Solder joint integrity may be compromised through mechanical shock, particularity in portable electronics using area array devices with solder balls for interconnections.

Do you know what level of applied strain your printed circuit board assembly realizes in your fielded state?

The concept for the introduction of an electrostatic discharge (ESD) control system is expanded here to cover the most important topic at the moment: static control requirements for machines and production plants.

The idea of monitoring manufacturing processes using statistical methods goes back to the 1920s when Walter A. Shewhart, an American physicist, engineer and statistician, was engaged by the Western Electric Company in Chicago to find a way to produce their products with a certain quality level. 

Three full–field optical techniques, shadow moiré, fringe projection, and digital image correlation (DIC), are used to measure temperature–dependent warpage....

The Tin Whisker User Group of the International Electronics Manufacturing Initiative (iNEMI) released a major update of its publication "Recommendations on Lead–Free Finishes for Components Used in High–Reliability Products" at the end of last year.

This paper examines the long–term reliability of no–clean tacky fluxes when subjected to a variety of processing conditions.

The requirements on electronic assemblies used for high–tech applications in the automotive or avionics industry are steadily increasing.

This paper reports on a method for estimating and minimizing mechanical stress on MEMS sensor and actuator structures that is caused by the packaging processes.