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PCB production & test: tips from pros on lead-free processes PDF Print E-mail
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Written by Thomas Berger   
Thursday, 07 August 2008
Part 1—Issues in hot air solder levelling (HASL).
 
Suitable choices for lead-free hand soldering PDF Print E-mail
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Written by Shubo Gao and David M. Jacobson   
Thursday, 24 July 2008
Lead-free processes for reflow and wave soldering are well documented, but this is not the case for hand soldering, which is still used for specialised electronic products. This article describes the selection of solder and board finishes that suit hand soldering and important issues affecting the choice.
 
Lead free HASL PDF Print E-mail
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Written by T. Scimeca, G. Sikorcin, and T. Lentz   
Wednesday, 02 April 2008

The solder surface produced on bare printed circuit boards by hot air solder leveling (HASL) has been used extensively as a solderable finish for many years.

 
7.10 - Pin-in-hole reflow (PIHR) and lead-free solder joints PDF Print E-mail
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Written by David Bernard and Bob Willis   
Wednesday, 07 November 2007

Because the implications of switching to using lead-free materials for printed wiring board (PWB) assembly have particular impact on the equipment and capability for wave soldering, it is attractive to consider the applicability of using the pin-in-hole intrusive reflow technique as an alternative within the production environment.

 
7.9 - Vapor phase for lead-free reflow PDF Print E-mail
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Written by David Suihkonen   
Friday, 12 October 2007

Vapor phase, or condensation heating, has progressed through many variations since its invention in 1973[1].

 
7.7 - Liquid tin corrosion and lead free wave soldering PDF Print E-mail
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Written by Jim Morris, Matthew J. O’Keefe and Martin Perez   
Thursday, 16 August 2007

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion-resistant coatings and improved lead free solder alloys.

 
7.6 - Advanced coating technologies for lead-free solders PDF Print E-mail
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Written by Bill Boyd   
Thursday, 05 July 2007

As industry moves to lead-free soldering, tin has replaced lead in a majority of the new solder formulas and also in component coatings and leads.

 
7.5 - Measuring true temperature in lead-free assembly PDF Print E-mail
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Written by Yoshinobu Anbe, Phil Harrison   
Monday, 11 June 2007

This article analyzes different thermocouple products and their suitability for modern lead-free manufacturing.

 
7.4 - Carrier tape for lead-free assembly of PCBs PDF Print E-mail
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Written by Y.M.Lim   
Friday, 11 May 2007

Generally, flexible printed circuit boards (FPCBs) have been fixed on a carrier plate (jig) using single-sided polyimide film tape, film-based double-sided tape or resin-coated carrier plate, but these types of holding methods produce inconvenience and problems.

 
7.2 - Validation of SAC305 and SnCu-based solders at the contract assembler level PDF Print E-mail
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Written by Peter Biocca & Carlos Rivas   
Wednesday, 07 March 2007

This paper details the experience of one medium sized assembler set on achieving a customer-driven mandate to go lead-free for the assembly of high-end printer boards.

 
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