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Energy measurement: The main metric for high strain rate bondtesting of solder balls
Friday, 03 July 2009

Solder joint integrity may be compromised through mechanical shock, particularity in portable electronics using area array devices with solder balls for interconnections.

 
IC Packaging Technology Retrospective - Part 4
Friday, 03 July 2009

The electronics industry’s mantra has for many years been “Smaller, Faster, Lighter, Better and Cheaper.” 

 
EMS ‘Lean Sigma’ shortens cycle time, reduces costs & improves quality
Monday, 08 June 2009

Lean Sigma, an approach that has been in practice for several years, mixes the lean manufacturing concept and problem solving approach with Six Sigma for a more efficient manufacturing process.

 
Jetting fluids in non traditional packaging and assembly applications
Monday, 08 June 2009

The expansion of business into alternative energy, green components and energy-efficient components is having a significant impact on the electronics and semiconductor industry.

 
Shear Testing of BGA Pads – Pads are not as good as they were?
Monday, 08 June 2009

Shear force measurement is a common and quick way of destructively assessing solder joints and complement pull strength measurements.

 
IC Packaging Technology Retrospective - Part 3
Monday, 08 June 2009

Part 2 of this retrospective, seen in last month’s issue of Global SMT and Packaging, took a bit of a detour from the topic to explore the reasoning and the impact of the ‘80% Rule.’

 
Tackling SMT enemy number one
Thursday, 14 May 2009
Raising the standard of solder paste application
 
IC packaging technology retrospective—part 2
Friday, 08 May 2009

Part one left off noting that surface mount brought with it significant advantages to IC packaging but also that there was need to provide guidance for future development. The result of that effort is something that is now known as the ‘80% rule.’

 
Conformal coating process control and inspection
Friday, 08 May 2009

There is definitely an increasing interest in conformal coating for electronics.

 
Vapor phase vs. convection reflow in RoHS-compliant assembly
Friday, 08 May 2009

EMS providers rely on component suppliers to ensure that the lead-free transition on the component terminations is seamless to their soldering processes, but that rarely happens.

 
Conquering SMT stencil printing challenges with today’s miniature components
Friday, 08 May 2009

This article discusses new developments in stencil laser and material technology and shows how these advancements, when combined, provide comparable and cost-effective alternatives to traditional electroformed stencils. The results are improved yields, cycle time reductions and significant cost savings.

 
Hot air solder leveling in the lead-free era
Friday, 08 May 2009

Although the advantages of hot air solder leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized, in the years leading up to the implementation of the EU RoHS Directive in July 2006, the conventional wisdom was that it would have no place in the new lead-free electronics manufacturing technology.

 
Efficient line changeover: the key to lean manufacturing
Monday, 06 April 2009

Changes in the domestic printed circuit board assembly industry have resulted in a dominant shift to a high-mix, low-volume (HMLV) manufacturing environment resulting in a high frequency of line changeovers.

 
iNEMI project evaluates BFR-free PCB materials
Monday, 06 April 2009

The electronics industry is under pressure to eliminate brominated flame retardants (BFRs) that were once widely used in electronics housings and cases and are still used extensively in printed circuit boards.

 
PoP (package on package): An EMS perspective on assembly, rework and reliability
Monday, 06 April 2009

While already in widespread use in the consumer market for handheld, portable electronics, package on package (PoP) continues to gain in popularity and seems likely to be implemented in other types of electronic assemblies.

 
Counterfeit component introduction & testing—goods in inspection not a thing of the past!
Monday, 06 April 2009

In an ideal world, components would only be purchased from the original producer, a franchised distributor or an approved non-franchised source.

 
PiP, PoP and PuP—Package with package construction options
Monday, 06 April 2009

Since the beginning, all IC packages have been designed to perform the basic tasks of interconnecting and protecting the semiconductor die and making it useful for interconnection at the next level.

 
Strain gage testing: the delta effect of thermal cycle testing
Tuesday, 10 March 2009

Do you know what level of applied strain your printed circuit board assembly realizes in your fielded state?

 
General guide to solder balls in wave soldering—now you see them, now you don’t
Friday, 06 March 2009

There are two types of solder balls generally seen after wave soldering.

 
IC packaging technology retrospective—part 1
Monday, 02 March 2009

All IC packaging technology structures since the invention of the integrated circuit itself have been tasked to perform, at a minimum, the simple and fundamental tasks of interconnecting and protecting the semiconductor die and making it useful for interconnection at the next level.

 
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Featured Interview

Interview—Jeff Timms, Microscan

Jeff Timms, president of Microscan since 2007, has been focusing these past two years on bringing the company to the forefront of the precision data acquisition and control solutions industry.

 

Small Matters

IC Packaging Technology Retrospective - Part 4

The electronics industry’s mantra has for many years been “Smaller, Faster, Lighter, Better and Cheaper.” 

 

Lead-Free Matters

Shear Testing of BGA Pads – Pads are not as good as they were?

Shear force measurement is a common and quick way of destructively assessing solder joints and complement pull strength measurements.

 

Global Business

Sobering first quarter

Modest seasonal & cyclical recovery now underway.

 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff
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