• Investigation and development of tin-lead and lead-free solder pastes to reduce head-in-pillow defects by Jasbir Bath and Roberto Garcia, Christopher Associates Inc., and Noriyoshi Uchida, Hajime Takahashi, Gordon Clark, Manabu Itoh, Koki Solder
• China’s export trade for gray-market handsets by Kevin Wang, iSuppli
• Combating counterfeit components—industry initiatives for a global problem by Nigel Burtt, Enjaybee Associates 

And more!

9.11 - November 2009

• Safe detection of hidden faults - Jens Kokott, GOEPEL electronic
  
• Reducing copper dissolution in lead-free assembly - D. Di Maio, C. P. Hunt and B. Willis
  
• Collaborative cleaning process innovations from managing experience and learning curves - Mike Bixenman, DBA and Dirk Ellis, Kyzen Corporation, and John Neiderman, Speedline Technologies

and more! 

• What you need to know before buying your AOI solution by Paul Groome, Machine Vision Products
• Which tools are best for SMT rework—conduction or convection? by Paul Wood, OK International
• Business process management for improved productivity and customer satisfaction by Maths E. Andersson, Elcoteq
  

9.9 – September 2009

• PoP (package on package) and vapor phase technology—Dan Coada, EPIC Technologies
• A baseline study of stencil and screen print processes for wafer backside coating—Jeff Schake, DEK USA, Inc.
• Special Packaging Feature—Imbedded Component/Die Technology: Is it ready for mainstream design applications?—Casey H. Cooper, Mark T. McMeen and Jim D. Raby, STI Electronics, Inc.

And more!

9.8 – August 2009

• "Establishing a precision stencil printing process for miniaturized electronics assembly" by Chris Anglin, Indium Corporation
• "Moving AOI beyond the grey world" by Shoich Rashed, Marantz Business Electronics Europe
• "Solder joint reliability: acceleration transforms and acceleration factors" by Werner Engelmaier
  

9.6 – June 2009

• "RoHS war stories" by Bev Christian, Research In Motion, and Michael Fry, Intertek Ageus Solutions
• "Energy measurement: The main metric for high strain rate bond testing of solder balls" by Dr. Stephen Clark, Dage Precision Industries
• "A revolution in wave soldering" by Peter Grundy, ITM Consulting

9.7 – July 2009

• "Metal–based wafer level packaging" by Shari Farrens, Ph.D., SUSS MicroTec
• "Cost reduction of wafer level packaging by using established materials from non–electronics industries" by Giles Humpston, Tessera
• "Case Study: Reducing recall risk down to no more than three PCB panels"

• "EMS ‘Lean Sigma’ shortens cycle time, reduces costs & improves quality" by Maths E. Andersson, Elcoteq, Luxembourg
• "Jetting fluids in non–traditional packaging and assembly applications" by Alec J. Babiarz, Asymtek, Carlsbad, CA, USA 
• Cleaning chemistry vs. mechanical impingement

In this issue: 

• Hot air solder leveling in the lead–free era 
  Keith Sweatman, Nihon Superior Co., Ltd
  
• Vapor phase vs. convection reflow in RoHS–compliant assembly
  Dan Coada, EPIC Technologies
  
• Conquering SMT stencil printing challenges with today’s miniature components
  Robert F. Dervaes, Fine Line Stencil, Inc.; Jeff Poulos, Alternative Solutions, Inc.; and Scott Williams, Ed Fagan, Inc.

And more! 

• iNEMI project evaluates BFR–free PCB materials
  Stephen Tisdale, Gary B. Long, Roger Krabbenhoft, Kostas Papathomas, Ph.D., and Terry Fischer
• PoP: An EMS perspective on assembly, rework and reliability Heather McCormick, Irene Sterian, Jimmy Chow, Mike Berry, Joel Trudell and Roden Cortero
• Efficient line changeover: the key to lean manufacturing
  Douglas Farlow