| Posted by Jan Keijzer and Gerard Elema, Adeon Technologies BV on 11 June 2007 at 11:32
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 This paper discusses the requirement for an engineering collaboration application software platform for the electronics and mechatronics industries to provide technology that allows users to work in a secure, global network from one single GUI. A common, unified interface allows seamless communication within design teams and suppliers, manufacturers, and other partners. The system provides a unique solution for engineering collaboration and is revolutionizing the manner in which supply chains manage their data streams. Read the full article (PDF)...
This article was taken from Global SMT & Packaging Vol. 7 No. 5 - May 2007 |
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 