The expansion of business into alternative energy, green components and energy-efficient components is having a significant impact on the electronics and semiconductor industry.

The ability to jet liquid materials that have viscosities in excess of 20 centipoises has opened a new level of packaging miniaturization.

Typically, dispensing platform specifications do not include the error associated with positional mechanisms, which greatly contributes to final accuracy and repeatability.

Jetting adhesives for electronics and semiconductor packaging has provided enabling technology for high-throughput underfilling, small fillets and other applications for small, discrete amounts of material used in packaging.