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Friday, 03 July 2009 |
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Digi TransPort VC7400 integration with Digi TransPort and Digi Connect® cellular router reduces complexity of VPN setup; increases reliability |
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Friday, 03 July 2009 |
 Maintenance-Free CANbus Controller for Embedded Control Applications Offers 128 MB SD-RAM Capabilities, Weighs Less than One Pound |
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Friday, 03 July 2009 |
 Anders now offers innovative multicolour Field Sequential LCD display modules - the fastest and most cost-effective path to colour. |
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Friday, 03 July 2009 |
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 Both systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch screen operation.
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Friday, 03 July 2009 |
 A sky-blue ink, this dielectric features extremely low odor, with excellent flow characteristics and print quality. |
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Thursday, 02 July 2009 |
 All MATRIX lasers are fully RoHS compliant and backed by an 18 month/10,000 hour warranty. |
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Thursday, 02 July 2009 |
 3Dconnexion’s 3D mice offer CATIA users a more streamlined design process, increased comfort and performance benefits. |
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Thursday, 02 July 2009 |
 ALPHA® CVP-520’s low reflow temperature capability delivers excellent print and reflow process yields for pin-in-through-hole applications. |
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Thursday, 02 July 2009 |
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Boundary Scan software platform SYSTEM CASCON™ expands support for IEEE1149.1 TAP transceiver by Texas Instruments |
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Wednesday, 01 July 2009 |
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New comprehensive Smart Energy product family expands iDigi™ Energy offering |
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Wednesday, 01 July 2009 |
 Combining the Intel® Atom™ Processor N270 with the mobile Intel® 945GME Express chipset makes for powerful graphics performance |
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Wednesday, 01 July 2009 |
 This switch has multiple illuminated cap options that include graphics. |
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Wednesday, 01 July 2009 |
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 New Power Resistors Feature High Power Density and Small Form Factor Design
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Tuesday, 30 June 2009 |
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 Thermally complex soldering processes can be reliably performed using the Hot-Beam-05 underheater.
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Tuesday, 30 June 2009 |
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This allows Napatech adapters to be inserted or removed from a network connection without disrupting network connectivity or requiring the network appliance to be shut down. |
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Tuesday, 30 June 2009 |
 The MX-BGAZ II allows inspection of the BGA ball’s upper and lower joints by changing the observation angle through the optical rotary ring. |
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Monday, 29 June 2009 |
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The 3M family of 0.8 mm cable assemblies provides a broad range of interface solutions for Camera Link applications. |
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Monday, 29 June 2009 |
 The device is pin compatible with conventional SMD oscillators making its use a simple drop-in replacement. |
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Monday, 29 June 2009 |
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 New CVP-360 will deliver high productivity and lowest cost of ownership with excellent in-circuit test yields.
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Monday, 29 June 2009 |
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The MPC®-cleaning agent provides excellent cleaning performance in capillary spaces. |
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Friday, 26 June 2009 |
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Extensive searchable directory provides essential frequency control product design service to website |
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Friday, 26 June 2009 |
 Verigy’s Yield Learning Solution Helps Semiconductor Manufacturers Accelerate Time-to-Market and Maximize Entitlement Yield |
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Friday, 26 June 2009 |
 Proven over many years, Fryolux’s popularity lies in the facts that it is both convenient and economical to use. |
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Friday, 26 June 2009 |
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 Direct Contact Stencil Cleaning System
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Friday, 26 June 2009 |
 New Products expand the availability of unique holders for SMT users |
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Friday, 26 June 2009 |
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BPWin 5.0 features Software Version Control with the “BPWinLauncher” feature. |
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Thursday, 25 June 2009 |
 Fast turn-around high-density lead frames for complicated or intricate applications |
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Thursday, 25 June 2009 |
 This valuable tool contains a number of charts intended to help R&D engineers and product designers choose the appropriate adhesive for their application. |
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Thursday, 25 June 2009 |
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SMIC and Synopsys announce the availability of reference flow 4.0 Flow addresses critical low power challenges of 65nm designs with Synopsys’ Eclypse Low Power Solution |
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Thursday, 25 June 2009 |
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 The VF Series Multi Channel Synthesizers provide phase adjustable output to avoid destructive arcing and cross-talk in multiple cathode plasma processing chambers.
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