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Issue 6.5 / May 2006
- Editorial -China begins to mature?
Trevor Galbraith
- Technology Focus -
IC package qualification testing for lead-free soldering
Vern Solberg
Thermal process optimization provides reduced energy consumption
Piotr Kanica
High performance flip-chip packages with copper pillar bumping
Joachim Kloeser, Ernst Weissbach
- Special Features -
NEPCON Shanghai show report (North American edition)
Book reviews - Bob Willis reviews the latest industry publications
SMT/Hybrid/Packaging 2006 - Preview (European edition)
- Regular Columns -
LEADOUT – benchmarking of the soldering process (European edition)
Bob Willis
IC package innovations (North American edition)
Joe Fjelstad
A ‘stable’ 2006 – all things considered
Jon and Walt Custer
Surfacing lead-free issues in North America and Asia (European edition)
Alan Rae
Voids in solder joint reliability (North American edition)
Werner Engelmaier
- Other regular features -
Industry news
Appointments
Association news
International diary
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