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New Digi TransPort™ VPN Concentrator Enables Easy End-to-End Connectivity of Remote Wireless Devices
Friday, 03 July 2009
Digi TransPort VC7400 integration with Digi TransPort and Digi Connect® cellular router reduces complexity of VPN setup; increases reliability
 
Saelig Introduces CANminiBOX™ Fanless CANbus Controllers
Friday, 03 July 2009
Saelig's CANminiBOX™Maintenance-Free CANbus Controller for Embedded Control Applications Offers 128 MB SD-RAM Capabilities, Weighs Less than One Pound
 
Anders Eases Monochrome-to-Colour LCD Migration with Unique Multicolour LCD Technology
Friday, 03 July 2009
Anders' Unique Multicolour LCD TechnologyAnders now offers innovative multicolour Field Sequential LCD display modules - the fastest and most cost-effective path to colour.
 
Seika Machinery, Inc. Features YJ Link Conveyor Systems
Friday, 03 July 2009

Young Jin Conveyors for SPI and AOIBoth systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch screen operation.

 
125-17 - Screen-Printable Solvent-Resistant Flexible Ultraviolet-Curable Coating
Friday, 03 July 2009
125-17, an exceptional dielectric inkA sky-blue ink, this dielectric features extremely low odor, with excellent flow characteristics and print quality.
 
New MATRIX UV Laser for High-Throughput Applications
Thursday, 02 July 2009
Coherent MATRIX UVAll MATRIX lasers are fully RoHS compliant and backed by an 18 month/10,000 hour warranty.
 
3Dconnexion 3D mice now supported by Dassault Systèmes’ CATIA V5R19 SP4
Thursday, 02 July 2009
3Dconnexion 3D mice3Dconnexion’s 3D mice offer CATIA users a more streamlined design process, increased comfort and performance benefits.
 
Cookson Electronics’ Launches ALPHA® CVP 520 Lead-Free Low Temperature Solder Paste
Thursday, 02 July 2009
Cookson Electronics ALPHA® CVP-520 Solder PasteALPHA® CVP-520’s low reflow temperature capability delivers excellent print and reflow process yields for pin-in-through-hole applications.
 
CASCON supports TI TAP transceiver
Thursday, 02 July 2009
Boundary Scan software platform SYSTEM CASCON™ expands support for IEEE1149.1 TAP transceiver by Texas Instruments
 
Digi Announces ZigBee Smart Energy Certified ESP Gateway
Wednesday, 01 July 2009
New comprehensive Smart Energy product family expands iDigi™ Energy offering
 
congatec Introduces New Low-Cost, Low-Power ETX/XTX Module
Wednesday, 01 July 2009
conga-XA945 moduleCombining the Intel® Atom™ Processor N270 with the mobile Intel® 945GME Express chipset makes for powerful graphics performance
 
E-Switch’s Latest Tact Switch is Illuminated with Many Cap Options!
Wednesday, 01 July 2009
TL1220This switch has multiple illuminated cap options that include graphics.
 
Bourns Announces New Power Resistor Products
Wednesday, 01 July 2009

Bourns CRF1206 CRM2512-FT Power ResistorsNew Power Resistors Feature High Power Density and Small Form Factor Design

 
Link Hamson Introduces Hot Beam-05 Underheater
Tuesday, 30 June 2009

Link Hamson's Hot Beam-05 UnderheaterThermally complex soldering processes can be reliably performed using the Hot-Beam-05 underheater.

 
New technology for intelligent in-line network upgrades without disrupting connectivity
Tuesday, 30 June 2009
This allows Napatech adapters to be inserted or removed from a network connection without disrupting network connectivity or requiring the network appliance to be shut down.
 
Seika Machinery, Inc. Features the HIROX MX-BGAZ II Lens
Tuesday, 30 June 2009
HIROX’s MX-BGAZ II LensThe MX-BGAZ II allows inspection of the BGA ball’s upper and lower joints by changing the observation angle through the optical rotary ring.
 
3M Offers Wide Range of Power over Camera Link Cabling Solutions for Machine Vision Applications
Monday, 29 June 2009
The 3M family of 0.8 mm cable assemblies provides a broad range of interface solutions for Camera Link applications.
 
Cardinal Components, Inc., introduces a programmable spread spectrum oscillator "CSSC"
Monday, 29 June 2009
The device is pin compatible with conventional SMD oscillators making its use a simple drop-in replacement.
 
Cookson Electronics Launches ALPHA® CVP-360 Pb-free Solder Paste with Low-Ag SACX® Alloy
Monday, 29 June 2009

ALPHA® CVP-360 Pb-free Solder PasteNew CVP-360 will deliver high productivity and lowest cost of ownership with excellent in-circuit test yields.

 
New MPC® PCB cleaner for low standoff components
Monday, 29 June 2009
The MPC®-cleaning agent provides excellent cleaning performance in capillary spaces.
 
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Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff
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