Written by Stephen Tisdale, Gary B. Long, Roger Krabbenhoft, Kostas Papathomas, Ph.D., and Terry Fischer
Monday, 06 April 2009
The electronics industry is under pressure to eliminate brominated
flame retardants (BFRs) that were once widely used in electronics
housings and cases and are still used extensively in printed circuit
boards.
Could new web-based medical applications, coupled with the next generation of Bluetooth® wireless-based consumer medical devices, change personal medical care?
The market for contactless labels has passed through the trough and out the other side—RFID is gaining momentum again: In 2007, 144 million RFID tags were sold in the EU alone.
Jeff Timms, president of Microscan since 2007, has been focusing these
past two years on bringing the company to the forefront of the
precision data acquisition and control solutions industry.
For our application and experiment, a new underfilling process, molded underfill (MUF), is being investigated. 
1-part and 2-part liquid adhesives and sealants have long been part of the materials portfolio used in electronics packaging. 
Few things strike more dread in the hearts of technical service
personnel than the words "Is your flux compatible with material 'XYZ'?" 
Metal thermal interface materials (TIMs) offer substantially higher thermal conductivity than other commercially available TIMs. 
Engineers are always striving to make a lighter, faster and stronger PCB. 
This article helps those working with solder pastes improve their understanding of this key material.
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