The term/concept of synergy seems very apt when applied to the interaction of the Occam process solderless assembly concept in combination with a unique PCB interconnection technology called twisted wire interconnect or TWI.

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

Normaly connectors in pin-in-hole intrusive reflow have the greatest impact on reflow delta T because they are BIG, so what happens with a higher reflow temperature with tin/copper solder paste?

As many engineers and rework staff know, there are a wide range of techniques for replacing BGA components on a board assembly.

During the soldering operation, copper is dissolved by tin to form a tin/copper intermetallic, and the amount dissolved is dependent on the soldering process, solder alloy, surfaces to be joined, temperature, time and solder flow rate.

The electronics industry’s mantra has for many years been "Smaller, Faster, Lighter, Better and Cheaper."

Shear force measurement is a common and quick way of destructively assessing solder joints and complement pull strength measurements.

Part 2 of this retrospective, seen in last month’s issue of Global SMT and Packaging, took a bit of a detour from the topic to explore the reasoning and the impact of the ‘80% Rule.’

Part one left off noting that surface mount brought with it significant advantages to IC packaging but also that there was need to provide guidance for future development. The result of that effort is something that is now known as the ‘80% rule.’

There is definitely an increasing interest in conformal coating for electronics.