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Issue 7.2 -  February 2007

- Editorial -

Manufacturing still strong in the west
Trevor Galbraith

- Technology Focus -

The validation of SAC305 and SnCu-based solders at the contract assembler level
Peter Biocca, Carlos Rivas

Process improvement with selective solder
John Weisheit, Tom Barnard

Evaluation of wafer bumping stencils
Scott F. Popelar, Robert A. Niemet

Integrating strategic alliances in product development and manufacturing
Larry Fleming

- Business Feature -

Does lean manufacturing really save money?
Todd Baggett

- Special Features -

Roger Savage interview - Kester

IPC Printed Circuit Expo/APEX/Designer’s Summit

- Regular Columns-

Getting through the memory bottleneck (North American edition)
Joe Fjelstad

Via hole mounting on surface pads or not? (European edition)
Bob Willis

2007 looking better than previously expected!
Jon and Walt Custer

Lead-free component removal (North American edition)
Bob Willis

Voids in solder joints - reliability (European edition)
Werner Engelmaier

iNEMI board assembly roadmap
Dr. Dongkai Shangguan

- Other Regular Features -
Industry News
New Products
Association News
International Diary

Keywords : SAC305, SnCu, Biocca, Rivas, process improvement, selective soldering, wafer bumping stencils, wafer bumping, product development, manufacturing, Fleming, Niemet, Popelar, Barnard, Weishert

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