My original column on this topic, “How to specify reliable PCBs for lead-free solder assembly”, appeared in the September 2006 [GSMT&P 6.08] issue. Reader feedback, as well lively discussions at the IPCWorks’06 conference, particularly in the committee responsible for IPC-4101[1-3] showed the need to amplify on the theme.

The PCBs most threatened by the increase in soldering temperature necessitated by the EU-RoHS-forced switch to lead-free solders are PCBs of more complex construction with many layers, thicknesses in excess of 1.5mm (60 mils), and plated-through or buried vias with aspect ratios of more than 6:1.

Download the complete column (free) in PDF format.

This column appeared in Global SMT & Packaging magazine issue 7.1 - January 2007.

Werner Engelmaier has over 41 years experience in electronic packaging and interconnection technology. Known as ‘Mr. Reliability’ in the industry, he is the president of Engelmaier Associates, L.C., a firm providing consulting services on reliability, manufacturing and processing aspects of electronic packaging and interconnection technology. He is the chairman of the IPC Main Committee on Product Reliability. He was elected into the IPC Hall of Fame 2003, and was awarded the IPC President’s Award in 1996 and the IEPS Electronic Packaging Achievement Award in 1987. He also was named a Bell Telephone Laboratories Distinguished Member of Technical Staff in 1986 and an IMAPS Fellow in 1996. More information is available at www.engelmaier.com, and he can be reached at engelmaier@aol.com.

Keywords : Werner Engelmaier, Engelmaier, lead-free, reliability

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