Issue 6.8 – September 2006

• How to clean lead–free materials by Thomas M. Forsythe
• Atmospheric plasma – A new surface treatment technology for cleaning PCBs by Rory A. Wolf
• Alternative technologies for lead–free defluxing by Michael T. Konrad

...and more. Click for full table of contents. 

Issue 6.7 – August 2006

• Status of EU RoHS exemptions by John H. Lau
  
• Performance of printable phase change materials by Devesh Mathur, Ph.D.
  
• Evaluating new polyurethane systems (PUR) in micro optics and optical casting by Manfred Supra Ph. D.
  
• Survey of RFID case studies by Francois Monette

Issue 6.6 / June/July 2006

• Standardizing cleanliness criteria for fiber optic connectors cuts costs, improves quality by Tatiana Berdinskikh, Sun–Yuan Huang, Heather Tkalec, Douglas H. Wilson, Frank (Yi) Zhang
• Fine pitch component self–alignment with Sn/Pb and Sn/Ag/Cu solders by Minna Arra, David Geiger, Dongkai Shangguan and Jonas Sjöberg
• Conductive adhesives and Nanotechnology – alternatives for lead–free soldering by Frank Liotine, Jr.

...and more. Click for full table of contents.

Issue 6.5 / May 2006

• "IC package qualification testing for lead–free soldering" by Vern Solberg
• "Thermal process optimization provides reduced energy consumption" by Piotr Kanica
• "High performance flip–chip packages with copper pillar bumping" by Joachim Kloeser, Ernst Weissbach

...and more. Click for full table of contents.

Issue 6.4 / April 2006

• "Single ball reballing and repair of BGA components" by Robert V. Avila
• "Maximizing the 'value–add' of the electronic materials partner" by George A. Toskey
• "Fact and fiction of lead–free soldering" by Keith Sweatman
• "Why solder spikes form" by Yoshinobu Anbe

...and more. Click for full table of contents.

Issue 6.3 / March 2006

• "Advances in jetting small dots of high viscosity fluid for electronic and semiconductor packaging" by Alec J. Babiarz
• "Printing the electronic future" by Dr Peter Harrop
• Global Technology Awards – winners profiles
• Pat Flynn Interview – ECT Technologies Inc.

...and more. Click for full table of contents.

Issue 6.2 / February 2006

• "Understanding stencil requirements for a lead–free mass imaging process" by Clive Ashmore
• The turtle and the hare – beating the RoHS deadline anyway" by Peter Biocca
• "Developing the 01005 stencil printing process" by Joe Belemonte
• Technology focus: Surface mount solder ball assembly

...and more. Click for full table of contents.

Issue 6.1 / January 2006

• "Contamination control in lead–free hand soldering" by Ray Cirimele
•  "Optimizing cleaning energy with spray in air systems – pt 2" by Steve Stach, Mike Bixenman
• "Challenges in 01005 placement" by Parminder Singh
• "Cross cultural selling, think global, act local" by Steve Thurlow

...and more. Click for full table of contents.