Written by Helen Holder, Gregory Henshall, Aileen Maloney et al
Wednesday, 10 December 2008
Since the implementation of EU RoHS in 2006, the electronics industry
has seen a proliferation of Pb-free alloys for wave soldering, mini-pot
rework, BGA and CSP solder balls and, more recently, solder pastes for
mass reflow.
Lead-free processes for reflow and wave soldering are well documented, but this is not the case for hand soldering, which is still used for specialised electronic products. This article describes the selection of solder and board finishes that suit hand soldering and important issues affecting the choice.
The solder surface produced on bare printed circuit boards by hot air solder leveling (HASL) has been used extensively as a solderable finish for many years.
Because the implications of switching to using lead-free materials for printed wiring board (PWB) assembly have particular impact on the equipment and capability for wave soldering, it is attractive to consider the applicability of using the pin-in-hole intrusive reflow technique as an alternative within the production environment.
Written by Jim Morris, Matthew J. O’Keefe and Martin Perez
Thursday, 16 August 2007
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion-resistant coatings and improved lead free solder alloys.
Generally, flexible printed circuit boards (FPCBs) have been fixed on a carrier plate (jig) using single-sided polyimide film tape, film-based double-sided tape or resin-coated carrier plate, but these types of holding methods produce inconvenience and problems.
Jeff Timms, president of Microscan since 2007, has been focusing these
past two years on bringing the company to the forefront of the
precision data acquisition and control solutions industry.
The solder surface produced on bare printed circuit boards by hot air solder leveling (HASL) has been used extensively as a solderable finish for many years. 
Because the implications of switching to using lead-free materials for printed wiring board (PWB) assembly have particular impact on the equipment and capability for wave soldering, it is attractive to consider the applicability of using the pin-in-hole intrusive reflow technique as an alternative within the production environment.
Vapor phase, or condensation heating, has progressed through many variations since its invention in 1973[1].
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion-resistant coatings and improved lead free solder alloys.
As industry moves to lead-free soldering, tin has replaced lead in a majority of the new solder formulas and also in component coatings and leads. 
This article analyzes different thermocouple products and their suitability for modern lead-free manufacturing.
Generally, flexible printed circuit boards (FPCBs) have been fixed on a carrier plate (jig) using single-sided polyimide film tape, film-based double-sided tape or resin-coated carrier plate, but these types of holding methods produce inconvenience and problems.
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