Industry Blogs

Top blogs

Syndicate

Rework


7.4 - Rework of package on package in lead-free array PDF Print E-mail
User Rating: / 0
Written by Paul Wood   
Friday, 11 May 2007

This paper will help you understand the process of lead-free rework of  package-on-package (POP) mounted on a PCB, which is new technology already being used in high-end graphics cards and mobile phones.

 
6.8 - Rework system-to-system performance characterization PDF Print E-mail
User Rating: / 0
Written by Al Cabral   
Friday, 13 October 2006

This paper describes a practical approach to characterizing the thermal performance of similarly configured rework systems, with the aim of yielding like thermal performance.

 
6.4 - Single ball reballing and repair of BGA components PDF Print E-mail
User Rating: / 1
Written by Robert V. Avila   
Monday, 03 April 2006

The trend of increasing complication in the rework arena continues.

 

Related Items