Part 2 of this retrospective, seen in last month’s issue of Global SMT
and Packaging, took a bit of a detour from the topic to explore the
reasoning and the impact of the ‘80% Rule.’
Part one left off noting that surface mount brought with it significant
advantages to IC packaging but also that there was need to provide
guidance for future development. The result of that effort is something
that is now known as the ‘80% rule.’
Written by PiP, PoP and PuP—Package with package construction options
Monday, 06 April 2009
Since the beginning, all IC packages have been designed to perform the
basic tasks of interconnecting and protecting the semiconductor die and
making it useful for interconnection at the next level.
All IC packaging technology structures since the invention of the
integrated circuit itself have been tasked to perform, at a minimum,
the simple and fundamental tasks of interconnecting and protecting the
semiconductor die and making it useful for interconnection at the next
level.
Jeff Timms, president of Microscan since 2007, has been focusing these
past two years on bringing the company to the forefront of the
precision data acquisition and control solutions industry.