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Written by Dr. Stephen Clark
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Friday, 03 July 2009 |
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Solder joint integrity may be compromised through mechanical shock,
particularity in portable electronics using area array devices with
solder balls for interconnections.
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Written by Mark T. McMeen
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Tuesday, 10 March 2009 |
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Do you know what level of applied strain your printed circuit board assembly realizes in your fielded state?
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Written by Dipl.-Ing. Hartmut Berndt
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Monday, 09 February 2009 |
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The concept for the introduction of an electrostatic discharge (ESD)
control system is expanded here to cover the most important topic at
the moment: static control requirements for machines and production
plants.
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Written by Mathias Keil
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Tuesday, 18 November 2008 |
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The idea of monitoring manufacturing processes using statistical methods goes back to the 1920s when Walter A. Shewhart, an American physicist, engineer and statistician, was engaged by the Western Electric Company in Chicago to find a way to produce their products with a certain quality level.
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Written by Brian Toleno, Ph.D., and Dan Maslyk
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Wednesday, 02 July 2008 |
Increased functionality and smaller devices are significant drivers in innovative packaging designs. |
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Written by Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer
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Wednesday, 05 March 2008 |
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Three fullfield optical techniques, shadow moiré, fringe projection, and digital image correlation (DIC), are used to measure temperaturedependent warpage.... |
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Written by Joe Smetana
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Thursday, 05 July 2007 |
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The Tin Whisker User Group of the International Electronics Manufacturing Initiative (iNEMI) released a major update of its publication "Recommendations on LeadFree Finishes for Components Used in HighReliability Products" at the end of last year. |
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Written by Brian Smith, Jennifer Allen and John Tuccy, Kester
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Monday, 11 June 2007 |
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This paper examines the longterm reliability of noclean tacky fluxes when subjected to a variety of processing conditions. |
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Written by Dr. Helmut Schweigart
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Tuesday, 10 April 2007 |
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The requirements on electronic assemblies used for hightech applications in the automotive or avionics industry are steadily increasing. |
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Written by Soeren Hirsch, Soeren Majcherek & Bertram Schmidt
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Wednesday, 07 February 2007 |
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This paper reports on a method for estimating and minimizing mechanical stress on MEMS sensor and actuator structures that is caused by the packaging processes. |
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