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Nanotechnology and mathematical methods for high-performance thermal interface materials PDF Print E-mail
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Written by Sara N. Paisner, PhD   
Monday, 16 June 2008
Higher power chips have resulted from a variety of new developments in the electronics industry.

 

 
Case Study: Technology partnership for effective RFID system solutions PDF Print E-mail
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Written by Dipl.-Ing. (FH) Florian Hierl   
Wednesday, 21 May 2008
The market for contactless labels has passed through the trough and out the other side—RFID is gaining momentum again: In 2007, 144 million RFID tags were sold in the EU alone.
 
Full metal TIMs PDF Print E-mail
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Written by Robert N. Jarrett, Jordan P. Ross, Ross Berntson   
Wednesday, 05 March 2008

Metal thermal interface materials (TIMs) offer substantially higher thermal conductivity than other commercially available TIMs.

 
Optimizing thermal and mechanical performance in PCBs PDF Print E-mail
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Written by Alex Mangroli and Kris Vasoya   
Friday, 04 January 2008

Engineers are always striving to make a lighter, faster and stronger PCB.

 
Fundamentals of Solder Paste Technology PDF Print E-mail
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Written by Dosten Baluch & Gerard Minogue   
Friday, 04 January 2008

This article helps those working with solder pastes improve their understanding of this key material.

 
Embedded thermoelectric cooling PDF Print E-mail
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Written by Jesko von Windheim   
Monday, 03 December 2007

Thin film thermoelectric devices offer a fundamentally new operating regime for integrated, active cooling solutions and localized thermal management, yet the assembly methodology used to implement these devices is fully compatible with existing surface mount approaches. 

 
Film vs. paste: Die attach options for stacked die applications PDF Print E-mail
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Written by James T. Huneke, Robert Chu, Jin-O Choi, Howard Yun and Han Wu   
Monday, 03 December 2007
As consumers continue to push electronics manufacturers for smaller yet higher functioning products, packaging engineers must keep pace with the development of devices that can meet these demands.
 
SnAgCuBi and SnAgCuBiSb solder joint properties investigations PDF Print E-mail
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Written by Kisiel R. Bukat K., Sitek J., Gsior W., Moser Z. and Pstru[ J.   
Monday, 03 December 2007

This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb elements to the SnAgCu solders.

 
7.8 - Optical silicones for use in harsh operating environments PDF Print E-mail
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Written by Bill Riegler, Stephen Bruner and Rob Thomaier   
Tuesday, 04 September 2007

The optics industry widely uses silicones for various fiber-optic, cable potting applications and light-emitting diode protection.

 
7.6 - Is tin heading for a crisis? PDF Print E-mail
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Written by Peter Kettle   
Thursday, 05 July 2007

Tin prices have risen sharply after two decades of depression.

 
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