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Issue 7.3 -  March 2007

- Editorial -

The only way is up
Trevor Galbraith

- Technology Focus -

Characterization methods for mechanical stress caused by packaging processes
Soeren Hirsch, Soeren Majcherek, Bertram Schmidt

Nanodispensing in high-speed production processes
Dipl.-Ing. (FH) Rainer Möst

Conformal coating issues: When reliability goes astray
Dr. Helmut Schweigart

- Special Features -

Paul Walter interview – Dage Precision Industries
 

- Regular Columns-

Conventional and virtual lead-free assembly training course (European edition)
Bob Willis

ESD – Electronics products’ shocking menace  (North American edition)
Joe Fjelsad

2006 in hindsight; 2007 outlook
Jon and Walt Custer

The case against ENIG  (North American edition)
Werner Engelmaier

- Other Regular Features -
Industry News
New Products
Association News
International Diary

Keywords : mechanical stress, packaging, nanodispensing, high-speed production, conformal coating

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