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Issue 6.5 / May 2006

- Editorial -

- Technology Focus -

IC package qualification testing for lead-free soldering
Vern Solberg

Thermal process optimization provides reduced energy consumption
Piotr Kanica

High performance flip-chip packages with copper pillar bumping
Joachim Kloeser, Ernst Weissbach

- Special Features -

Book reviews - Bob Willis reviews the latest industry publications

SMT/Hybrid/Packaging 2006 - Preview (European edition)

- Regular Columns -

IC package innovations (North American edition)

Joe Fjelstad

A ‘stable’ 2006 – all things considered
Jon and Walt Custer

Surfacing lead-free issues in North America and Asia (European edition)
Alan Rae

Voids in solder joint reliability (North American edition)
Werner Engelmaier

- Other regular features -

Keywords : Trevor Galbraith, IC packaging, qualification testing, lead-free soldering, Solberg, thermal process opitimization, energy consumption, piotr kanica, flip-chip, copper pillar bumping, Kloeser, Weissbach, NEPCON Shanghai, SMT Nuremberg

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