| Posted by Global SMT & Packaging on 12 April 2007 at 14:59
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 Indium Corporation’s vice president of technology, Dr. Ning-Cheng Lee, will lecture on metallurgical fundamentals and optimal processes at the International Conference on Soldering and Reliability in Toronto, Ontario, Canada, on April 17-19, 2007. Dr. Lee will also teach a 6-hour short course on creating high reliability for Pb-Free solder joints at Nepcon Shanghai on April 24-27, 2007.
In both presentations Dr. Lee will emphasize implementing reliable Pb-free assembly processes by overcoming technical issues and challenges. He will focus on:
• Pb-free legislation status
• Pb-free alloys, surface finishes, components and substrates.
• Pb-free wave soldering, rework, and inspection
• Reliable solutions to common problems in Pb-free SMT assembly.
Dr. Lee, a world-renown soldering expert and SMTA Member of Distinction, has extensive experience in the development of solder alloys, solder fluxes, solder pastes, high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. www.indium.com |
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(0 vote)
The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 