Hot air solder leveling in the lead-free era Keith Sweatman, Nihon Superior Co., Ltd
Vapor phase vs. convection reflow in RoHS-compliant assembly
Dan Coada, EPIC Technologies
Conquering SMT stencil printing challenges with today’s miniature components Robert F. Dervaes, Fine Line Stencil, Inc.; Jeff Poulos, Alternative Solutions, Inc.; and Scott Williams, Ed Fagan, Inc.
Strain gage testing: the delta effect of thermal cycle testing
by Mark T. McMeen
Resolution of solder voids in pin-in-hole product
by Condia Yu, Eddie W. W. Tang, Jack To, Ka Wai Chan, Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie Kobeda,
Sunil Nigam, Jeffrey Taylor & Kaspar Tsang.
A new angle on printing George Babka, Scott Zerkle, Frank Andres,
Rahul Raut, Westin Bent and
Dave Connell
"Molded underfill process for the SiP" Tae Hyun Kim, Ki Chan Kim, Sung Yi, Dong-Kuk Kim, Tae Sung Jung, Jin Su Kim, and Joseph Y. Lee, Samsung Electro-Mechanics Co., Ltd.
"Thermally conductive liquid materials for electronics packaging" by Sanjay Misra, Ph.D., The Bergquist Company
"Reflow significance on package-on-package reflow assembly" by S. Manian Ramkumar, Ph.D., RIT, and Brian O’Leary, KIC
Test data requirements for assessment of alternative Pb-free solder alloys by Helen Holder, Gregory Henshall, Aileen Maloney, et al, Hewlett-Packard Company
Lasers—a flexible tool for PCB and device rework by Bob Wettermann, CIT, BEST Inc.
Can lead-free and lead-containing PCBs be cleaned in a single process? by Dipl. Ing. Stefan Strixner, ZESTRON Europe
Jeff Timms, president of Microscan since 2007, has been focusing these
past two years on bringing the company to the forefront of the
precision data acquisition and control solutions industry.