Industry Blogs

Top blogs
Association News

Select a news topic , then select a news article to read. Topics from all our news sections are listed below the section links.

Association news Europe | Association news North America



iNEMI Members Release Position Statement on the Definition of “Low Halogen” for Electronic Products PDF Print E-mail
Thursday, 02 July 2009
Statement defines BFR/CFR/PVC-Free
 
Ball Grid Array, Land Grid Array and Stack Package Design and Assembly Seminar PDF Print E-mail
Tuesday, 30 June 2009
Wednesday 2nd September
Bedfordshire Golf Club, Spring Lane, Stagsden, Bedford
 
New SMTA Webtorial Announced PDF Print E-mail
Monday, 29 June 2009
Just like a webinar, a webtorial takes advantage of instant communication via telephone and internet to simulate a tutorial.
 
MEPTEC and SMTA Announce Medical Electronics Symposium Collaboration PDF Print E-mail
Monday, 29 June 2009
SMTA and MEPTEC will combine their symposia into one event for 2009.
 
IPC Midwest Technical Conference Hits Quality, Reliability and Counterfeiting Head On PDF Print E-mail
Thursday, 25 June 2009
A Taste of “Reality PCB” Comes to the Midwest
 
3rd International Symposium on Tin Whiskers - One more week to register! PDF Print E-mail
Thursday, 18 June 2009
June 23-24, 2009
Technical University of Denmark
Lyngby, Denmark
 
Revised IPC Standard on Immersion Silver Plating Establishes Maximum Deposit Thickness PDF Print E-mail
Wednesday, 17 June 2009
This newly revised specification sets the requirements for the use of immersion silver (IAg) as a surface finish for printed boards.
 
LORD Corporation’s Sara Paisner Elected President Of IMAPS carolinas Chapter PDF Print E-mail
Wednesday, 17 June 2009
Sara PaisnerAt LORD, Paisner leads projects focused on developing the company’s next generation of thermal interface gels, greases and adhesives for the microelectronics industry.
 
South East Asia Technical Conference on Electronics Assembly Technologies PDF Print E-mail
Monday, 15 June 2009
November 19-20, 2009
Penang, Malaysia - In conjunction with the SMTA Penang Academy and 2009 SMTA Penang Tabletop Exhibition
Abstract Deadline: July 6, 2009
 
Only 1 week left to register for the EIPC Summer Conference in St. Michael! PDF Print E-mail
Wednesday, 10 June 2009

EIPC Summer Conference
St. Michael, Lungau, Austria
June 18 & 19, 2009

 
SMTA 25th Anniversary Celebration at SMTAI Announced PDF Print E-mail
Monday, 08 June 2009
Registration for the dinner will be available on the SMTAI registration form online by the end of June.
 
IPC statistical report shows decline continuing and first signs of recovery PDF Print E-mail
Friday, 05 June 2009
IPC's global statistical programs for several key industry segments all show worsening year-on-year growth rates in first quarter 2009, after growth rates turned negative in late 2008.
 
Professor Rao Tummala to Present Keynote at 2009 International Wafer-Level Packaging Conference PDF Print E-mail
Wednesday, 03 June 2009
Prof. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech since 1994.
 
Peter Barry, Mission Assurance Manager at Jet Propulsion Laboratory, to Present Keynote at SMTAI2009 PDF Print E-mail
Tuesday, 26 May 2009
Peter will present an overview of the role that mission assurance management plays in JPL projects.
 
IPC Executive Webcast Series PDF Print E-mail
Tuesday, 26 May 2009
IPC executive webcasts offer insight into current economic trends and future industry market opportunities
 
Medal for Engelmaier PDF Print E-mail
Tuesday, 26 May 2009
Werner EngelmaierThe medal is given every five years; this year was the 130-year anniversary of the founding of the Technologisches Gewerbe Museum.
 
ITRI forges further links with China PDF Print E-mail
Friday, 22 May 2009
ITRI has signed a Co-operation Agreement with the Chinese Solder Association which commits the two organisations to a number of joint initiatives.
 
IPC Issues call for participation for 2010 IPC APEX EXPO™ PDF Print E-mail
Thursday, 21 May 2009
A 300-word abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted by July 17, 2009.
 
3rd International Symposium on Tin Whiskers - Register Now PDF Print E-mail
Wednesday, 20 May 2009
This symposium will cover case histories, theories of tin  whisker growth, experiments and results, risk evaluation methods, and risk mitigation strategies.
 
Communication guide on declarable substance content in electrotechnical products released PDF Print E-mail
Wednesday, 20 May 2009
An industry materials declaration guide that facilitates reporting of material content information across the global electrotechnical supply chain.
 
<< Start < Prev 1 2 3 4 5 6 7 8 9 10 Next > End >>

Results 1 - 24 of 513

Related Items



Featured Interview

Interview—Jeff Timms, Microscan

Jeff Timms, president of Microscan since 2007, has been focusing these past two years on bringing the company to the forefront of the precision data acquisition and control solutions industry.

 

Small Matters

IC Packaging Technology Retrospective - Part 3

Part 2 of this retrospective, seen in last month’s issue of Global SMT and Packaging, took a bit of a detour from the topic to explore the reasoning and the impact of the ‘80% Rule.’

 

Lead-Free Matters

Shear Testing of BGA Pads – Pads are not as good as they were?

Shear force measurement is a common and quick way of destructively assessing solder joints and complement pull strength measurements.

 

Global Business

Sobering first quarter

Modest seasonal & cyclical recovery now underway.

 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff