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6.4 - April 2006

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European Version PDF

North American Version PDF

Issue 6.4 / April 2006

- Editorial -

Where is the world taking us?
Trevor Galbraith

- Technology Focus -

Single ball reballing and repair of BGA components
Robert V. Avila

Maximizing the 'value-add' of the electronic materials partner
George A. Toskey

Fact and fiction of lead-free soldering
Keith Sweatman

Why solder spikes form
Yoshinobu Anbe


- Special Features -

George Szekeley Interview - TYCO Electronics

- Regular Columns -

Stencil board options and board wash-offs (European edition)
Bob Willis

The unaccounted cost of the lead-free mandate
Joe Fjelstad

Clear signs of normal seasonal slowdown
Jon and Walt Custer

Further study needed on backward compatability
Dongkai Shangguan


- Other regular features -

Industry news
Appointments
Association news
International diary