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Dispensing
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The ability to jet liquid materials that have viscosities in excess of 20 centipoises has opened a new level of packaging miniaturization.
Piezo-driven jet dispensing systems offer high dispensing speed in combination with extreme accuracy. 
Jetting adhesives for electronics and semiconductor packaging has provided enabling technology for high-throughput underfilling, small fillets and other applications for small, discrete amounts of material used in packaging. 
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