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- Editorial -

2 – An industry dividing
Trevor Galbraith

- Technology Focus -

10 – Optical silicones for use in harsh operating environments
Bill Riegler, Stephen Bruner and Rob Thomaier

16  – Obtaining and controlling reflow oven cooling rates
Fred Dimock and Rob DiMatteo

28 – Roxton™, the next generation of SMT nozzles
Dr Hywel Jones

34 – Beating the chip counterfeiters
Keith Bryant

- Special Features -

26 – Jack Paster interview – RMD Instruments
42 – SEMICON West post-show report

- Regular Columns -
4 – Process defects can be a thing of the Past (European edition)
Bob Willis

4 – IC packaging and interconnection technologies’ 4th dimension challenge (North American edition)
Joe Fjelstad

18 – Soft landing in progress; seat belt sign still on
Walt Custer and Jon Custer-Topai

46 – Achieving solder joint reliability in a lead-free world, part 2
Werner Engelmaier

- Other Regular Features -
6 – Industry News
38 – New Products
43 – Association News
48 – International Diary

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