Different devices demand different processes and safety; however, temperature of the component and reliability are often not included in the tool selection method.

When defining an inspection strategy for your manufacturing processes, there are many factors that need to be be considered

Solid state imagers are being incorporated in an ever–expanding diversity of products.

Metal based wafer bonding for WLP has several advantages, including enhanced hermeticity, and it facilitates vertical integration.

The following article is a series of "from the trenches" stories taken both from the perspective of an electronics manufacturer and an environmental compliance consultancy.

Solder joint integrity may be compromised through mechanical shock, particularity in portable electronics using area array devices with solder balls for interconnections.

Lean Sigma, an approach that has been in practice for several years, mixes the lean manufacturing concept and problem solving approach with Six Sigma for a more efficient manufacturing process.

The expansion of business into alternative energy, green components and energy–efficient components is having a significant impact on the electronics and semiconductor industry.

EMS providers rely on component suppliers to ensure that the lead–free transition on the component terminations is seamless to their soldering processes, but that rarely happens.

This article discusses new developments in stencil laser and material technology and shows how these advancements, when combined, provide comparable and cost–effective alternatives to traditional electroformed stencils. The results are improved yields, cycle time reductions and significant cost savings.

Although the advantages of hot air solder leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized, in the years leading up to the implementation of the EU RoHS Directive in July 2006, the conventional wisdom was that it would have no place in the new lead–free electronics manufacturing technology.

Changes in the domestic printed circuit board assembly industry have resulted in a dominant shift to a high–mix, low–volume (HMLV) manufacturing environment resulting in a high frequency of line changeovers.

The electronics industry is under pressure to eliminate brominated flame retardants (BFRs) that were once widely used in electronics housings and cases and are still used extensively in printed circuit boards.

While already in widespread use in the consumer market for handheld, portable electronics, package on package (PoP) continues to gain in popularity and seems likely to be implemented in other types of electronic assemblies.

Do you know what level of applied strain your printed circuit board assembly realizes in your fielded state?