Issue 8.7 - July 2008

• "Understanding hidden reactions and the importance of profile in reflow soldering, part 1" by Dr. S. Manian Ramkumar, Anand Kannabiran, Aarthi Baskaran, Dr. Viswam Puligandla,  Bjorn Dahle
• "PCB production & test: Tips from pros on lead-free processes, part 1—issues in hot air solder levelling (HASL)" by Thomas Berger 
• Case Study: Solder dross recycling: Tried, tested and proven at Kimball Electronics
  
• Case Study: Electronic design & engineering firm expands sales by automating PCB assembly
• Interview: Bernd Schenker—ERSA GmbH

...and more

Issue 8.6 - June 2008

"Process and assembly methods for increased yield of PoP devices" by Brian Toleno, Ph.D., and Dan Maslyk

"Suitable choices for lead-free hand soldering" by Shubo Gao and David M. Jacobson

"Pushing the barriers of wafer level device integration" by Gordon Christison

...and more

Issue 8.5 - May 2008

• "Tools & methods for lean production management in EA" by Dr. T. Nguyen & Vern Harrison
• "Improving print performance using area ratio sensitivity analysis" by Chris Anglin
• "Wafer-level cavity package with via-through-pad interconnects" by Giles Humpston
• "Nanotechnology and mathematical methods for high-performance thermal interface materials" by Sara N. Paisner, PhD

...and more.

Issue 8.4 - April 2008

• Cleaning process integration of cleaning material with cleaning equipment by Mike Bixenman and Steve Stach
• Thermal profiling optimizes printed circuit board assembly by
  Etienne Witte and Paul Austen
• Challenges for high density PoP (package-on-package) utilizing SoP (solder-on-pad) by Joanna Kristine Wildhart and Moody Dreiza

...and more.

Issue 8.3 - March 2008

• Process requirements for high density SMD placement by Sjef van Gastel
• Lead free HASL by T. Scimeca, G. Sikorcin, and T. Lentz
• Reducing cost in the EMS supply chain through niche sourcing by Dawn Poirier

...and more.

Issue 8.2 - February 2008

• Full metal TIMs by Robert N. Jarrett, Jordan P. Ross, Ross Berntson
• Comparing techniques for temperature-dependent warpage measurement by Jiahui Pan, Ryan Curry, Neil Hubble and Dirk Zwemer
• Pin in paste stencil design for notebook mainboard by Atilim Demirtas

...and more. Click for full table of contents.

Issue 8.1 - January 2008

• Strength of lead-free bga spheres in high speed loading by Keith Sweatman, Shoichi Suenaga, and Tetsuro Nishimura
• Placement optimisation in a lean manufacturing environment by Pierre Chatain
• Global Technology Awards roll of honour

...and more. Click for full table of contents.

Issue 7.12 - December 2007

• Special Feature: Movers and shakers
• Optimizing thermal and mechanical performance in PCBs by Alex Mangroli and Kris Vasoya
• Fundamentals of solder paste technology by Dosten Baluch & Gerard Minogue

...and more. Click for full table of contents.
 

Issue 7.11 - November 2007

• Reducing power consumption by selecting optimal oven recipes by Abhinav Ajmera, Sreekanth Varma Penmatsa and Prof. S. Manian Ramkumar
• Film vs. paste: Die attach options for stacked die applications by James T. Huneke, Robert Chu, Jin-O Choi, Howard Yun and Han Wu
• Embedded thermoelectric cooling by Jesko von Windheim
• SnAgCuBi and SnAgCuBiSb solder joint properties investigations by R. Kisiel, K. Bukat K., J. Sitek, W. Gąsior, Z. Moser and J. Pstruś

...and more. Click for full table of contents.

Issue 7.10 - October 2007

• Pin-in-hole reflow (PIHR) and lead-free solder joints by David Bernard, Bob Willis
• Chip packaging 2.0 – User-definable chip pinout packaging for optimized PCB design by Martin Hart
• Package on package (PoP) process development and reliability evaluation by Jonas Sjoberg, David A. Geiger, Todd Castello and Dr. Dongkai Shangguan
• Changeover optimization in electronics assembly by Mika Johnsson and Tommi Puustelli

...and more. Click for full table of contents.