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IPC Midwest 2007



IPC Midwest 2007 is the only Midwest show that covers all aspects of industry, from board design and manufacture to electronics assembly, manufacture and test.

The conference and exhibition will be held Wednesday, September 26 through Friday, September 28 at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, Illinios, USA. Exhibits open at 10:00am each day of the show. A full schedule of events is available here, on the show's website. 

Pre-register online to get free admission to the exhibition. Your free admission also includes admission to all the free forums, the keynote address by NFL Football Hall of Famer Gale Sayers, admission to the show floor receptions on Wednesday and Thursday, a free IPC training preview DVD, a free IPC standards development CD, and use of the exhibit hall's Internet lounge.

Here are some of the exciting new products you will see on the show floor:



ACE Production Technologies - Booth #336
ACE Production Technologies Inc. will be exhibiting selective soldering systems with internal (integral) pre-heating modules.
 
Agilent Technologies - Booth #306

Agilent Technologies will highlight the Medalist portfolio of solder paste inspection, automated optical inspection, automated x-ray inspection and in-circuit test.

 
Aqueous Technologies - Booth #708

Aqueous Technologies Corp. will premiere the Trident, its fourth-generation automatic defluxing system.

 
BPM Microsystems - Booth #609

BPM will showcase its new revolutionary Flashstream flash programming technology.

 
CyberOptics - Booth #537

CyberOptics Corporation will highlight its Flex Ultra High-Resolution automated optical inspection system (AOI).

 
Datapaq, Inc - Booth #840

Available with 6 or 10 channels, the Q18 boasts a fast USB connection, 18,000 readings per channel, high accuracy (±0.5 °C) and rapid charging - that makes for easy and reliable thermal profiling.

 
DEK International - Booth #409

DEK has developed a suite of powerful technologies designed to enhance manufacturing efficiency and enable higher levels of productivity

 
Digitaltest - Booth #324

Center stage at Booth 324  at this year’s IPC Midwest  exhibition will be a comprehensive range of innovative software and hardware test technologies.

 
Essemtec - Booth #303

Essemtec will display the SP600 batch printer with shuttle system.

 
Europlacer - Booth #633

Europlacer will showcase the Vitesse2 flexible high-volume SMT placement system, which features high throughput combined with the flexibility of a mid-range fine-pitch placer.

 
High-Tech Conversions - Booth #1016

High-Tech Conversions’ GREEN MONSTER ESD stencil wiping roll will be featured in the Blue Thunder Technologies booth.

 
Juki Corporation - Booth #703

Juki Corporation will exhibit the Juki 300 high value selective soldering system, part of a line of selective soldering systems designed to meet the demands of a rapidly changing electronics manufacturing industry.

 
KIC - Booth #134

KIC will launch KIC Explorer, a new generation of thermal profiler that features an impressively compact design that allows it to move easily through the restrictive process dimensions encountered in today’s thermal applications.

 
Kyzen Corporation - Booth #803
Kyzen Corporation will showcase AQUANOX A4625, designed for optimum effectiveness in cleaning the latest lead-free residues while providing brilliant mirrored solder finishes, in booth 803.
 
RMD Instruments to exhibit at IPC Midwest, booth #524

RMD Instruments LLC will demonstrate its innovative LeadTracer-RoHS XRF system, with new sample preparation stand.

 
The electronics group of Henkel - Booth #811

Henkel’s latest underfill technology, Loctite® 3536, delivers improved reliability for today’s advanced CSP and BGA packages.

 
Universal Instruments - Booth #415

Universal Instruments’ award-winning Genesis Platform solutions will be on display at IPC Midwest 2007, booth 415.

 
Zestron America - Booth #835

ZESTRON America is pleased to introduce its newly developed FAST (Fast Acting Surfactant Technology) Technology.

 


Featured Interview

Interview—Jeff Timms, Microscan

Jeff Timms, president of Microscan since 2007, has been focusing these past two years on bringing the company to the forefront of the precision data acquisition and control solutions industry.

 

Small Matters

IC Packaging Technology Retrospective - Part 4

The electronics industry’s mantra has for many years been “Smaller, Faster, Lighter, Better and Cheaper.” 

 

Lead-Free Matters

Shear Testing of BGA Pads – Pads are not as good as they were?

Shear force measurement is a common and quick way of destructively assessing solder joints and complement pull strength measurements.

 

Global Business

Sobering first quarter

Modest seasonal & cyclical recovery now underway.

 

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