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Tuesday, 09 February 2010 |
 Mouser is the first to announce the availability of the much anticipated USB 3.0 SuperSpeed connectors from Amphenol. |
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Tuesday, 09 February 2010 |
 The Omron Foundation, Inc. also encouraged U.S. Omron employees to make individual donations in support of local relief efforts to help Haiti recover. |
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Tuesday, 09 February 2010 |
International Electronics Forum 2010
5-7 May, Dresden, Germany
Early Bird Booking Fee Now Available |
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Tuesday, 09 February 2010 |
 Among the advanced Productivity Tools featured on the platform is the multi-award-winning Cyclone high-performance understencil cleaner. |
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Tuesday, 09 February 2010 |
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 SemiProbe announces the installation of a simultaneous double sided prober at leading New York research lab.
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Tuesday, 09 February 2010 |
 Ivan Sheiham brings with him a wealth of experience, having previously worked for a global electrical insulation business, developing business in Asia and other emerging markets. |
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Tuesday, 09 February 2010 |
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Yole Developpement is pleased to publish the reverse costing & engineering process analysis of the famous: SEOUL Semiconductor Z-Power P9 LED |
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Tuesday, 09 February 2010 |
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 Rich Brooks will present a paper titled “Optimizing the Cleaning Process to Remove Flux Residues Under Low Profile Components” at the upcoming SMTA Houston Expo and Tech Forum.
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Tuesday, 09 February 2010 |
 Keith Sweatman will present a paper titled “The Relationship between Whisker Growth and Corrosion in Sn-3.0Ag-0.5Cu” at the upcoming TMS 2010 Annual Meeting & Exhibition. |
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Tuesday, 09 February 2010 |
 New mobile application gives users anytime, anywhere access to Digi-Key |
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Tuesday, 09 February 2010 |
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The company’s series of units - 1000, 7000 and 9000 - have a capacity range of 5-20 kg that will cover any wave solder machine needs. |
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Tuesday, 09 February 2010 |
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The new facility will be a big advantage to the European sector. |
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Tuesday, 09 February 2010 |
 MIDs are molded plastic components that are laser activated and then selectively metalized with copper, nickel, and gold. |
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Monday, 08 February 2010 |
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A full technical programme for DATE 2010, the major global event in Europe which is set to shape the future of the worldwide electronics industry, is now available. |
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Monday, 08 February 2010 |
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Multi-level Production Collaboration Includes Wet Processing Tools And Materials For Alchimer’s Through-Silicon Via Platform |
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Monday, 08 February 2010 |
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‘Top Global EMS Provider’ to exhibit services at MD&M West 2010 in Anaheim, California, February 9-11, 2010 |
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Monday, 08 February 2010 |
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CYBERSOLV®141-R can be used as a replacement for HFC 141B precision cleaning applications, and is safe and effective to use for bench top electronics cleaning. |
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Monday, 08 February 2010 |
 A flying probe test can be carried out at such high speeds as a maximum cycle time of 0.05 seconds per step, with a probing pitch of 0.2 mm at a minimum. |
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Monday, 08 February 2010 |
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The one-day seminars introduce Parylene coating solutions for the medical device, electronics, automotive and aerospace industries. |
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Monday, 08 February 2010 |
 The sytem also ensures a robust test handling process even for small packages. |
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 