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Conquering SMT stencil printing challenges with today’s miniature components PDF Print E-mail
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Written by Robert F. Dervaes, Jeff Poulos, and Scott Williams   
Friday, 08 May 2009

This article discusses new developments in stencil laser and material technology and shows how these advancements, when combined, provide comparable and cost–effective alternatives to traditional electroformed stencils. The results are improved yields, cycle time reductions and significant cost savings.

 
Efficient line changeover: the key to lean manufacturing PDF Print E-mail
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Written by hglackey   
Monday, 06 April 2009

Changes in the domestic printed circuit board assembly industry have resulted in a dominant shift to a high–mix, low–volume (HMLV) manufacturing environment resulting in a high frequency of line changeovers.

 
A new angle on printing PDF Print E-mail
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Written by George Babka, Scott Zerkle, et al   
Monday, 02 March 2009

Although blade contact angle is a critical stencil printing parameter, screen printers have so far been unable to vary it ‘on–the–fly’, in software.

 
Parallel print & inspection processes to achieve 100% post–print inspection PDF Print E-mail
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Written by Wolfram Hübsch   
Tuesday, 23 September 2008

As the first process step in an SMT production line, solder paste printing is of key importance. 

 
Improving print performance using area ratio sensitivity analysis PDF Print E-mail
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Written by Chris Anglin   
Monday, 09 June 2008
The purpose of a solder paste print evaluation is to observe variation in transfer efficiency to the assembly process under conditions that permit careful scrutiny.
 
Pin in paste stencil design for notebook mainboard PDF Print E-mail
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Written by Atilim Demirtas   
Wednesday, 05 March 2008

This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required.

 
Process development and characterization of the stencil printing process for small aperatures PDF Print E-mail
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Written by Dr. Daryl Santos, SUNY Binghamtom and Dr. Rita Mohanty, Speedline Technologies   
Thursday, 19 July 2007

The consumer’s interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly.

 
7.2 – Evaluation of wafer bumping stencils PDF Print E-mail
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Written by Scott F. Popelar and Robert A. Niemet   
Wednesday, 07 March 2007

In order to better characterize the performance of wafer bumping stencils, a novel solder transfer ratio has been defined that relates the amount of solder paste volume transferred to a wafer to the actual stencil aperture volume.

 
White paper: Bumping BGAs using solder paste printing process for RFI shields packaging PDF Print E-mail
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Written by Dr. Gerald Pham-Van-Diep, Srinivasa R. Aravamudhan, Joe Belmonte1, Dr. Benlih Huang   
Friday, 26 January 2007
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies consists of "snapping" the shell–like shields onto solder spheres that are soldered to printed circuit board [PCB] pads.
 
6.9 – Step stencils PDF Print E-mail
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Written by William E. Coleman Ph.D. and Michael R. Burgess   
Friday, 01 December 2006

In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. However, as SMT requirements became more complex and, consequently, more demanding, so did the requirements for complex step stencils.

 

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Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff