Written by Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer
Wednesday, 05 March 2008
Three full-field optical techniques, shadow moiré, fringe projection, and digital image correlation (DIC), are used to measure temperature-dependent warpage....
The Tin Whisker User Group of the International Electronics Manufacturing Initiative (iNEMI) released a major update of its publication “Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products” at the end of last year.
Written by Soeren Hirsch, Soeren Majcherek & Bertram Schmidt
Wednesday, 07 February 2007
This paper reports on a method for estimating and minimizing mechanical stress on MEMS sensor and actuator structures that is caused by the packaging processes.
Rampant counterfeiting in regions such as Asia has made strict research into the documentation and authenticity of chips an essential prerequisite for accepting ICs for integration into manufactured products.
Depending on how liberal one is in their definition of what a wafer
level package is, the technology is either entering its second, third
or perhaps even its fourth or fifth decade of use.
Increased functionality and smaller devices are significant drivers in innovative packaging designs. 
Three full-field optical techniques, shadow moiré, fringe projection, and digital image correlation (DIC), are used to measure temperature-dependent warpage....
The Tin Whisker User Group of the International Electronics Manufacturing Initiative (iNEMI) released a major update of its publication “Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products” at the end of last year.
This paper examines the long-term reliability of no-clean tacky fluxes when subjected to a variety of processing conditions. 
The requirements on electronic assemblies used for high-tech applications in the automotive or avionics industry are steadily increasing. 
This paper reports on a method for estimating and minimizing mechanical stress on MEMS sensor and actuator structures that is caused by the packaging processes.
Rampant counterfeiting in regions such as Asia has made strict research into the documentation and authenticity of chips an essential prerequisite for accepting ICs for integration into manufactured products.
When the solder iron pulls away, a solder spike is formed. There is, of
course, more to it than that, as my experiments involving flux activity
show.
