Pac Tech GmbH announced the incorporation of Pac Tech Asia, a wholly owned subsidiary of Pac Tech GmbH, and the acquisition of a new 53,512 square foot facility located at 11900 Bayan Lepas, Byan Lepas Industrial Zone, Penang, Malaysia. The new facility will provide state-of-the-art wafer bumping and backend processing for semiconductor companies within the Pacific Rim. The building will have up to 40,000 square feet of remodeled production floor space, including cleanroom area. Both will be equipped with the latest generation equipment.

The new Malaysian facility is designed and laid-out to accommodate mass-production. In the initial phase of operation, it will be capable of handling up to 600,000 wafers per year. Pac Tech Asia will provide a variety of special applications designed to enhance and support the Asian semiconductor manufacturing community. The applications supported will include: electroless Ni/Au under-bump metallization for copper and aluminum devices, solder-paste stencil printing for flip-chips, solder-ball placement for wafer-level CSPs down to 200µm ball diameters, and micro solder-ball placement for fine-pitch applications down to 120µm. More advanced applications include: Ni/Pd/Au metalization for today's power MOSFET devices and gold wire bonding, tall Ni/Au bumping for Smart Card and Smart Label. The facility offers up to 300mm wafer processing capability.

The facility is scheduled to begin operation in June 2007, and is currently accepting process qualification orders. Semiconductor companies can begin to provide Pac Tech GmbH and Pac Tech USA with their wafer forecasts in order to begin allocation of time and schedule them into the production planning. High volume production will begin in October 2007. Pac Tech GmbH and Pac Tech USA can be contacted to begin the pre-qualification of processes to be used in the new Asian facility.

The initially processes flow capability will include: Low-cost wafer-bumping using electroless Ni/Au, solder stencil printing, solder-ball placement for wafer-level CSP, wafer thinning, backside metal sputtering, wafer backside laser marking, and wafer sawing. Beginning in 2008, the facility will also offer electrical testing and tape-and-reel processing.

“This new Asian facility is the next step in our worldwide support for the most cost-effective source of wafer bumping and backend processing in the world.” Comments Dr. Elke Zakel, President of Pac Tech GmbH. “This Malaysian facility is just the latest in our efforts to accomplish that goal.”

Dr. Thorsten Teutsch, President of Pac Tech USA and appointed CTO for Pac Tech Asia, comments, “The new facility in Malaysia provides the link in our global presence, and is very beneficial for our U.S. operation and will help Pac Tech USA to address new customers and to increase our domestic business as an entry portal for high-volume customers to our Asian manufacturing site.” www.pactech.de

Keywords : Pac Tech, Malaysia, Asia

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