The 2007 recipient, Gayatri Cuddalorepatta, a graduate student in the field of mechanical engineering at the University of Maryland, has been selected by the SMTA Grant Committee for her project entitled "Cyclic Plasticity vs. Cyclic Creep Fatigue of SnAgCu (SAC) Solder: A Micromechanics Approach."

c Her project includes experimental studies as well as fundamental mechanics-based modeling to quantify the behavior of various candidate materials for Pb-free solders. Cuddalorepatta has a B.E. in Mechanical Engineering from Osmania University (India), and an M.S. in Mechanical Engineering from State University of New York, Binghamton.

In her professional pursuits, Cuddalorepatta hopes to work in the field of electronics packaging. She plans to join the academic world to catalyze studies in nano-scale material modeling and experimental techniques applied to diverse material systems in electronic packaging. She has particular interest in involving research teams from multiple disciplines to address issues faced in practical applications involving electronic packages and systems to develop more efficient and robust electronic packages.

Cuddalorepatta’s project was selected from many applications reviewed by the SMTA's Grant Committee. The award includes $5,000 (which goes directly to the student) and travel expenses to SMTA International in Orlando, Florida, during which Cuddalorepatta will be presented the award at the SMTA Annual Meeting by Hutchins Grant Committee chairperson Dr. Laura Turbini of Research in Motion.

This grant, co-sponsored by SMTA and Circuits Assembly Magazine, was established in memory of past SMTA president and industry colleague Charles Hutchins. For more information, or to make a donation, visit the Hutchins Grant section on smta.org or contact SMTA executive administrator JoAnn Stromberg at 952-920-7682 or joann@smta.org.

http://www.smta.org/hutchins/hutchins.cfm

Keywords : Industry News, North America, 2007 SMTA Hutchins Grant Award Recipient Announced

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