Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

Normaly connectors in pin-in-hole intrusive reflow have the greatest impact on reflow delta T because they are BIG, so what happens with a higher reflow temperature with tin/copper solder paste?

Different devices demand different processes and safety; however, temperature of the component and reliability are often not included in the tool selection method.

When defining an inspection strategy for your manufacturing processes, there are many factors that need to be be considered

Solid state imagers are being incorporated in an ever–expanding diversity of products.

Metal based wafer bonding for WLP has several advantages, including enhanced hermeticity, and it facilitates vertical integration.

As many engineers and rework staff know, there are a wide range of techniques for replacing BGA components on a board assembly.

During the soldering operation, copper is dissolved by tin to form a tin/copper intermetallic, and the amount dissolved is dependent on the soldering process, solder alloy, surfaces to be joined, temperature, time and solder flow rate.

The following article is a series of "from the trenches" stories taken both from the perspective of an electronics manufacturer and an environmental compliance consultancy.

Solder joint integrity may be compromised through mechanical shock, particularity in portable electronics using area array devices with solder balls for interconnections.

The electronics industry’s mantra has for many years been "Smaller, Faster, Lighter, Better and Cheaper."

Lean Sigma, an approach that has been in practice for several years, mixes the lean manufacturing concept and problem solving approach with Six Sigma for a more efficient manufacturing process.

The expansion of business into alternative energy, green components and energy–efficient components is having a significant impact on the electronics and semiconductor industry.

Shear force measurement is a common and quick way of destructively assessing solder joints and complement pull strength measurements.

Part 2 of this retrospective, seen in last month’s issue of Global SMT and Packaging, took a bit of a detour from the topic to explore the reasoning and the impact of the ‘80% Rule.’