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Written by Thomas Berger
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Thursday, 07 August 2008 |
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Part 1—Issues in hot air solder levelling (HASL). |
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Written by Shubo Gao and David M. Jacobson
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Thursday, 24 July 2008 |
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Lead-free processes for reflow and wave soldering are well documented, but this is not the case for hand soldering, which is still used for specialised electronic products. This article describes the selection of solder and board finishes that suit hand soldering and important issues affecting the choice. |
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Written by T. Scimeca, G. Sikorcin, and T. Lentz
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Wednesday, 02 April 2008 |
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 The solder surface produced on bare printed circuit boards by hot air solder leveling (HASL) has been used extensively as a solderable finish for many years.
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Written by David Bernard and Bob Willis
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Wednesday, 07 November 2007 |
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 Because the implications of switching to using lead-free materials for printed wiring board (PWB) assembly have particular impact on the equipment and capability for wave soldering, it is attractive to consider the applicability of using the pin-in-hole intrusive reflow technique as an alternative within the production environment.
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Written by David Suihkonen
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Friday, 12 October 2007 |
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 Vapor phase, or condensation heating, has progressed through many variations since its invention in 1973[1].
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Written by Jim Morris, Matthew J. O’Keefe and Martin Perez
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Thursday, 16 August 2007 |
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 Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion-resistant coatings and improved lead free solder alloys.
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Written by Bill Boyd
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Thursday, 05 July 2007 |
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 As industry moves to lead-free soldering, tin has replaced lead in a majority of the new solder formulas and also in component coatings and leads.
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Written by Yoshinobu Anbe, Phil Harrison
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Monday, 11 June 2007 |
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 This article analyzes different thermocouple products and their suitability for modern lead-free manufacturing.
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Written by Y.M.Lim
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Friday, 11 May 2007 |
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 Generally, flexible printed circuit boards (FPCBs) have been fixed on a carrier plate (jig) using single-sided polyimide film tape, film-based double-sided tape or resin-coated carrier plate, but these types of holding methods produce inconvenience and problems.
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Written by Peter Biocca & Carlos Rivas
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Wednesday, 07 March 2007 |
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 This paper details the experience of one medium sized assembler set on achieving a customer-driven mandate to go lead-free for the assembly of high-end printer boards.
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