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Reliability


Energy measurement: The main metric for high strain rate bondtesting of solder balls PDF Print E-mail
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Written by Dr. Stephen Clark   
Friday, 03 July 2009

Solder joint integrity may be compromised through mechanical shock, particularity in portable electronics using area array devices with solder balls for interconnections.

 
Strain gage testing: the delta effect of thermal cycle testing PDF Print E-mail
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Written by Mark T. McMeen   
Tuesday, 10 March 2009

Do you know what level of applied strain your printed circuit board assembly realizes in your fielded state?

 
Electrostatic discharge (ESD) and automated handling processes PDF Print E-mail
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Written by Dipl.-Ing. Hartmut Berndt   
Monday, 09 February 2009

The concept for the introduction of an electrostatic discharge (ESD) control system is expanded here to cover the most important topic at the moment: static control requirements for machines and production plants.

 
SPC and usage difficulties in SMT PDF Print E-mail
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Written by Mathias Keil   
Tuesday, 18 November 2008

The idea of monitoring manufacturing processes using statistical methods goes back to the 1920s when Walter A. Shewhart, an American physicist, engineer and statistician, was engaged by the Western Electric Company in Chicago to find a way to produce their products with a certain quality level. 

 
Process and assembly methods for increased yield of PoP devices PDF Print E-mail
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Written by Brian Toleno, Ph.D., and Dan Maslyk   
Wednesday, 02 July 2008
Increased functionality and smaller devices are significant drivers in innovative packaging designs.
 
Comparing techniques for temperature-dependent warpage measurement PDF Print E-mail
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Written by Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer   
Wednesday, 05 March 2008

Three full-field optical techniques, shadow moiré, fringe projection, and digital image correlation (DIC), are used to measure temperature-dependent warpage....

 
7.6 - iNEMI Updates Tin Whisker Recommendations PDF Print E-mail
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Written by Joe Smetana   
Thursday, 05 July 2007

The Tin Whisker User Group of the International Electronics Manufacturing Initiative (iNEMI) released a major update of its publication “Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products” at the end of last year.

 
7.5 - Reliability of tacky fluxes in varying soldering applications PDF Print E-mail
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Written by Brian Smith, Jennifer Allen and John Tuccy, Kester   
Monday, 11 June 2007

This paper examines the long-term reliability of no-clean tacky fluxes when subjected to a variety of processing conditions.

 
Conformal coating issues: When reliability goes astray PDF Print E-mail
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Written by Dr. Helmut Schweigart   
Tuesday, 10 April 2007

The requirements on electronic assemblies used for high-tech applications in the automotive or avionics industry are steadily increasing.

 
7.1 - Characterizing mechanical stress caused by packaging processes PDF Print E-mail
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Written by Soeren Hirsch, Soeren Majcherek & Bertram Schmidt   
Wednesday, 07 February 2007

This paper reports on a method for estimating and minimizing mechanical stress on MEMS sensor and actuator structures that is caused by the packaging processes.

 

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Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff
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