9.6 - June 2009

• "RoHS war stories" by Bev Christian, Research In Motion, and Michael Fry, Intertek Ageus Solutions
• "Energy measurement: The main metric for high strain rate bond testing of solder balls" by Dr. Stephen Clark, Dage Precision Industries
• "A revolution in wave soldering" by Peter Grundy, ITM Consulting

• "EMS ‘Lean Sigma’ shortens cycle time, reduces costs & improves quality" by Maths E. Andersson, Elcoteq, Luxembourg
• "Jetting fluids in non-traditional packaging and assembly applications" by Alec J. Babiarz, Asymtek, Carlsbad, CA, USA 
• Cleaning chemistry vs. mechanical impingement

In this issue: 

• Hot air solder leveling in the lead-free era 
  Keith Sweatman, Nihon Superior Co., Ltd
  
• Vapor phase vs. convection reflow in RoHS-compliant assembly
  Dan Coada, EPIC Technologies
  
• Conquering SMT stencil printing challenges with today’s miniature components
  Robert F. Dervaes, Fine Line Stencil, Inc.; Jeff Poulos, Alternative Solutions, Inc.; and Scott Williams, Ed Fagan, Inc.

And more! 

• iNEMI project evaluates BFR-free PCB materials
  Stephen Tisdale, Gary B. Long, Roger Krabbenhoft, Kostas Papathomas, Ph.D., and Terry Fischer
• PoP: An EMS perspective on assembly, rework and reliability Heather McCormick, Irene Sterian, Jimmy Chow, Mike Berry, Joel Trudell and Roden Cortero
• Efficient line changeover: the key to lean manufacturing
  Douglas Farlow
  

• Strain gage testing: the delta effect of thermal cycle testing
  by Mark T. McMeen
• Resolution of solder voids in pin-in-hole product by Condia Yu, Eddie W. W. Tang, Jack To, Ka Wai Chan, Brian Carlson, Rick Chen, PS Hou, Phil Isaacs, Eddie Kobeda, Sunil Nigam, Jeffrey Taylor & Kaspar Tsang.
• A new angle on printing
  George Babka, Scott Zerkle, Frank Andres, Rahul Raut, Westin Bent and Dave Connell

And more!

• Electrostatic discharge (ESD) and automated handling processes
  Dipl.-Ing. Hartmut Berndt, B.E.STAT European ESD Competence Centre
• PCB layout and soldering nozzle design in selective soldering processes Reiner Zoch, SEHO Systems GmbH
• Supporting niche service needs at a regional level—a case study
  Barry Reece and Ken Russell, Clover Electronics
  

Issue 9.1 - January 2009

• "Electrostatic discharge (ESD) and automated handling processes" by Dipl.-Ing. Hartmut Berndt, B.E.STAT European ESD Competence Centr
• "PCB layout and soldering nozzle design in selective soldering processes" by Reiner Zoch, SEHO Systems Gmb
• "Supporting niche service needs at a regional level—a case study" by Barry Reece and Ken Russell, Clover Electronic
• Special Feature: Four industry suppliers come of age 

And more...

Issue 8.12 - December 2008

2008 World Distributor Review

• "Molded underfill process for the SiP" Tae Hyun Kim, Ki Chan Kim, Sung Yi, Dong-Kuk Kim, Tae Sung Jung, Jin Su Kim, and Joseph Y. Lee, Samsung Electro-Mechanics Co., Ltd.
• "Thermally conductive liquid materials for electronics packaging" by Sanjay Misra, Ph.D., The Bergquist Company
• "Reflow significance on package-on-package reflow assembly" by S. Manian Ramkumar, Ph.D., RIT, and Brian O’Leary, KIC 

And more...

Issue 8.11 - November 2008

• Test data requirements for assessment of alternative Pb-free solder alloys by Helen Holder, Gregory Henshall, Aileen Maloney, et al, Hewlett-Packard Company
• Lasers—a flexible tool for PCB and device rework by Bob Wettermann, CIT, BEST Inc.
• Can lead-free and lead-containing PCBs be cleaned in a single process? by Dipl. Ing. Stefan Strixner, ZESTRON Europe
  
• Global Technology Awards winners

And more...

Issue 8.10 - October 2008

• 01005 assembly process—from the board design to reflow
• SPC and usage difficulties in SMT
• Process capability index: A better way to assess equipment capability
• Understanding the hidden reactions and the importance of profile—part 3

And more...