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Written by Gordon Christison
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Tuesday, 08 July 2008 |
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 Techsearch has predicted a compound annual growth rate of more than 24% for wafer-level packages between 2005 and 2010. Contract electronics manufacturers and original design manufacturers face a range of handling problems when using these small silicon devices in assemblies.
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Written by Joe Fjelstad
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Tuesday, 08 July 2008 |
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The ongoing journey to co-design of chip, package and substrate.
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Written by Brian Toleno, Ph.D., and Dan Maslyk
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Wednesday, 02 July 2008 |
 Increased functionality and smaller devices are significant drivers in innovative packaging designs. |
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Written by Sheila Hamilton, Technical Director, Teknek
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Wednesday, 25 June 2008 |
 Presenting the contamination analysis in this way makes it immediately obvious where housekeeping procedures or manufacturing protocols need to be increased or changed within the department. |
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Written by Hunter Paterson, Product Manager, Teknek
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Tuesday, 24 June 2008 |
 Research has shown that 80% of contaminants are introduced in to a “clean area” by people and products, 15% is generated by the products themselves and 5% is actually produced by the room and filtration system. |
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Written by Bob Willis
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Monday, 16 June 2008 |
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Over the last few years I have been asked to examine many different ball grid array (BGA) defects from assembly and on field failures here are a selection of the defects and some of the popular causes. |
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Written by Giles Humpston
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Monday, 16 June 2008 |
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The continued drive toward solid state imagers with greater pixel numbers and smaller pixels adversely affects yields, particularly through physical contamination during assembly of the camera module. |
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Written by Dr. T. Nguyen & Vern Harrison
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Monday, 16 June 2008 |
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Lean manufacturing is far from a new concept, and many within the electronics assembly (EA) industry are already familiar with the principles and concepts behind it. |
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Written by Sara N. Paisner, PhD
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Monday, 16 June 2008 |
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Higher power chips have resulted from a variety of new developments in the electronics industry.
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Written by Joe Fjelstad
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Monday, 09 June 2008 |
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Approaching four decades of working in the electronics interconnection industry, it appears to this observer that, when looking back over all those years, the electronics interconnection manufacturing industry has been on a treadmill of sorts and changing ever so slowly. |
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Written by Chris Anglin
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Monday, 09 June 2008 |
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The purpose of a solder paste print evaluation is to observe variation in transfer efficiency to the assembly process under conditions that permit careful scrutiny. |
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Written by Dipl.-Ing. (FH) Florian Hierl
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Wednesday, 21 May 2008 |
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The market for contactless labels has passed through the trough and out the other side—RFID is gaining momentum again: In 2007, 144 million RFID tags were sold in the EU alone. |
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Written by Global SMT & Packaging
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Wednesday, 21 May 2008 |
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The electronics industry is continually faced with problems that take time and money to solve. Many of the problems are by no means new. Possibly they may be areas that were not considered important. |
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Written by Global SMT & Packaging
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Wednesday, 14 May 2008 |
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Will the latest bit of environmental legislation be a hold up? |
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Written by Joanna Kristine Wildhart and Moody Dreiza
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Wednesday, 14 May 2008 |
 This paper covers the surface mount and package stacking assembly challenges related to high density package-on-package (PoP) utilizing solder-on-pad (SOP) technology. |
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Written by Etienne Witte and Paul Austen
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Wednesday, 07 May 2008 |
 This article describes thermal profiling hardware and process management software solutions as used at EMS provider Axiom Electronics LLC to meet the thermal profiling challenges of today’s microelectronics environment. |
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Written by Mike Bixenman and Steve Stach
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Wednesday, 30 April 2008 |
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 Innovative electronic assembly designs strive to increase functionality over smaller surface areas. Highly dense circuit assembly designs increase the cleaning challenge.
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Written by Bob Willis
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Monday, 21 April 2008 |
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Ball Grid Array BGAs are a widely used technology in a vast range of products, including consumer, telecommunications and office-based systems.
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Written by Dawn Poirier
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Wednesday, 16 April 2008 |
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 The EMS industry has created many business models, including those where OEMs provide value-added assembly services in addition to a proprietary product.
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Written by Sjef van Gastel
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Wednesday, 09 April 2008 |
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 As the drive towards assembly miniaturization continues and surface
mount technology matures, components are becoming ever smaller and
thinner.
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