IPC Midwest 2007 is the only Midwest show that covers all aspects of industry, from board design and manufacture to electronics assembly, manufacture and test.
The conference and exhibition will be held Wednesday, September 26 through Friday, September 28 at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, Illinios, USA. Exhibits open at 10:00am each day of the show. A full schedule of events is available here, on the show's website.
Pre-register online to get free admission to the exhibition. Your free admission also includes admission to all the free forums, the keynote address by NFL Football Hall of Famer Gale Sayers, admission to the show floor receptions on Wednesday and Thursday, a free IPC training preview DVD, a free IPC standards development CD, and use of the exhibit hall's Internet lounge.
Here are some of the exciting new products you will see on the show floor:
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 ACE Production Technologies Inc. will be exhibiting selective soldering systems with internal (integral) pre-heating modules. |
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Agilent Technologies will highlight the Medalist portfolio of solder paste inspection, automated optical inspection, automated x-ray inspection and in-circuit test. |
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Aqueous Technologies Corp. will premiere the Trident, its fourth-generation automatic defluxing system. |
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 BPM will showcase its new revolutionary Flashstream flash programming technology.
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 CyberOptics Corporation will highlight its Flex Ultra High-Resolution automated optical inspection system (AOI).
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 Available with 6 or 10 channels, the Q18 boasts a fast USB connection, 18,000 readings per channel, high accuracy (±0.5 °C) and rapid charging - that makes for easy and reliable thermal profiling.
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 DEK has developed a suite of powerful technologies designed to enhance manufacturing efficiency and enable higher levels of productivity
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 Center stage at Booth 324 at this year’s IPC Midwest exhibition will be a comprehensive range of innovative software and hardware test technologies.
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 Essemtec will display the SP600 batch printer with shuttle system.
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 Europlacer will showcase the Vitesse2 flexible high-volume SMT placement system, which features high throughput combined with the flexibility of a mid-range fine-pitch placer.
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High-Tech Conversions’ GREEN MONSTER ESD stencil wiping roll will be featured in the Blue Thunder Technologies booth. |
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Juki Corporation will exhibit the Juki 300 high value selective soldering system, part of a line of selective soldering systems designed to meet the demands of a rapidly changing electronics manufacturing industry. |
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 KIC will launch KIC Explorer, a new generation of thermal profiler that features an impressively compact design that allows it to move easily through the restrictive process dimensions encountered in today’s thermal applications.
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 Kyzen Corporation will showcase AQUANOX A4625, designed for optimum effectiveness in cleaning the latest lead-free residues while providing brilliant mirrored solder finishes, in booth 803. |
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 RMD Instruments LLC will demonstrate its innovative LeadTracer-RoHS XRF system, with new sample preparation stand.
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 Henkel’s latest underfill technology, Loctite® 3536, delivers improved reliability for today’s advanced CSP and BGA packages.
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Universal Instruments’ award-winning Genesis Platform solutions will be on display at IPC Midwest 2007, booth 415. |
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 ZESTRON America is pleased to introduce its newly developed FAST (Fast Acting Surfactant Technology) Technology.
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