Global SMT RSS feed
Dispensing
Related Items |
 Featured Interview
Small Matters
Lead-Free Matters
 Global Business
Industry BlogsKeep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
The expansion of business into alternative energy, green components and
energy–efficient components is having a significant impact on the
electronics and semiconductor industry. 
The ability to jet liquid materials that have viscosities in excess of 20 centipoises has opened a new level of packaging miniaturization.
Piezo–driven jet dispensing systems offer high dispensing speed in combination with extreme accuracy. 
Jetting adhesives for electronics and semiconductor packaging has provided enabling technology for high–throughput underfilling, small fillets and other applications for small, discrete amounts of material used in packaging. 
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 