Written by Robert F. Dervaes, Jeff Poulos, and Scott Williams
Friday, 08 May 2009
This article discusses new developments in stencil laser and material technology and shows how these advancements, when combined, provide comparable and cost-effective alternatives to traditional electroformed stencils. The results are improved yields, cycle time reductions and significant cost savings.
Changes in the domestic printed circuit board assembly industry have
resulted in a dominant shift to a high-mix, low-volume (HMLV)
manufacturing environment resulting in a high frequency of line
changeovers.
The purpose of a solder paste print evaluation is to observe variation in transfer efficiency to the assembly process under conditions that permit careful scrutiny.
Written by Dr. Daryl Santos, SUNY Binghamtom and Dr. Rita Mohanty, Speedline Technologies
Thursday, 19 July 2007
The consumer’s interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly.
In order to better characterize the performance of wafer bumping stencils, a novel solder transfer ratio has been defined that relates the amount of solder paste volume transferred to a wafer to the actual stencil aperture volume.
Written by Dr. Gerald Pham-Van-Diep, Srinivasa R. Aravamudhan, Joe Belmonte1, Dr. Benlih Huang
Friday, 26 January 2007
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies consists of “snapping” the shell-like shields onto solder spheres that are soldered to printed circuit board [PCB] pads.
Written by William E. Coleman Ph.D. and Michael R. Burgess
Friday, 01 December 2006
In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. However, as SMT requirements became more complex and, consequently, more demanding, so did the requirements for complex step stencils.
Jeff Timms, president of Microscan since 2007, has been focusing these
past two years on bringing the company to the forefront of the
precision data acquisition and control solutions industry.