While there are many rework processes outlined by both rework equipment vendors and the IPC 7711/7721PCB rework and repair documents, there is a lack of repositories of application notes for non-mainstream laser-based PCB rework processes.

This paper will help you understand the process of lead-free rework of  package-on-package (POP) mounted on a PCB, which is new technology already being used in high-end graphics cards and mobile phones.

This paper describes a practical approach to characterizing the thermal performance of similarly configured rework systems, with the aim of yielding like thermal performance.

The trend of increasing complication in the rework arena continues.