liberal one is in their definition of what a wafer
level package is, the technology is either entering its second, third
or perhaps even its fourth or fifth decade of use.
Presenting the contamination analysis in this way makes it immediately obvious where housekeeping procedures or manufacturing protocols need to be increased or changed within the department. 
Research has shown that 80% of contaminants are introduced in to a “clean area” by people and products, 15% is generated by the products themselves and 5% is actually produced by the room and filtration system. 
Innovative electronic assembly designs strive to increase functionality over smaller surface areas. Highly dense circuit assembly designs increase the cleaning challenge. 
When industry announced the intention to eliminate lead (Pb) from the soldering process, a number of experiments were performed to test the cleaning efficacy of Pb-free soldering materials.
The iNEMI Fiber Connector End-Face Inspection Project conducted
research to quantify the correlation between fiber optic connector
cleanliness and optical performance, with the goal of developing
industry-standard criteria. 
In Global SMT & Packaging issue 5.6 (June/July 2005), Stach & Bixenman presented research for optimizing cleaning energy in batch and inline cleaning systems....
