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- Editorial -

Contract manufacturing isn’t working
Trevor Galbraith

- Technology Focus -

Global impact of the accelerating cost increase of metals
Bruce S. Moloznik, Mitch Holtzer, Stan Rothschild, Doug Dixon, Ross Berntson

Reliability of tacky fluxes in varying soldering applications
Brian Smith, Jennifer Allen, John Tuccy

Measuring true temperature in lead-free assembly
Yoshinobu Anbe, Phil Harrison

An economical alternative to boundary scan in memory devices
The IEEE P1581 Working Group

- Business Feature -

Managing distributed development & NPI across global supply chains
Jan Keijzer, Gerard Elema

- Special Features -

Bjorn Dahle interview - KIC

Company Focus: Glenbrook Technologies

- Regular Columns -

SMART Group launches “Lead-Free Process Defect Guide” at Nepcon Electronics
Bob Willis

Connector technologies get down (North American edition)
Joe Fjelstad

‘Perfect Storm’ zaps 1Q’07 global electronics sales
Jon and Walt Custer

Finite element analysis is a wonderful tool for complex situations, but…caveat!
Werner Engelmaier

Via hole mounting on surface pads or not? (North American edition)
Bob Willis

Early involvement in sourcing (European edition)
Carsten Barth

- Other Regular Features -
Industry News
New Products
Association News
International Diary

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