Issue 7.11 – November 2007

• Reducing power consumption by selecting optimal oven recipes by Abhinav Ajmera, Sreekanth Varma Penmatsa and Prof. S. Manian Ramkumar
• Film vs. paste: Die attach options for stacked die applications by James T. Huneke, Robert Chu, Jin–O Choi, Howard Yun and Han Wu
• Embedded thermoelectric cooling by Jesko von Windheim
• SnAgCuBi and SnAgCuBiSb solder joint properties investigations by R. Kisiel, K. Bukat K., J. Sitek, W. Gąsior, Z. Moser and J. Pstruś

...and more. Click for full table of contents.

Issue 7.10 – October 2007

• Pin–in–hole reflow (PIHR) and lead–free solder joints by David Bernard, Bob Willis
• Chip packaging 2.0 – User–definable chip pinout packaging for optimized PCB design by Martin Hart
• Package on package (PoP) process development and reliability evaluation by Jonas Sjoberg, David A. Geiger, Todd Castello and Dr. Dongkai Shangguan
• Changeover optimization in electronics assembly by Mika Johnsson and Tommi Puustelli

...and more. Click for full table of contents.

Issue 7.9 – September 2007

• Wave solder: Process optimization for simple to complex boards by Denis Barbini and Paul Wang
• Solder–free assembly – A more environmentally friendly alternative to lead–free by Joe Fjelstad
• Vapor phase for lead–free reflow by David Suihkonen

...and more. Click for full table of contents.

Issue 7.8 – August 2007

• Optical silicones for use in harsh operating environments by Bill Riegler, Stephen Bruner and Rob Thomaier
• Obtaining and controlling reflow oven cooling rates by Fred Dimock and Rob DiMatteo
• Roxton™, the next generation of SMT nozzles by Dr Hywel Jones
• Beating the chip counterfeiters by Keith Bryant

...and more. Click for full table of contents.

Issue 7.7 – July 2007

• Medical electronics pose unique challenges by Anthony Primavera, Roger Roberts, Ravi Subrahmanyan
• Market trends for 3D stacking by Dr. Eric Mounier
• Liquid tin corrosion and lead free wave soldering by Jim Morris; Matthew J. O’Keefe, Ph.D.; Martin Perez, Ph.D

...and more. Click for full table of contents.

Issue 7.6 – June 2007

• Advanced coating technologies for lead–free solders by Bill Boyd
• iNEMI Updates Tin Whisker Recommendations by Joe Smetana
• Is tin heading for a crisis? (part two) by Peter Kettle

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Issue 7.5 – May 2007

• Global impact of the accelerating cost increase of metals by Bruce S. Moloznik, Mitch Holtzer, Stan Rothschild, Doug Dixon, Ross Berntson
• Reliability of tacky fluxes in varying soldering applications by Brian Smith, Jennifer Allen, John Tuccy
• Measuring true temperature in lead–free assembly by Yoshinobu Anbe
• An economical alternative to boundary scan in memory devices by The IEEE P1581 Working Group

...and more. Click for full table of contents.

Issue 7.4 – April 2007

• Jetting for semiconductor and electronic component packaging by Soeren Hirsch, Soeren Alec J. Babiarz
• Carrier tape for leadfree assembly of FPCBs by Y.M.Lim,K.Y.Park
• Rework of package on package in lead–free array by Paul Wood
• The progress and pitfalls of China's technical standards by Byron Wu

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Issue 7.3 – March 2007

• Characterization methods for mechanical stress caused by packaging processes by Soeren Hirsch, Soeren Majcherek, Bertram Schmidt
• Nanodispensing in high–speed production processes by Dipl.–Ing. (FH) Rainer Möst
• Conformal coating issues: When reliability goes astray by Dr. Helmut Schweigart

...and more. Click for full table of contents.

Issue 7.2 – February 2007

• The validation of SAC305 and SnCu–based solders at the contract assembler level by Peter Biocca, Carlos Rivas
• Process improvement with selective solder by John Weisheit, Tom Barnard
• Evaluation of wafer bumping stencils by Scott F. Popelar, Robert A. Niemet
• Integrating strategic alliances in product development and manufacturing by Larry Fleming

...and more. Click for full table of contents.