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Are we there yet? PDF Print E-mail
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Columns - Joe Fjelstad
Written by Joe Fjelstad   
Tuesday, 08 July 2008

The ongoing journey to co-design of chip, package and substrate.

 
Ball grid array & lead-free assembly defects, part 1 PDF Print E-mail
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Columns - Bob Willis
Written by Bob Willis   
Monday, 16 June 2008

Over the last few years I have been asked to examine many different ball grid array (BGA) defects from assembly and on field failures here are a selection of the defects and some of the popular causes.

 
Change in the electronics industry – slow but inevitable PDF Print E-mail
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Columns - Joe Fjelstad
Written by Joe Fjelstad   
Monday, 09 June 2008

Approaching four decades of working in the electronics interconnection industry, it appears to this observer that, when looking back over all those years, the electronics interconnection manufacturing industry has been on a treadmill of sorts and changing ever so slowly.

 
Static control - Training is still the key to success PDF Print E-mail
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Columns - Bob Willis
Written by Global SMT & Packaging   
Wednesday, 21 May 2008
The electronics industry is continually faced with problems that take time and money to solve. Many of the problems are by no means new. Possibly they may be areas that were not considered important.
 
"REACH for the sky…" PDF Print E-mail
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Columns - Joe Fjelstad
Written by Global SMT & Packaging   
Wednesday, 14 May 2008
Will the latest bit of environmental legislation be a hold up?
 
BGA & stack packages - making dummy parts PDF Print E-mail
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Columns - Bob Willis
Written by Bob Willis   
Monday, 21 April 2008


Ball Grid Array BGAs are a widely used technology in a vast range of products, including consumer, telecommunications and office-based systems.

 
A brief history of embedded device technology PDF Print E-mail
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Columns - Joe Fjelstad
Written by Joe Fjelstad   
Wednesday, 09 April 2008

Electronics manufacturing technology has evolved slowly since its beginnings. 

 
New finish off to a nice start PDF Print E-mail
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Columns - Joe Fjelstad
Written by Joe Fjelstad   
Monday, 17 March 2008

Soldering in the legislatively imposed era of lead-free solder has resulted in some significant challenges being thrust upon the electronics assembly industry.

 
Practical selection/problems for SMT adhesives PDF Print E-mail
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Columns - Bob Willis
Written by Bob Willis   
Monday, 17 March 2008

Surface mount technology (SMT) first started with the introduction of mixed technology designs incorporating components mounted on the underside of the circuit board.  

 
Identification of assembly and soldering defects today – history tomorrow PDF Print E-mail
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Columns - Bob Willis
Written by Bob Willis   
Tuesday, 12 February 2008

How often have you solved assembly and soldering problems only to have them come back to haunt you in six months’ time?

 
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