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Written by Gordon Christison
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Tuesday, 08 July 2008 |
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 Techsearch has predicted a compound annual growth rate of more than 24% for wafer-level packages between 2005 and 2010. Contract electronics manufacturers and original design manufacturers face a range of handling problems when using these small silicon devices in assemblies.
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Written by Brian Toleno, Ph.D., and Dan Maslyk
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Wednesday, 02 July 2008 |
 Increased functionality and smaller devices are significant drivers in innovative packaging designs. |
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Written by Sheila Hamilton, Technical Director, Teknek
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Wednesday, 25 June 2008 |
 Presenting the contamination analysis in this way makes it immediately obvious where housekeeping procedures or manufacturing protocols need to be increased or changed within the department. |
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Written by Hunter Paterson, Product Manager, Teknek
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Tuesday, 24 June 2008 |
 Research has shown that 80% of contaminants are introduced in to a “clean area” by people and products, 15% is generated by the products themselves and 5% is actually produced by the room and filtration system. |
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Written by Giles Humpston
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Monday, 16 June 2008 |
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The continued drive toward solid state imagers with greater pixel numbers and smaller pixels adversely affects yields, particularly through physical contamination during assembly of the camera module. |
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Written by Dr. T. Nguyen & Vern Harrison
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Monday, 16 June 2008 |
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Lean manufacturing is far from a new concept, and many within the electronics assembly (EA) industry are already familiar with the principles and concepts behind it. |
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Written by Sara N. Paisner, PhD
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Monday, 16 June 2008 |
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Higher power chips have resulted from a variety of new developments in the electronics industry.
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Written by Chris Anglin
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Monday, 09 June 2008 |
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The purpose of a solder paste print evaluation is to observe variation in transfer efficiency to the assembly process under conditions that permit careful scrutiny. |
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Written by Dipl.-Ing. (FH) Florian Hierl
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Wednesday, 21 May 2008 |
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The market for contactless labels has passed through the trough and out the other side—RFID is gaining momentum again: In 2007, 144 million RFID tags were sold in the EU alone. |
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Written by Joanna Kristine Wildhart and Moody Dreiza
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Wednesday, 14 May 2008 |
 This paper covers the surface mount and package stacking assembly challenges related to high density package-on-package (PoP) utilizing solder-on-pad (SOP) technology. |
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Written by Etienne Witte and Paul Austen
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Wednesday, 07 May 2008 |
 This article describes thermal profiling hardware and process management software solutions as used at EMS provider Axiom Electronics LLC to meet the thermal profiling challenges of today’s microelectronics environment. |
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Written by Mike Bixenman and Steve Stach
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Wednesday, 30 April 2008 |
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 Innovative electronic assembly designs strive to increase functionality over smaller surface areas. Highly dense circuit assembly designs increase the cleaning challenge.
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Written by Dawn Poirier
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Wednesday, 16 April 2008 |
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 The EMS industry has created many business models, including those where OEMs provide value-added assembly services in addition to a proprietary product.
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Written by Sjef van Gastel
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Wednesday, 09 April 2008 |
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 As the drive towards assembly miniaturization continues and surface
mount technology matures, components are becoming ever smaller and
thinner.
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Written by T. Scimeca, G. Sikorcin, and T. Lentz
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Wednesday, 02 April 2008 |
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 The solder surface produced on bare printed circuit boards by hot air solder leveling (HASL) has been used extensively as a solderable finish for many years.
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Written by Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer
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Wednesday, 05 March 2008 |
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 Three full-field optical techniques, shadow moiré, fringe projection, and digital image correlation (DIC), are used to measure temperature-dependent warpage....
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Written by Robert N. Jarrett, Jordan P. Ross, Ross Berntson
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Wednesday, 05 March 2008 |
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 Metal thermal interface materials (TIMs) offer substantially higher thermal conductivity than other commercially available TIMs.
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Written by Atilim Demirtas
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Wednesday, 05 March 2008 |
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 This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required.
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Written by Pierre Chatain
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Wednesday, 06 February 2008 |
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 Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines.
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Written by Alex Mangroli and Kris Vasoya
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Friday, 04 January 2008 |
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 Engineers are always striving to make a lighter, faster and stronger PCB.
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