Issue 8.12 – December 2008

2008 World Distributor Review

• "Molded underfill process for the SiP" Tae Hyun Kim, Ki Chan Kim, Sung Yi, Dong–Kuk Kim, Tae Sung Jung, Jin Su Kim, and Joseph Y. Lee, Samsung Electro–Mechanics Co., Ltd.
• "Thermally conductive liquid materials for electronics packaging" by Sanjay Misra, Ph.D., The Bergquist Company
• "Reflow significance on package–on–package reflow assembly" by S. Manian Ramkumar, Ph.D., RIT, and Brian O’Leary, KIC 

And more...

Issue 8.11 – November 2008

• Test data requirements for assessment of alternative Pb–free solder alloys by Helen Holder, Gregory Henshall, Aileen Maloney, et al, Hewlett–Packard Company
• Lasers—a flexible tool for PCB and device rework by Bob Wettermann, CIT, BEST Inc.
• Can lead–free and lead–containing PCBs be cleaned in a single process? by Dipl. Ing. Stefan Strixner, ZESTRON Europe
  
• Global Technology Awards winners

And more...

Issue 8.10 – October 2008

• 01005 assembly process—from the board design to reflow
• SPC and usage difficulties in SMT
• Process capability index: A better way to assess equipment capability
• Understanding the hidden reactions and the importance of profile—part 3

And more...

Issue 8.9 – September 2008

• "Optimizing batch cleaning for removing lead–free flux residues on PCA" by Steve Stach, Austin American Corporation, and Mike Bixenman, DBA, Kyzen Corporation
  
  "Compatibility of polymers and fluxes: Getting to the heart of the matter" by Andy Mackie, Ph.D., and Christopher Nash, Indium Corporation
  
  "A Breath of Fresh Air" by Claude W. "Bubba" Powers, Cooper Hand Tools

and more...

Issue 8.8 – August 2008

• "Advances in solder ball placement for surface–mountable packages" by Tom Falcon, DEK Printing Machines Ltd
• "Understanding hidden reactions and the importance of profile in reflow soldering, part 2" by Dr. S. Manian Ramkumar, Mr. Anand Kannabiran and Ms. Aarthi Baskaran, CEMA at RIT; Dr. Viswam Puligandla; Mr. Bjorn Dahle, KIC
• "Parallel print & inspection processes to achieve 100% post–print inspection" by Wolfram Hübsch, ERSA GmbH

...and more.

Issue 8.7 – July 2008

• "Understanding hidden reactions and the importance of profile in reflow soldering, part 1" by Dr. S. Manian Ramkumar, Anand Kannabiran, Aarthi Baskaran, Dr. Viswam Puligandla,  Bjorn Dahle
• "PCB production & test: Tips from pros on lead–free processes, part 1—issues in hot air solder levelling (HASL)" by Thomas Berger 
• Case Study: Solder dross recycling: Tried, tested and proven at Kimball Electronics
  
• Case Study: Electronic design & engineering firm expands sales by automating PCB assembly
• Interview: Bernd Schenker—ERSA GmbH

...and more

Issue 8.6 – June 2008

"Process and assembly methods for increased yield of PoP devices" by Brian Toleno, Ph.D., and Dan Maslyk

"Suitable choices for lead–free hand soldering" by Shubo Gao and David M. Jacobson

"Pushing the barriers of wafer level device integration" by Gordon Christison

...and more

Issue 8.5 – May 2008

• "Tools & methods for lean production management in EA" by Dr. T. Nguyen & Vern Harrison
• "Improving print performance using area ratio sensitivity analysis" by Chris Anglin
• "Wafer–level cavity package with via–through–pad interconnects" by Giles Humpston
• "Nanotechnology and mathematical methods for high–performance thermal interface materials" by Sara N. Paisner, PhD

...and more.

Issue 8.4 – April 2008

• Cleaning process integration of cleaning material with cleaning equipment by Mike Bixenman and Steve Stach
• Thermal profiling optimizes printed circuit board assembly by
  Etienne Witte and Paul Austen
• Challenges for high density PoP (package–on–package) utilizing SoP (solder–on–pad) by Joanna Kristine Wildhart and Moody Dreiza

...and more.

Issue 8.3 – March 2008

• Process requirements for high density SMD placement by Sjef van Gastel
• Lead free HASL by T. Scimeca, G. Sikorcin, and T. Lentz
• Reducing cost in the EMS supply chain through niche sourcing by Dawn Poirier

...and more.