Different devices demand different processes and safety; however, temperature of the component and reliability are often not included in the tool selection method.

While there are many rework processes outlined by both rework equipment vendors and the IPC 7711/7721PCB rework and repair documents, there is a lack of repositories of application notes for non–mainstream laser–based PCB rework processes.

This paper will help you understand the process of lead–free rework of  package–on–package (POP) mounted on a PCB, which is new technology already being used in high–end graphics cards and mobile phones.

This paper describes a practical approach to characterizing the thermal performance of similarly configured rework systems, with the aim of yielding like thermal performance.

The trend of increasing complication in the rework arena continues.