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Monday, 01 February 2010 |
 The TSic™ series are used for sensing temperature in building automation, automotive, industrial, office automation, white goods and low-power/mobile applications. |
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Monday, 01 February 2010 |
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 Gore hydrophilic ptfe filters for high-purity chemical processing improve flow while maintaining or increasing particle retention
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Monday, 01 February 2010 |
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 BI Technologies develops sample kits with miniature thin film resistor networks configured in isolated and bussed circuits
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Monday, 01 February 2010 |
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 The New Leica TCS STED CW for a Wide Range of Applications in Cell Research and Neuroscience
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Friday, 29 January 2010 |
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MCU enables higher-performing designs in a variety of applications |
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Friday, 29 January 2010 |
 It has Powerful Gate Drive for High Efficiency Buck or Boost DC/DC Converters |
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Friday, 29 January 2010 |
 Our solutions and developments help our customers achieve high yields and top quality results. |
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Thursday, 28 January 2010 |
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 The WM8912 also features a control write sequencer to ensure ease of system design by enabling and disabling the DAC with a single register write.
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Thursday, 28 January 2010 |
 The cables do not require any further adapters but can easily be inserted into the connector manually. |
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Thursday, 28 January 2010 |
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A new addition to the Avery Dennison Specialty Tape Advantage Solutions portfolio |
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Wednesday, 27 January 2010 |
 The world’s most advanced contact cleaning system for the electronics sector |
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Wednesday, 27 January 2010 |
 Designated the Q2119A, this gold ball auto bonder supports a variety of customer needs from prototyping to medium volume production. |
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Wednesday, 27 January 2010 |
 The LT6350 incorporates two op amps and matched resistors to create a differential output from a single-ended high impedance input. |
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Wednesday, 27 January 2010 |
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Silicon-proven 3G DigRF, CSI-2 controller and D-PHY accelerate development of mobile devices |
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Wednesday, 27 January 2010 |
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Compact switch features increased reliability through mounting support, sealing to IP67 specifications... |
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Wednesday, 27 January 2010 |
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 Yamaichi Electronics offers a new manual microSD Card reader PJS008U-3000-0.
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Wednesday, 27 January 2010 |
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The CLM979 feeder can be mounted in parallel to standard SMD component feeders. |
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Tuesday, 26 January 2010 |
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 The CRO2660B-LF is also ideal for automated surface mount assembly and reflow.
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Tuesday, 26 January 2010 |
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The HD-IR is the first 1280 x 1024 pixel camera solution making it the highest resolution infrared camera commercially available. |
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Tuesday, 26 January 2010 |
 The CM-T3530 is the newest addition to Anders’ line of systems-on-module - offering a rich set of multimedia, connectivity and storage features in a credit-card size package. |
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Global SMT RSS feed
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 