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Written by Shubo Gao and David M. Jacobson
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Thursday, 24 July 2008 |
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Lead-free processes for reflow and wave soldering are well documented, but this is not the case for hand soldering, which is still used for specialised electronic products. This article describes the selection of solder and board finishes that suit hand soldering and important issues affecting the choice. |
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Written by Gordon Christison
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Tuesday, 08 July 2008 |
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 Techsearch has predicted a compound annual growth rate of more than 24% for wafer-level packages between 2005 and 2010. Contract electronics manufacturers and original design manufacturers face a range of handling problems when using these small silicon devices in assemblies.
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Written by Brian Toleno, Ph.D., and Dan Maslyk
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Wednesday, 02 July 2008 |
 Increased functionality and smaller devices are significant drivers in innovative packaging designs. |
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Written by Sheila Hamilton, Technical Director, Teknek
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Wednesday, 25 June 2008 |
 Presenting the contamination analysis in this way makes it immediately obvious where housekeeping procedures or manufacturing protocols need to be increased or changed within the department. |
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Written by Hunter Paterson, Product Manager, Teknek
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Tuesday, 24 June 2008 |
 Research has shown that 80% of contaminants are introduced in to a “clean area” by people and products, 15% is generated by the products themselves and 5% is actually produced by the room and filtration system. |
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Written by Giles Humpston
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Monday, 16 June 2008 |
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The continued drive toward solid state imagers with greater pixel numbers and smaller pixels adversely affects yields, particularly through physical contamination during assembly of the camera module. |
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Written by Dr. T. Nguyen & Vern Harrison
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Monday, 16 June 2008 |
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Lean manufacturing is far from a new concept, and many within the electronics assembly (EA) industry are already familiar with the principles and concepts behind it. |
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Written by Sara N. Paisner, PhD
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Monday, 16 June 2008 |
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Higher power chips have resulted from a variety of new developments in the electronics industry.
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Written by Chris Anglin
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Monday, 09 June 2008 |
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The purpose of a solder paste print evaluation is to observe variation in transfer efficiency to the assembly process under conditions that permit careful scrutiny. |
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Written by Dipl.-Ing. (FH) Florian Hierl
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Wednesday, 21 May 2008 |
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The market for contactless labels has passed through the trough and out the other side—RFID is gaining momentum again: In 2007, 144 million RFID tags were sold in the EU alone. |
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Written by Joanna Kristine Wildhart and Moody Dreiza
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Wednesday, 14 May 2008 |
 This paper covers the surface mount and package stacking assembly challenges related to high density package-on-package (PoP) utilizing solder-on-pad (SOP) technology. |
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Written by Etienne Witte and Paul Austen
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Wednesday, 07 May 2008 |
 This article describes thermal profiling hardware and process management software solutions as used at EMS provider Axiom Electronics LLC to meet the thermal profiling challenges of today’s microelectronics environment. |
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Written by Mike Bixenman and Steve Stach
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Wednesday, 30 April 2008 |
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 Innovative electronic assembly designs strive to increase functionality over smaller surface areas. Highly dense circuit assembly designs increase the cleaning challenge.
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Written by Dawn Poirier
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Wednesday, 16 April 2008 |
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 The EMS industry has created many business models, including those where OEMs provide value-added assembly services in addition to a proprietary product.
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Written by Sjef van Gastel
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Wednesday, 09 April 2008 |
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 As the drive towards assembly miniaturization continues and surface
mount technology matures, components are becoming ever smaller and
thinner.
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Written by T. Scimeca, G. Sikorcin, and T. Lentz
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Wednesday, 02 April 2008 |
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 The solder surface produced on bare printed circuit boards by hot air solder leveling (HASL) has been used extensively as a solderable finish for many years.
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Written by Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer
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Wednesday, 05 March 2008 |
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 Three full-field optical techniques, shadow moiré, fringe projection, and digital image correlation (DIC), are used to measure temperature-dependent warpage....
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Written by Robert N. Jarrett, Jordan P. Ross, Ross Berntson
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Wednesday, 05 March 2008 |
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 Metal thermal interface materials (TIMs) offer substantially higher thermal conductivity than other commercially available TIMs.
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Written by Atilim Demirtas
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Wednesday, 05 March 2008 |
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 This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required.
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Written by Pierre Chatain
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Wednesday, 06 February 2008 |
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 Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines.
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