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7.6 - June 2007 PDF Print E-mail
 

Posted by Global SMT & Packaging on 08 June 2007 at 14:54

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- Editorial -

Europe is still popping!
Trevor Galbraith


- Technology Focus -

Advanced coating technologies for lead-free solders
Bill Boyd

iNEMI Updates Tin Whisker Recommendations
Joe Smetana

Is tin heading for a crisis?
Peter Kettle


- Special Features -

John Hartner Interview - DEK
SEMICON West preview
Nepcon UK report
Nepcon Shanghai report
Country Focus: Korea
Technology Focus: Juki OPASS


- Regular Columns -

Your questions answered at SMT Nuremberg 2007 (European edition)
Bob Willis

MIDs in our midst (North American edition)
Joe Fjelstad

Early 2007 review; outlook for next 18 months
Walt Custer and Jon Custer-Topai

Achieving solder joint reliability in a lead-free world, part 1!
Werner Engelmaier


- Other Regular Features -
Industry News
New Products
Association News
International Diary

   
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